Wafer Processing

WAFER PROCESSING ARTICLES



Improved ion implant exhaust management reduces energy, capital costs

02/09/2016  How Texas Instruments got greener, safer and saved money.

SUNY Poly, GLOBAL FOUNDRIES announce new $500M R&D program

02/09/2016  SUNY Polytechnic Institute (SUNY Poly) and GLOBALFOUNDRIES today announced the establishment of a new Advanced Patterning and Productivity Center (APPC), which will be located at the Colleges of Nanoscale Science and Engineering (CNSE) in Albany, N.Y.

Helium reduction at pre-metal sub-atmospheric CVD

02/08/2016  A novel SACVD PMD invention sets the benchmark for helium reduction efforts by achieving four key objectives: cost reduction, quality, process robustness and productivity.

Yield and cost challenges at 16nm and beyond

02/08/2016  A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.

TSMC assessing February 6 earthquakes and planning recovery

02/08/2016  TSMC this weekend announced that the earthquake of 6.4 magnitude which struck southern Taiwan at 3:57 am on February 6, 2016 did not cause any serious personnel injuries nor any structural or facility damage to the Company’s Fab 14 and Fab 6 manufacturing sites in the Tainan Science Park.

TSMC approved to build 12-in wafer fab in China

02/05/2016  Taiwan's Investment Commission on Wednesday gave Taiwan Semiconductor Manufacturing Co. (TSMC) approval to build its first 12-inch wafer fab in mainland China.

Cautious expectations amid a slow-growth global economy

02/04/2016  The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at least a “good” worldwide economy to support it.

Microchip Technology appoints Ganesh Moorthy to President and COO

02/04/2016  Microchip Technology Incorporated, a provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that its Board of Directors has appointed Ganesh Moorthy as President and Chief Operating Officer effective today.

Presto Engineering expands turnkey IC production management services with three new operations in Asia

02/02/2016  Presto Engineering Inc. announced this week that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.

TowerJazz completes acquisition of Maxim's San Antonio fabrication facility

02/02/2016  TowerJazz, the global specialty foundry leader, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc.

ISS Europe 2016: Reaching into a new era

02/01/2016  At the SEMI Industry Strategy Symposium Europe (SEMI ISS Europe) on 6-8 March, industry experts will delve into the disruptions and opportunities impacting the electronics manufacturing supply chain.

Entegris expands R&D operations for semiconductor process liquid filtration in South Korea

01/27/2016  Entegris, Inc. announced today the expansion of its liquid filtration/purification analytical science and research and development facility in Suwon, South Korea.

Thin wafer market worth $9.17B by 2022

01/27/2016  According to a new marketsandmarkets report, the market was valued $6.76 Billion in 2015 and estimated to reach $9.17 Billion by 2022, at a CAGR of 3.7% between 2016 and 2022.

Semiconductor veteran Tom Werthan to lead finance operations as Chief Financial Officer of Phononic

01/20/2016  Tom Werthan, a veteran semiconductor and finance executive experienced in leading financial operations at public and privately-held technology companies, has been appointed Chief Financial Officer at Phononic.

Annihilating nanoscale defects

01/14/2016  Researchers at the University of Chicago and the U.S. Department of Energy's Argonne National Laboratory, led by Juan de Pablo and Paul Nealey, may have found a way for the semiconductor industry to hit miniaturization targets on time and without defects.

SEMI Awards honor process and technology integration achievements

01/14/2016  SEMI announced the recipients of the 2015 SEMI Awards for the Americas.

Ferrotec receives multi-system endorsement of e-beam evaporator systems from WIN Semiconductors

01/12/2016  Ferrotec Corporation this week announced that the largest pure-play GaAs foundry company, WIN Semiconductors Corp., has selected Temescal systems from Ferrotec Corporation for its next stage of expansion by ordering multiple e-beam evaporators for metal deposition

Semiconductor capital spending to decline 4.7% in 2016, according to Gartner

01/12/2016  Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc.

Semiconductor capital spending market in the US to reach over $31B by 2019

01/11/2016  Technavio's market research analysts estimate the semiconductor capital spending market in the US, to grow at a CAGR of around 9% between 2015 and 2019.

Worldwide semiconductor revenue declined 1.9% in 2015, Gartner reports

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

More Webcasts