03/11/2016  Nanoelectronics research center imec has today announced the opening of its new 300mm cleanroom.

03/10/2016  GLOBALFOUNDRIES today announced the availability of a new set of process design kits (PDKs) with an interoperable co-design flow to help chip designers improve design efficiency and deliver differentiated RF front-end solutions in increasingly sophisticated mobile devices.

03/09/2016  A new study by University of Illinois engineers found that in the transistor laser, a device for next-generation high-speed computing, the light and electrons spur one another on to faster switching speeds than any devices available.

03/08/2016  Paul Lindner, executive technology director at EV Group, is the recipient of the 2015 European SEMI Award.

03/04/2016  Mutricy succeeds Mike Cadigan, who will transition to a newly created role as senior vice president of global sales and business development.

03/03/2016  Toppan Printing Co., Ltd. announced it has developed a next-generation EUV photomask for semiconductors.

03/02/2016  Researchers demonstrate a proof-of-concept device that could take advantage of spin of electrons to potentially create more energy efficient electronic devices.

03/01/2016  IC Insights recently released its new Global Wafer Capacity 2016-2020 report that provides in-depth detail, analyses, and forecasts for IC industry capacity by wafer size, by process geometry, by region, and by product type through 2020.

02/26/2016  Mentor Graphics Corp. ushered in a new era of emulation by announcing new applications for the Veloce emulation platform.

02/26/2016  The Semiconductor Industry Association (SIA) applauded congressional approval of legislation that includes a key provision to combat counterfeit semiconductors.

02/23/2016  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, New York.

02/23/2016  Recent capital spending trends indicative of maturing semiconductor industry.

02/22/2016  Semiconductor Manufacturing International Corporation and Leadcore Technology Co. have announced a collaboration to launch SMIC's 28nm High-K Metal Gate, or HKMG, process.

02/19/2016  Soitec (Euronext), a manufacturer of semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-SOI) applications, has begun mass production of 300mm RF-SOI substrates for mobile communications.

02/18/2016  Semiconductor lithographic use of Neon is increasing more rapidly than expected for several reasons including the delay of EUVL while demand for finer line width patterning is increasing.

02/18/2016  Fairchild Semiconductor's board of directors has determined that the unsolicited proposal received from China Resources Microelectronics Ltd and Hua Capital Management Co., Ltd. does not constitute a “Superior Proposal” as defined in the company’s agreement with ON Semiconductor.

02/17/2016  Slow-growth regional GDPs weigh heavy on potential global IC growth.

02/16/2016  Cadence Design Systems, Inc. today announced that the Cadence Innovus Implementation System has been qualified for Samsung Foundry's latest 10-nanometer (10nm) process.

02/12/2016  At next week’s SPIE Photonics West 2016, imec will demonstrate a lens-free microscope for large field-of-view live imaging at micrometer resolution.

02/12/2016  Mentor Graphics Corp. has announced that it is collaborating with GLOBALFOUNDRIES to qualify the Mentor RTL to GDS platform for the current version of the GLOBALFOUNDRIES 22FDX platform reference flow.