Wafer Processing

WAFER PROCESSING ARTICLES



Lori Knowlton joins Silicon Labs as Chief People Officer

08/22/2016  Silicon Labs (NASDAQ: SLAB), a provider of silicon, software and solutions for a smarter, more connected world, today named Lori Knowlton as Senior Vice President and Chief People Officer (CPO).

Intel to produce 10nm ARM chip designs

08/19/2016  ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

GlobalWafers to acquire SunEdison Semiconductor

08/18/2016  GlobalWafers Co., Ltd. and SunEdison Semiconductor Limited (NASDAQ:SEMI) announced today that they have entered into a definitive agreement for the acquisition by GlobalWafers of all of the outstanding ordinary shares of SunEdison Semiconductor in a transaction valued at US$683 million, including SunEdison Semiconductor outstanding net indebtedness.

Global silicon photonics market to grow at a CAGR of over 48% through 2020

08/18/2016  Technavio analysts forecast the global silicon photonics market to grow at an impressive CAGR of over 48% during the forecast period, according to their latest report.

Advancements in RH measurement in wafer and reticle environments

08/18/2016  These RH control requirements create a need for a wireless wafer-like humidity sensor which simultaneously measures RH at several points across the wafer as well as throughout the entire IC manufacturing environment.

Hexagonal boron nitride semiconductors enable cost-effective detection of neutron signals

08/16/2016  Texas Tech University researchers demonstrate hexagonal boron nitride semiconductors as a cost-effective alternative for inspecting overseas cargo containers entering US ports.

Time to uncover the process mystery for IC designs

08/15/2016  Semiconductor processes have long been a mystery for many circuit designers. They didn’t need to worry about how chips were fabricated most of the time, thanks to the many EDA innovations that make their jobs easier and complex designs possible.

Seven Top-20 semiconductor suppliers show double-digit gains in 2Q16

08/15/2016  MediaTek and AMD register the fastest 2Q16/1Q16 growth rates of 32% and 23%, respectively.

Evolution of across-wafer uniformity control in plasma etch

08/12/2016  A look at control of process uniformity across the wafer during plasma etch processes.

As Japan seizes lead in growing semiconductor segments, industry leaders exhibit at SEMICON Japan

08/11/2016  SEMI today announced that SEMICON Japan 2016, at Tokyo Big Sight on December 14-16, has increased exhibition and programming to keep pace with high-growth semiconductor segments in Japan.

Power semiconductor market revenues decline

08/11/2016  Overall revenue for the power semiconductors market globally dropped slightly in 2015, due primarily to macroeconomic factors and application-specific issues.

POET Technologies announces milestone toward commercialization integrated opto-electronics tech platform

08/10/2016  The milestone achieved is the first demonstration of functional Hetero-junction Field Effect Transistors (HFETs) down to 250nm effective gate lengths on the same proprietary epitaxy and utilizing the same integrated process sequence that was previously used to demonstrate high performance detectors.

Expanded focus areas and opportunities to exhibit at SEMICON Europa

08/10/2016  Europe's largest electronics manufacturing exhibition SEMICON Europa (25-27 October) will take place in Grenoble at ALPEXPO.

Lam Research enables next-generation memory with industry's first ALD process for low-fluorine tungsten fill

08/09/2016  Lam Research Corp. (NASDAQ: LRCX), an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition (ALD) process for depositing low-fluorine-content tungsten films, the latest addition to its ALTUS family of products.

Making a solar energy conversion breakthrough with help from a ferroelectrics pioneer

08/08/2016  Philadelphia-based team shows how a ferroelectric insulator can surpass shockley-queisser limit.

Park Systems launches Park NX20 300mm research AFM with full 300mm semiconductor wafer scan

08/05/2016  Park Systems announced NX20 300mm, the only AFM on the market capable of scanning the entire sample area of 300mm wafers using a 300mm vacuum chuck while keeping the system noise level below 0.5angstrom RMS.

Samco opens new office in Malaysia

08/04/2016  Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.

Huge 2H16 spending surge expected from Samsung, TSMC, and Intel

08/04/2016  Combined outlays from the “Big 3” spenders is forecast to almost double in 2H16 over 1H16.

GLOBALFOUNDRIES appoints Wallace Pai as General Manager to oversee China business development

08/02/2016  GLOBALFOUNDRIES announced that Wallace Pai has been appointed as vice president and general manager of China.

Global semiconductor sales increase in second quarter

08/02/2016  The Semiconductor Industry Association today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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