Wafer Processing

WAFER PROCESSING ARTICLES



SRC awarded NIST funding to develop Semiconductor Synthetic Biology Consortium

05/21/2015  Semiconductor Research Corporation announced that it has received funding from the National Institute of Standards and Technology (NIST) Advanced Manufacturing Technology (AMTech) program to create a Semiconductor Synthetic Biology (SemiSynBio) consortium whose mission is to develop a SemiSynBio roadmap.

Six top 20 semiconductor suppliers show >20% growth

05/21/2015  SK Hynix moves into top 5, MediaTek climbs into top 10, and Sharp and UMC move into the top 20 ranking.

imec and Tokyo Electron demonstrate electrical advantages of direct Cu etch scheme for advanced interconnects

05/20/2015  Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects.

GLOBALFOUNDRIES offers new low-power 28nm solution for high-performance mobile and IoT applications

05/20/2015  Technology is the first in the industry to provide design enablement support optimized to meet low power requirements of RF SoCs.

Computing at the speed of light

05/19/2015  University of Utah engineers have taken a step forward in creating the next generation of computers and mobile devices capable of speeds millions of times faster than current machines.

EV Group NILphotonics Competence Center sees strong demand For emerging photonic applications

05/19/2015  Newly launched center assisting customers in developing products and applications in photonics; leads to multiple system orders.

imec and Lam Research develop novel metallization method

05/19/2015  During the IEEE IITC conference in Grenoble, the nanoelectronics research center imec and Lam Research Corporation today presented a novel bottom-up prefill technique for vias and contacts.

First quarter silicon wafer shipments reach record levels

05/19/2015  Worldwide silicon wafer area shipments increased during the first quarter 2015 when compared to fourth quarter 2014 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Random nanowire configurations increase conductivity over heavily ordered configurations

05/15/2015  Researchers at Lehigh University have identified for the first time that a performance gain in the electrical conductivity of random metal nanowire networks can be achieved by slightly restricting nanowire orientation.

SEMICON West 2015 focuses on the most critical issues in semiconductor manufacturing

05/15/2015  SEMI today announced the SEMICON West 2015 technical and business program agenda tackling the most important issues facing the future of semiconductor manufacturing.

Process Watch: Time is the enemy of profitability

05/14/2015  There are three main phases to semiconductor manufacturing: research and development (R&D), ramp, and high volume manufacturing (HVM). All of them are expensive and time is a critical element in all three phases.

SRC names former Freescale CTO Ken Hansen as new president and CEO

05/14/2015  Semiconductor Research Corporation (SRC) announced today that Ken Hansen has been appointed SRC’s new President and Chief Executive Officer (CEO), effective June 1.

Moore's Law to keep on 28nm

05/13/2015  Scaling is now bifurcating - some scaling on with 28/22nm, while other push below 14nm.

IBM's silicon photonics technology ready to speed up cloud and Big Data applications

05/12/2015  IBM today announced a significant milestone in the development of silicon photonics technology, which enables silicon chips to use pulses of light instead of electrical signals over wires to move data at rapid speeds and longer distances in future computing systems.

ASE and TDK announce plans for joint venture agreement

05/08/2015  Driving towards market leadership in setting the industry standard for semiconductor miniaturization in portable and wearable consumer devices.

Channeling valleytronics in graphene

05/07/2015  To the list of potential applications of graphene - a two-dimensional semiconductor of pure carbon that is stronger and much faster than silicon - we can now add valleytronics.

Visualizing formation in BEOL

05/07/2015  New tests show in real-time that cracks can run on top of and through metal layers.

Understanding the structural and optical properties of silicon nitride

05/07/2015  Using first-principles calculations, the electronic structures and optical properties that arise on doping-atom-containing silicon nitride systems are reported as a function of dielectric constant, reflectivity, absorption and loss spectra.

Enhanced thermal management solutions for RF power amplifiers

05/06/2015  Synthetic diamond heat spreaders and GaN-on-Diamond wafers have emerged as a leading thermal- management technology for RF Power Amplifiers.

"Microcombing" creates stronger, more conductive carbon nanotube films

05/05/2015  Researchers from North Carolina State University and China's Suzhou Institute of Nano-Science and Nano-Biotics have developed an inexpensive technique called "microcombing" to align carbon nanotubes.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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