Wafer Processing

WAFER PROCESSING ARTICLES



UC Berkeley, University of Minnesota professors recognized at annual SRC TECHCON Conference

09/13/2016  Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, presented its highest honors Sept. 12 to professors from University of California, Berkeley and University of Minnesota at SRC's annual TECHCON conference in Austin, Texas.

Silicon nanoparticles instead of expensive semiconductors

09/12/2016  Within an international collaboration, physicists of the Moscow State University replace expensive semiconductors with affordable silicon nanoparticles for display production.

Qualcomm Communication Technologies opens in Shanghai for semiconductor test manufacturing

09/12/2016  Qualcomm Incorporated (NASDAQ: QCOM) today announced the opening of Qualcomm Communication Technologies (Shanghai) Co. Ltd., a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first foray into providing manufacturing services for semiconductors.

Liquid to liquid ambient cooling systems for semiconductor tools

09/09/2016  An overview of liquid-to-liquid cooling systems and their operating principles.

M+W Group presents an integrated waste program for semiconductor facilities

09/08/2016  The global high-tech engineering and construction company M+W Group has presented current and future trends, as well as state of the art solutions, for an integrated approach to waste reduction in order to improve the sustainability of semiconductor fabs

Lam Research introduces dielectric atomic layer etching capability for advanced logic

09/07/2016  Lam Research Corp., an advanced manufacturer of semiconductor equipment, today announced that it is expanding its atomic layer etching (ALE) portfolio with the addition of ALE capability on its Flex dielectric etch systems.

SPTS Technologies collaborates with Novati Technologies to establish new plasma dicing line

09/07/2016  SPTS Technologies today announced its collaboration with Novati Technologies to establish Novati’s new plasma dicing line at their fab in Austin, Texas.

SEMI recognizes UMC CEO Po Wen Yen for sustainable semiconductor manufacturing leadership

09/07/2016  SEMI today presented its industry leadership award for sustainable manufacturing to Po Wen Yen, CEO of United Microelectronics Corporation (UMC).

SEMICON Taiwan 2016 opens tomorrow; 43,000 attendees expected

09/06/2016  Upbeat about the growth prospects of Taiwan's semiconductor sector, SEMICON Taiwan 2016 features 600 exhibitors covering over 1,600 booths,and is expected to attract more than 43,000 visitors in three days.

ZEISS launches a new high performance wafer and mask tuning system

09/06/2016  ZEISS introduces the new ZEISS ForTune system for photomask tuning. With its latest optical design, it takes two main mask tuning processes to the next level in terms of efficiency, accuracy and throughput. The first tool has already been delivered to the first customer.

Thinner wafers are fostering the growth and emergence of new dicing technologies

09/06/2016  Driven by rising demand for thinner wafers and stronger die, dicing technology is evolving.

Cabot Microelectronics appoints Thomas F. Kelly as VP of Corporate Development

09/02/2016  Cabot Microelectronics Corporation announced the appointment of Thomas F. Kelly, Vice President, Corporate Development, which is effective as of September 6, 2016.

Semiconductor industry icons to gather at SIA Award Dinner Nov. 10 in San Jose

09/02/2016  The Semiconductor Industry Association today announced more than a dozen semiconductor industry icons, leaders, and founders will come together at the annual SIA Award Dinner on Thursday, Nov. 10 in San Jose to celebrate the 25th anniversary of the Robert N. Noyce Award, the industry's highest honor.

Enabling industry collaboration to address critical ATE challenges

09/01/2016  For many years, the ATE industry has been challenged with controlling the cost of both production and development test by implementing innovative approaches and employing clever strategies (e.g., multi-site test implementation, DFT, etc.) to make “ends” meet, so to speak.

ASMC 2017 "Call for Papers" deadline is October 17

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

NXP Semiconductors joins Semiconductor Research Corporation

08/31/2016  Semiconductor Research Corporation (SRC), the university-research consortium for semiconductors and related technologies, today announced that NXP Semiconductors has signed an agreement to participate in multiple SRC research initiatives.

Industry veteran Lung Chu named president of SEMI China

08/30/2016  SEMI today announced the appointment of Lung Chu as president of SEMI China effective September 1, 2016.

TowerJazz and SMIC’s sales forecast to surge in 2016

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

Peregrine Semiconductor and Aemulus collaborate to advance high frequency testing

08/23/2016  Aemulus, a developer of automated test equipment (ATE) solutions, and Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator), announce their strategic partnership in the development of a new microwave frequency tester.

China's semiconductor industry worth $157.66B by 2020

08/22/2016  The China semiconductor industry is expected to reach $157.66 billion by 2020, at a CAGR of 12.8% between 2016 and 2020.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts