Wafer Processing

WAFER PROCESSING ARTICLES



Advanced technology key to strong foundry revenue per wafer

10/15/2018  Analysis shows more than a 16x difference between the average revenue generated by 0.5µ 200mm wafers ($370) and ?20nm 300mm wafers ($6,050).

Hidden gapless states on the path to semiconductor nanocrystals

10/12/2018  When chemists from the Institute of Physical Chemistry of the Polish Academy of Sciences in Warsaw were starting work on yet another material designed for the efficient production of nanocrystalline zinc oxide, they didn't expect any surprises. They were greatly astonished when the electrical properties of the changing material turned out to be extremely exotic.

Researchers quickly harvest 2-D materials, bringing them closer to commercialization

10/12/2018  Efficient method for making single-atom-thick, wafer-scale materials opens up opportunities in flexible electronics.

The global compound semiconductor market grows on increasing demand for optoelectronic devices

10/11/2018  The global compound semiconductor market was valued at USD 66,623 million in 2016 and is expected to reach USD 142,586 million in 2023 while growing at a CAGR of 11.3% from 2017 to 2023.

Toshiba Memory Corporation appoints Stacy J. Smith as Executive Chairman

10/11/2018  Toshiba Memory Corporation (TMC) today announced the appointment of Stacy J. Smith as Executive Chairman, effective on October 1, 2018.

Cadence recognized with four 2018 TSMC Partner of the Year awards

10/10/2018  Cadence Design Systems, Inc. today announced that it has received four TSMC Partner of the Year awards at this year’s TSMC Open Innovation Platform (OIP) Ecosystem Forum.

Presto Engineering upgrades Europe's largest independent semiconductor testing facility to ISO 9001:2015 standard

10/10/2018  Semiconductors play increasingly important control roles in automotive, industrial and safety critical applications. Quality and reliability are therefore of vital importance and so Presto Engineering has completed certification to the ISO 9001:2015 quality standard at its facility in Caen, France, which is Europe’s largest independent semiconductor test facility.

The Gigafab Minute and SEMI Standards: A modern miracle

10/09/2018  Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens in today’s leading-edge semiconductor gigafabs.

INFICON acquires Final Phase Systems

10/05/2018  INFICON Inc., a supplier of vacuum instrumentation and process control software to the semiconductor manufacturing industry acquired all assets of Final Phase Systems (FPS) of Austin, Texas, USA.

Part-organic invention can be used in bendable mobile phones

10/05/2018  Engineers at The Australian National University (ANU) have invented a semiconductor with organic and inorganic materials that can convert electricity into light very efficiently, and it is thin and flexible enough to help make devices such as mobile phones bendable.

AIM Photonics unveils support for datacom and telecom optical bands with its new silicon photonics PDK

10/04/2018  The American Institute for Manufacturing Integrated Photonics (AIM Photonics) and Analog Photonics (AP) today announced the release of the AP SUNY Process Design Kit v2.5a.

Consumer electronics are fueling global semiconductor market growth

10/04/2018  According to data compiled by Inkwood Research, the global semiconductor market is projected to grow at a CAGR of 7.67% during the forecast period from 2017 to 2024.

ANSYS achieves TSMC certifications for 7nm FinFET plus process technology and integrated fan-out with memory on substrate advanced packaging technology

10/03/2018  ANSYS announced TSMC certified ANSYS solutions for the 7 nanometer FinFET Plus (N7+) process node with extreme ultraviolet lithography (EUV) technology and validated the reference flow for the latest Integrated Fan-Out with Memory on Substrate (InFO_MS) advanced packaging technology.

DRAM market braces for slower growth

10/03/2018  History suggests that DRAM ASP and market growth will soon trend downward; suppliers cautious and stand ready to adjust capex expansion plans.

SMART Global Holdings appoints semiconductor veteran Bryan Ingram as new independent member of its Board of Directors

10/03/2018  SMART Global Holdings, Inc., parent company of SMART Modular Technologies, Inc. announced the appointment of Bryan Ingram, Senior Vice President and General Manager of the Wireless Semiconductor Division of Broadcom Inc., to its board of directors and its Compensation Committee, effective October 2, 2018.

Power subsystems: Surging on a wave of vacuum processing equipment

10/02/2018  Process power and reactive gas subsystems for semiconductor manufacturing equipment have grown at a CAGR of 21% since 2013.

Global semiconductor sales increase 14.9% year-to-year in August

10/02/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

SEMI calls for exclusion process for products in new China tariff list

10/02/2018  Last week, SEMI joined a coalition of business groups in calling for Ambassador Robert Lighthizer, U.S. Trade Representative, to enact an exclusion process for the most recent tranche of tariffs on $200 billion in goods imported from China.

Industry visionaries to present at SEMICON Japan 2018 SuperTHEATER

10/01/2018  Visionary keynote speakers and industry luminaries will share insights on Smart technologies that are shaping the future at SEMICON Japan 2018, the largest and most influential exhibition in Japan for electronics manufacturing.

A 'recipe book' that creates color centers in silicon carbide crystals

10/01/2018  Researchers are documenting the different temperature and proton dosages required to make defects that will further allow silicon carbide to be used for quantum technology.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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