06/29/2015  Research led by Michigan State University could someday lead to the development of new and improved semiconductors.

06/29/2015  As these early days of the Internet of Things show the network’s promise and reveal technological challenges that could threaten its ability to meet user expectations in the years ahead, technology providers will be charged with supplying the solutions that will meet those challenges.

06/25/2015  Crystalline semiconductors like silicon can catch photons and convert their energy into electron flows. New research shows a little stretching could give one of silicon's lesser-known cousins its own place in the sun.

06/25/2015  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, today announced its receipt of the "2014 Foundry Supplier of the Year" award from customer Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated.

06/23/2015  The joint venture company will focus on R&D towards next generation CMOS logic technology and build China's most advanced integrated circuit (IC) development R&D platform.

06/23/2015  Exagan, a start-up innovator of gallium-nitride (GaN) semiconductor technology that enables smaller and more efficient electrical converters, today announced it has raised €5.7 million in first-round financing that will be used to produce high-speed power switching devices on 200mm wafers.

06/22/2015  Cadence Design Systems, Inc. and Applied Materials, Inc. today announced the companies are collaborating on a development program to optimize the chemical-mechanical planarization (CMP) process through silicon characterization and modeling for advanced-node designs at 14 nanometer (nm) and below.

06/22/2015  Noel Technologies, a specialty foundry in Silicon Valley providing process development and substrate fabrication for a variety of high-technology industries, has promoted Brenda Hill to vice president of business development, marketing and sales.

06/19/2015  "We have opened the door to a new room," says Professor Christof Wöll, Director of KIT Institute of Functional Interfaces (IFG).

06/19/2015  Graham Curren, Sondrel CEO, has announced his commitment to further investment in the training of graduate engineers looking to develop a career in the IC design sector, by providing a teaching fellow, and nine scholarship awards to students engaged on the Sondrel University of Nottingham Ningbo (UNNC) School of VLSI Design.

06/18/2015  North America-based manufacturers of semiconductor equipment posted $1.56 billion in orders worldwide in May 2015 (three-month average basis) and a book-to-bill ratio of 0.99.

06/18/2015  For the first time in the long and vaunted history of scanning electron microscopy, the unique atomic structure at the surface of a material has been resolved.

06/18/2015  Researchers from North Carolina State University have created stretchable, transparent conductors that work because of the structures' "nano-accordion" design. The conductors could be used in a wide variety of applications, such as flexible electronics, stretchable displays or wearable sensors.

06/18/2015  Entegris, Inc., a developer of yield-enhancing materials and solutions for highly advanced manufacturing environments, announced the first shipments of production quantities of UPE (ultra-high molecular weight polyethylene) membrane from its i2M Center for Advanced Materials Science in Bedford, Massachusetts.

06/17/2015  150mm and 200mm wafer fabs account for two-thirds of total closures.

06/15/2015  DCG Systems announced today that it has acquired the assets of MultiProbe, a provider of atomic force-based nanoprobing solutions for the semiconductor industry.

06/15/2015  SEMI today announced that SEMICON West 2015 will feature the Silicon Innovation Forum (SIF), a unique forum for strategic investors and key decision makers to meet new and emerging early-stage companies developing the future of microelectronics.

06/15/2015  A simple way to turn carbon nanotubes into valuable graphene nanoribbons may be to grind them, according to research led by Rice University.

06/11/2015  As if scaling to 7nm geometries and going vertical with FinFETs, TSVs and other emerging technologies wasn’t challenge enough, the emerging market for connected smart devices will bring more changes to the semiconductor sector. And then there’s 3D printing looming in the wings.

06/11/2015  Europe’s leading nanoelectronics institutes, Tyndall National Institute in Ireland, CEA-Leti in France and imec in Belgium, have entered a €4.7 million collaborative open-access project called ASCENT (Access to European Nanoelectronics Network).