Wafer Processing

WAFER PROCESSING ARTICLES



MagnaChip announces cost competitive 0.13 micron Slim Flash process technology

10/03/2016  MagnaChip Semiconductor Corporation announced today the availability of a new 0.13 micron Slim Flash process technology, based on 0.13 micron EEPROM.

Brewer Science receives Made in Missouri Leadership Award for Sustainability Leadership

09/30/2016  The award honors innovative Missouri manufacturers and leaders that are shaping the future of global manufacturing.

Top 5 takeaways from SEMI Strategic Materials Conference

09/29/2016  As the rate of traditional scaling slows, the chip sector looks increasingly to materials and design to move forward on multiple paths for multiple applications. Figuring out more effective ways to collaborate across silos will be crucial.

Leading-edge leads the way in pure-play foundry growth

09/28/2016  Sales of ICs built using <40nm process technology forecast to rise 23% at pure-play foundries.

North American semiconductor equipment industry posts August 2016 book-to-bill ratio of 1.03

09/27/2016  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

Process Watch: Salami slicing your yield

09/26/2016  The Process Watch series explores key concepts about process control -- defect inspection and metrology -- for the semiconductor industry. This new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing.

Shanhai Capital to acquire Analogix Semiconductor

09/23/2016  Analogix Semiconductor, Inc. and Beijing Shanhai Capital Management Co, Ltd. today jointly announced that they have entered into a definitive merger agreement under which a consortium led by Shanhai Capital will acquire all of the outstanding shares of Analogix for over $500 million.

SRC honors professors from University of Chicago and University of Michigan

09/22/2016  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from the University of Chicago and the University of Michigan in recognition of their outstanding contributions to semiconductor research.

Etch abatement needed to meet WSC goals

09/21/2016  The World Semiconductor Council (WSC) is comprised of the semiconductor industry associations (SIAs) of the United States, Korea, Japan, Europe, China and Chinese Taipei. Its goal is to promote international cooperation in the semiconductor sector in order to facilitate the healthy growth of the industry from a long-term, global perspective.

2016 a sequel to last year’s M&A mania

09/21/2016  Value of semiconductor industry M&A agreements already over $50 billion this year.

CMP slurry optimization for advanced nodes

09/21/2016  As advanced device manufacturers identify needs for new and additional CMP steps, new slurry solutions can deliver exceptional planarization and defectivity within a stable CMP process.

Solid State Technology announces expanded conference for The ConFab 2017

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

NuMat Technologies and Linde form global partnership

09/20/2016  NuMat Technologies and The Linde Group have announced a collaborative partnership focused on the development of next generation separation and storage technologies that critically depend on material performance.

Intel appoints Bob Swan Executive Vice President and Chief Financial Officer

09/20/2016  Intel Corporation today announced the appointment of Robert H. Swan as executive vice president and chief financial officer (CFO), effective Oct. 10, 2016.

?200mm semiconductor manufacturing is here to stay

09/20/2016  Ted Shafer of ASML reports on the highlights from the ?200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

Synopsys and TSMC collaborate on development of interface and foundation IP for 7nm FinFET process

09/19/2016  Synopsys, Inc. today announced the successful tapeout of multiple customer test chips with DesignWare Logic Libraries and Embedded Memories for TSMC's 7nm FinFET process.

Moore's Law did indeed stop at 28nm

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

Cascade Microtech introduces wafer-level electromigration test system

09/15/2016  Cascade Microtech today announced the launch of the Estrada-EM system.

Global semiconductor sales rebound in July

09/14/2016  The Semiconductor Industry Association announced worldwide sales of semiconductors reached $27.1 billion for the month of July 2016.

The future of Europe pitch their startups at SEMICON Europa's Innovation Village

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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