Wafer Processing

WAFER PROCESSING ARTICLES



Novel solid-state nanomaterial platform enables terahertz photonics

02/17/2015  cientists are pioneering the use of nanomaterials in compact, sensitive, fast, low-cost terahertz detectors with potential in applications such as biomedical diagnostics, airport security screening and high data-rate wireless communication

eBeam Initiative announces education and collaboration focus on reactivating density benefits of Moore's Law

02/17/2015  The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announced that its top theme for 2015 will be the reactivation of the density benefits of Moore's Law through eBeam technology.

Extreme-temperature electronics

02/13/2015  Many industries are calling for electronics that can operate reliably in a harsh environment, including extreme temperatures above 200° Celsius.

Silicon wafer shipments reach record levels in 2014

02/11/2015  Worldwide silicon wafer area shipments increased 11 percent in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

SEMI wins semiconductor etch equipment export control ruling

02/11/2015  This week, after a four-month investigation, the U.S. Department of Commerce declared the export controls on certain etch equipment and technology ineffective, thereby removing a cumbersome and onerous impediment to efficient trade.

Improving the reliability of dry vacuum pumps in high-k ALD processes

02/10/2015  Design features that contributed most to the improved performance include increased rotational speed, integrated rotor sleeves, and increased purge injection temperature.

Processing of graphene on 300mm Si wafers in a state-of-the-art CMOS fabrication facility

02/10/2015  The building blocks are described that can be used to fabricate other novel device architectures that can take advantage of the unique properties of graphene or other interesting single-layer (i.e., 2D) materials.

Precision growth of light-emitting nanowires

02/10/2015  A novel approach to growing nanowires promises a new means of control over their light-emitting and electronic properties.

Qualcomm and China's National Development and Reform Commission reach resolution

02/09/2015  Qualcomm Incorporated today announced that it has reached a resolution with China's National Development and Reform Commission (NDRC) regarding the NDRC's investigation of Qualcomm under China's Anti-Monopoly Law.

One-atom-thin silicon transistors hold promise for super-fast computing

02/09/2015  Researchers at The University of Texas at Austin's Cockrell School of Engineering have created the first transistors made of silicene, the world's thinnest silicon material.

2014 was bumper year for automotive semiconductors

01/27/2015  The automotive semiconductor market did exceptionally well in 2014, according to new analysis from IHS.

New pathway to valleytronics

01/27/2015  A potential avenue to quantum computing currently generating quite the buzz in the high-tech industry is "valleytronics," in which information is coded based on the wavelike motion of electrons moving through certain two-dimensional (2D) semiconductors.

Researchers at Penn, UC Berkeley and Illinois use oxides to flip graphene conductivity

01/27/2015  Graphene, a one-atom thick lattice of carbon atoms, is often touted as a revolutionary material that will take the place of silicon at the heart of electronics. The unmatched speed at which it can move electrons, plus its essentially two-dimensional form factor, make it an attractive alternative, but several hurdles to its adoption remain.

New Soitec eSI90 RF-SOI wafer improves RF performance of high-end smart phone components

01/26/2015  Soitec (Euronext) has introduced its eSI90 substrate, the newest high-end wafer in its radio-frequency silicon-on-insulator (RF-SOI) product family.

GIGAPHOTON honored with 2015 "Toshiba Partnership Award"

01/26/2015  Gigaphoton Inc., a lithography light source manufacturer, today announced that the company has been recognized with a 2015 Partnership Award from Toshiba Semiconductor & Storage Company’s Yokkaichi Operations, a world production base of NAND flash memory devices.

Silver nanowires demonstrate unexpected self-healing mechanism

01/23/2015  With its high electrical conductivity and optical transparency, indium tin oxide is one of the most widely used materials for touchscreens, plasma displays, and flexible electronics. But its rapidly escalating price has forced the electronics industry to search for other alternatives.

2015 outlook: Tech trends and drivers

01/20/2015  Leading industry experts provide their perspectives on what to expect in 2015. 3D devices and 3D integration, rising process complexity and “big data” are among the hot topics.

Rice-sized laser, powered one electron at a time, bodes well for quantum computing

01/16/2015  Princeton University researchers have built a rice grain-sized laser powered by single electrons tunneling through artificial atoms known as quantum dots.

Solving an organic semiconductor mystery

01/16/2015  Berkeley Lab researchers uncover hidden structures in domain interfaces that hamper performance.

AKHAN Semiconductor first to invent fully transparent circuit creation process

01/15/2015  Adam Khan, founder and CEO of AKHAN Semiconductor, Inc. was granted a US patent by the US Patent and Trademark Office today for a groundbreaking process that adheres diamond, the only truly transparent semiconductor, to metals and alloys (including transparent metals) in a way that allows for reliable wire bonding and high conductivity.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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