01/07/2016  GlobalFoundries, TSMC, SK Hynix show greatest gains in wafer capacity in 2015.

01/07/2016  “In like a lion, out like a lamb” is just half the story for 2015. While initial expectations forecasted a double-digit growth year, the world economy faded and dragged our industry down to nearly flat 2015/2014 results.

01/06/2016  EUV lithography is on the threshold of becoming a mainstream patterning technology for sub-10nm chips, featured speaker Anthony Yen of Taiwan Semiconductor Manufacturing Co. (TSMC) will tell fellow attendees at SPIE Advanced Lithography 2016.

01/06/2016  The surprising trenching capability, reported by scientists from the National Institute of Standards and Technology (NIST) and IBM, is an important addition to the toolkit of nature-supplied 'self-assembly' methods that researchers aim to harness for making useful devices.

01/04/2016  NUS scientists have discovered how to manipulate electrons in thin semiconductors by encapsulating them in atomically thin materials and changing the electric field.

01/04/2016  Micron Technology, Inc. today announced that President Mark Adams will resign for personal health reasons.

12/18/2015  SEMI has been working to make the popular tax incentive a permanent part of the tax code since the R&D credit was first established in 1981.

12/18/2015  North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2015 (three-month average basis) and a book-to-bill ratio of 0.96.

12/15/2015  Applied Materials, Inc. today announced that Dr. Chorng-Ping Chang, who leads the company's strategic external research with universities and industry consortia, has been named a 2016 IEEE Fellow.

12/14/2015  At last week’s IEEE International Electron Devices Meeting 2015, nano-electronics research center imec presented three novel aluminum gallium nitride (AlGaN)/ gallium nitride (GaN) stacks featuring optimized low dispersion buffer designs.

12/14/2015  After deflated 2015, 3D leads the way.

12/14/2015  The agreement for Kozarska-Dubica-based production of mono and policrystalline silicon ingots and wafers for photovoltaic cells was signed a few days ago by MegaGroup, a Italian photovoltaic Holding currently owning MegaCell, MegaEngineering and MegaCivic and soon a new Company fully dedicated to the Bosnian project.

12/11/2015  TSMC this week submitted an application to the Investment Commission of Taiwan's Ministry of Economic Affairs for an investment project to build a wholly-owned 12-inch wafer manufacturing facility and a design service center in Nanjing, China.

12/11/2015  SEMI this week reported that worldwide semiconductor manufacturing equipment billings reached US$9.6 billion in the third quarter of 2015.

12/10/2015  At this week’s IEEE IEDM conference, nano-electronics research center imec demonstrates record enhancement of novel InGaAs Gate-All-Around (GAA) channel devices integrated on 300mm Silicon and explores emerging tunnel devices based on optimization of the same III-V compound semiconductor.

12/09/2015  Due to the further scaling and increasing complexity of transistors, the boundaries between back-end-of-line and front-end-of-line reliability research are gradually fading. Imec’s team leaders Kristof Croes and Dimitri Linten give their vision on the future of reliability research.

12/08/2015  It is possible to fabricate copper pillars more than 100?m in height, with aspect ratios up to 6:1, using advanced packaging stepper lithography in conjunction with electroplating.

12/08/2015  CEA-Leti today announced it has developed two techniques to induce local strain in FD-SOI processes for next-generation FD-SOI circuits that will produce more speed at the same, or lower, power consumption, and improve performance.

12/07/2015  CEA-Leti today announced preliminary steps for demonstrating a quantum bit, or qubit, the building block of quantum information, in a process utilizing a silicon-on-insulator (SOI) CMOS platform.

12/07/2015  CEA-Leti today announced it has signed an agreement with Keysight Technologies, a device-modeling software supplier, to adapt Leti’s UTSOI extraction flow methodology within Keysight’s device modeling solutions for high-volume SPICE model generation.