11/18/2015  The acquisition creates a leader in the power semiconductor market with combined revenue of approximately $5 billion, diversified across multiple markets with a strategic focus on automotive, industrial and smartphone end markets.

11/18/2015  CEA-Leti and its partners in the European FP7 project PLAT4M today announced they have built three silicon photonics platforms.

11/18/2015  A team from Jülich and Aachen has now found a way to control the desired conducting properties of this type of material more precisely and reliably than ever before.

11/18/2015  TowerJazz announced today it has signed an agreement with Maxim Integrated Products, Inc. to purchase Maxim's 8-inch fabrication facility in San Antonio, Texas, United States.

11/17/2015  Due to their exciting properties, 2D crystals like graphene and transition metal dichalcogenides promise to become the material of the future.

11/13/2015  Worldwide silicon wafer area shipments decreased during the third quarter 2015 when compared to second quarter area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

11/13/2015  The advent of Internet-connected devices, the so-called Internet of Things (IoT), offers myriad opportunities and significant risks. It is our collective responsibility, as an industry, to secure the transport and storage of the data. Failing to properly secure the data risks turning the digital threat into a physical threat.

11/12/2015  Method analyzes non-uniform conductors with a magnetic field.

11/11/2015  Ultratech, Inc. today introduced the Superfast 4G+ in-line, 3D topography inspection system.

11/11/2015  The world electronics market will consume over 121 billion analog ICs in 2015 and grow to over $56 billion by 2020.

11/06/2015  GLOBALFOUNDRIES today announced it has demonstrated silicon success on the first AMD products using its most advanced 14nm FinFET process technology.

11/03/2015  FEI Company and DCG Systems, Inc. announced an agreement where FEI willacquire DCG for $160 million in an all cash transaction.

11/03/2015  FEI announced the Helios G4 DualBeam series, which offers the highest throughput ultra-thin TEM lamella preparation for leading-edge semiconductor manufacturing and failure analysis applications.

11/03/2015  SIA announced worldwide sales of semiconductors reached $85.2 billion during the third quarter of 2015, an increase of 1.5 percent compared to the previous quarter.

11/03/2015  DCG Systems announced the release of EBIRCH, a technology for localizing shorts and other low-resistance faults that may reside in the interconnect structures or the polysilicon base layer of integrated circuits.

11/03/2015  Tsinghua Unigroup Ltd., a Chinese government-owned chipmaker will make a $600 million investment in Powertech Technology of Taiwan, according to multiple reports.

11/02/2015  X-FAB Silicon Foundries announced it will expand the capacity and capabilities of its Kuching-based foundry operation, X-FAB Sarawak Sdn. Bhd., to meet accelerating demand for its core technologies.

10/30/2015  Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

10/30/2015  Texas Instruments (Maxim Integrated) and STMicro (Fairchild) may be considering large acquisitions.

10/29/2015  Toshiba Corp. will retreat from the CMOS image sensor business, by selling the production line at its Oita plant to Sony Corp.