Wafer Processing

WAFER PROCESSING ARTICLES



Quarterly year-over-year growth slows substantially for IC market

11/02/2018  Analysis shows decline from 23% year-over-year growth in 1Q18 to 6% forecast for 4Q18.

Rudolph Technologies releases NovusEdge System for edge, notch and backside inspection of unpatterned wafers

11/01/2018  New system combines high sensitivity, repeatability and throughput to deliver the industry's best performance and cost-of-ownership for inspection of critical wafer zones.

GLOBALFOUNDRIES introduces Avera Semi, a wholly owned subsidiary to deliver custom ASIC solutions

11/01/2018  GLOBALFOUNDRIES today announced the establishment of Avera Semiconductor LLC, a wholly owned subsidiary dedicated to providing custom silicon solutions for a broad range of applications.

GSA announces new leadership and multiple market initiatives

10/31/2018  The Global Semiconductor Alliance (GSA) Board of Directors has appointed Dr. Lisa Su, President and Chief Executive Officer of Advanced Micro Devices, Inc. (AMD), as Chair of GSA Board of Directors and Simon Segars, Chief Executive Officer of Arm, as the Vice Chair.

A solar cell that does double duty for renewable energy

10/30/2018  Researchers develop an artificial photosynthesis system that generates hydrogen fuel and electricity at the same time.

Global semiconductor sales in September up 13.8% year-to-year

10/29/2018  Q3 sales are highest on record, 4.1 percent more than previous quarter, 13.8 percent higher than Q3 of last year.

Synopsys advances Test Fusion technology with test points to reduce manufacturing costs and boost quality

10/29/2018  Accelerates achieving test goals while meeting power, performance, and area targets.

SEMI Europe supports joint call to candidates for 2019 European elections

10/29/2018  SEMI Europe today confirmed its support for the joint call to future Members of the European Parliament to put industry at the core of the European Union's future.

Highly efficient wet-processed solar cells with molecules in the same orientation

10/26/2018  Researchers at Kanazawa University report in the journal Organic Electronics documents a new method for controlling the orientation of conducting molecules in organic solar cells that results in the enhanced light adsorption and performance of the cells.

KLA-Tencor announces plans to establish R&D facility in Ann Arbor, Michigan

10/25/2018  KLA-Tencor Corporation has announced plans to establish a research-and-development (R&D) center in Ann Arbor, Michigan.

The ASOPS system as a multiphysics measurement device for research and industry

10/25/2018  Insights into the rise of ASynchronous OPtical Sampling technology as one of the future measurement standard and how it can be used in the industry.

Cadence custom/AMS flow certified on Samsung 7LPP process technology

10/24/2018  Cadence Design Systems, Inc. today announced that its custom and analog/mixed-signal (AMS) IC design tools have achieved certification for Samsung Foundry’s 7nm Low Power Plus (7LPP) process technology.

Ferdinand-Braun-Institute selects Solstice S8 for automated plating and solvent processes

10/24/2018  ClassOne Technology, a supplier of new wet process tools to the 200mm and below semiconductor manufacturing industry, today announced the sale of its flagship Solstice S8 wet process tool to the Ferdinand-Braun-Institute (FBH) in Berlin, Germany.

North American semiconductor equipment industry posts September 2018 billings

10/24/2018  North America-based manufacturers of semiconductor equipment posted $2.09 billion in billings worldwide in September 2018 (three-month average basis), according to the September Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI.

U.S. announces trade talks with Japan, the EU, and UK; Action will benefit semiconductor industry

10/22/2018  Last week, the Office of the U.S. Trade Representative (USTR), on instruction from President Trump, notified Congress that the administration intends to begin bilateral trade negotiations with Japan, the European Union (EU), and the United Kingdom.

Samsung debuts semiconductor innovations at Samsung Tech Day

10/19/2018  Technologies introduced at the event include 7nm LPP EUV, SmartSSD and 256GB 3DS RDIMM.

Communications rise to represent largest portion of foundry sales

10/17/2018  Communications apps expected to account for 3x more than computer in 2018 pure-play foundry sales.

SEMI reaffirms support for industry cooperation on RoHS review

10/16/2018  SEMI today confirmed its support for a Joint-Industry Cooperation on an RoHS Review aimed at urging the European Commission to, at a minimum, consider dedicating more resources to a targeted outreach programme with third countries.

Wafer shipments forecast to set new highs through 2021

10/16/2018  Total wafer shipments in 2018 year are expected to eclipse the all-time market high set in 2017 and continue to reach record levels through 2021.

Dynamic Fault Detection: Utilizing AI and IoT to revolutionize manufacturing

10/15/2018  A new approach in Fault Detection and Classification (FDC) allows engineers to uncover issues more thoroughly and accurately by taking advantage of full sensor traces.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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