11/01/2016  Edwards and GlobalFoundries Singapore were recognized by Singapore’s National Environment Agency in the Best Practices category at the 2016 Energy Efficiency National Partnership (EENP) Awards.

11/01/2016  Investments in its facilities will enhance current System LSI production to meet the growing demands in the industry for advanced system-on-chip (SoC) products especially for mobile and other electronic devices.

11/01/2016  Industry posts highest-ever quarterly sales; market still behind 2015's year-to-date total.

10/31/2016  van der Pauw measurements with a parameter analyzer are examined followed by a look at Hall effects measurements.

10/31/2016  DSI announced today that ON Semiconductor has selected DSI’s Digital Supply Chain Platform (DSCP) to increase stock accuracy and improve worker productivity in its inventory processes across the global supply chain.

10/30/2016  Fluoropolymer Electrostatic Discharge (ESD) tubing reduces electrostatic charge to levels below the ignition energy of flammable semiconductor chemicals and maintains chemical purity, ensuring safety and improving process yields.

10/28/2016  Solid particles in the abatement exhaust must be properly managed, and in some cases, substantially reduced from the gas stream before it is released into the environment.

10/27/2016  Picosun Oy, a supplier of advanced industrial ALD (Atomic Layer Deposition) technology, now provides its customers production-scale aluminum nitride batch process with superior film thickness uniformity and fast speed.

10/27/2016  He will be presented with this achievement award during the GSA Awards Dinner Celebration on Thursday, December 8, 2016, at the Santa Clara Convention Center in Santa Clara, Calif.

10/27/2016  Qualcomm Incorporated and NXP Semiconductors N.V. today announced a definitive agreement, unanimously approved by the boards of directors of both companies, under which Qualcomm will acquire NXP.

10/25/2016  Reference flow enables system and semiconductor companies to accelerate delivery of designs on Samsung's second-generation 10nm process (10LPP).

10/24/2016  SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing.

10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

10/21/2016  Stanford, Oxford team creates high-efficiency tandem cells.

10/21/2016  Researchers have found an unexpected way to control the thermal conductivity of two-dimensional (2-D) materials, which will allow electronics designers to dissipate heat in electronic devices that use these materials.

10/21/2016  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

10/20/2016  Avalanche Technology, Inc., has entered into a manufacturing agreement with Sony Semiconductor Manufacturing Corporation to begin production of it's Spin Transfer Torque Magnetic RAM (STT-MRAM) on 300mm wafers at various advanced geometry nodes.

10/20/2016  The U.S. Air Force Research Laboratory and the Office of the Secretary of Defense have awarded Raytheon Company [NYSE: RTN] a $14.9M contract to further enhance its process for producing gallium nitride-based semiconductors.

10/20/2016  In a paradigm shift from conventional electronic devices, exploiting the quantum properties of superlattices holds the promise of developing new technologies.