Wafer Processing

WAFER PROCESSING ARTICLES



ETEL launches research center with focus on semiconductor industry

10/28/2015  ETEL S.A. announces the opening of a new research and development division.

Manipulating wrinkles could lead to graphene semiconductors

10/26/2015  RIKEN scientists have discovered that wrinkles in graphene can restrict the motion of electrons to one dimension, forming a junction-like structure that changes from zero-gap conductor to semiconductor back to zero-gap conductor.

Light goes infinitely fast with new on-chip material

10/23/2015  Researchers at the Harvard John A. Paulson School of Engineering and Applied Sciences (SEAS) have designed the first on-chip metamaterial with a refractive index of zero.

Berkeley Lab researchers demonstrate atomically thin excitonic laser

10/23/2015  An important step towards next-generation ultra-compact photonic and optoelectronic devices has been taken with the realization of a two-dimensional excitonic laser.

North American semiconductor equipment industry posts September 2015 book-to-bill ratio of 1.07

10/23/2015  North America-based manufacturers of semiconductor equipment posted $1.60 billion in orders worldwide in September 2015 (three-month average basis) and a book-to-bill ratio of 1.07.

SEMI announces continued annual growth for silicon shipment volumes

10/22/2015  Total wafer shipments this year are expected to exceed the market high set in 2014 and are forecast to continue shipping at record levels in 2016 and 2017.

IC Insights lowers its worldwide 2015 IC market forecast

10/22/2015  IC Insights recently released its October Update to The McClean Report, which examined the effects of slowing worldwide GDP growth and a stronger U.S. dollar on the 2015 IC market forecast.

New NSF-SRC report on energy efficient computing

10/22/2015  A report that resulted from a workshop funded by Semiconductor Research Corporation and National Science Foundation outlines key factors limiting progress in computing and novel device and architecture research that can overcome these barriers.

Slideshow: 2015 IEDM Preview

10/20/2015  An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

Historic era of consolidation for chip makers

10/19/2015  We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

Applied Materials and A*STAR announce new R&D joint lab in Singapore for advanced semiconductor technology

10/19/2015  Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

Scientists paint quantum electronics with beams of light

10/12/2015  Scientists from the University of Chicago and Penn State University accidentally discovered a new way of using light to draw and erase quantum-mechanical circuits in a unique class of materials called topological insulators.

Chemical mechanical planarization market worth $4.94 Billion by 2020

10/12/2015  According to a new market research report published by MarketsandMarkets, the market is expected to grow at a CAGR of 6.83% between 2015 and 2020, and reach $4.94 Billion by 2020.

Vanadium dioxide leads to a better transistor

10/12/2015  Penn State materials scientists have discovered a way to give the transistor a boost by incorporating vanadium oxide.

DCG Systems introduces Meridian M for static optical failure analysis

10/06/2015  DCG Systems announced the release of the Meridian M (TM) system for isolation of routine and challenging electrical faults at the wafer level.

Entegris introduces SmartStack 300 mm contactless horizontal wafer shipper

10/06/2015  Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.

Altatech adds new high-speed inspection system dedicated to ultra-thin substrates for 3D applications

10/05/2015  Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.

SDK to Offer SiC Epitaxial Wafers with very low defect density

10/05/2015  Showa Denko has developed a new grade of silicon carbide (SiC) epitaxial wafers for power devices with very low defect density.

Monolithic 3D - Game-Changing 2.0 at IEEE S3S

10/05/2015  The path to alternative scaling is now open.

Yamaichi Electronics 0.35mm pitch test contactor for semiconductor evaluation

10/02/2015  Yamaichi Electronics presents Test Contactors for lab and reliability applications and ultra fine pitch semiconductor devices.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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