11/18/2014  Molybdenum disulfide has emerged as a leading successor to graphene.

11/18/2014  Silicon is the second most-abundant element in the earth's crust. When purified, it takes on a diamond structure, which is essential to modern electronic devices--carbon is to biology as silicon is to technology. A team of Carnegie scientists led by Timothy Strobel has synthesized an entirely new form of silicon, one that promises even greater future applications.

11/17/2014  Today, nanoelectronics research center imec announced that SCREEN Semiconductor Solutions Co., Ltd., a leading manufacturer of advanced systems for the semiconductor industry, has joined imec’s suppliers hub for joint R&D in cleaning, wet etch and advanced lithography coat/develop processing.

11/13/2014  The Semiconductor Industry Association (SIA), in consultation with Semiconductor Research Corporation (SRC), today presented its University Research Award to professors from University of California, Berkeley and University of Texas at Dallas in recognition of their outstanding contributions to semiconductor research.

11/12/2014  SPTS Technologies, an Orbotech company, and a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced it was awarded ‘Supplier of the Year – Front End Equipment’ at this year’s Infineon Supplier Day held in Munich.

11/11/2014  AKHAN Semiconductor Inc. and the U.S. Department of Energy’s Argonne National Laboratory have reached an exclusive licensing agreement on a patent portfolio that will provide AKHAN with the intellectual property to become a fully-integrated semiconductor designer, developer and manufacturer.

11/11/2014  With generous “Morgan Challenge Matchmaker” contributions, the SEMI Foundation recently reached its goal of $1 million for workforce development.

11/10/2014  New research may help to develop graphene-based electronic devices that only become conductors when an external ultra-short pulse is applied, and are otherwise insulators.

11/10/2014  Applied Materials, Inc. today announced it collaborated with Samsung Electronics Co., Ltd. and PSK Inc., a Korea-based leader in photoresist removal, to develop an advanced patterning solution for the manufacture of future generations of NAND and DRAM device designs.

11/07/2014  Graphene Frontiers LLC, a developer of graphene materials and device technology, announces the issuance of a key industry patent.

11/07/2014  SEMATECH, the global consortium of semiconductor manufacturers, today announced that Dr. Ronald Goldblatt has been named President and Chief Executive Officer by the company’s Board of Directors, effective immediately. Dr. Goldblatt has served as acting President and Chief Executive Officer since April 2014.

11/06/2014  Presentations by Accenture Japan, Scripps, Toyota and ARM, were announced today for SEMICON Japan 2014, the largest exhibition in Japan for semiconductor manufacturing and related processing technology.

11/04/2014  The Global Semiconductor Alliance (GSA) is pleased to announce the 2014 award nominees for the GSA Awards Dinner Celebration taking place on Thursday, December 11, 2014, at the Santa Clara Convention Center in Santa Clara, Calif.

10/30/2014  SEMI announced today that the deadline for presenters to submit an abstract for the 26th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is extended to November 10.

10/23/2014  Semiconductor Manufacturing International Corporation and Maxscend Technologies Inc., a RF IP company based in China, announced that Maxscend Bluetooth RF IP has been silicon proven on SMIC's 55nm low leakage logic process.

10/21/2014  Lam Research Corp., a global supplier of wafer fabrication equipment and services to the semiconductor industry, today announced it has shipped the 100th Syndion module for deep silicon etch applications.

10/21/2014  Gigaphoton Inc. announced today that it has succeeded in achieving 3-hour continuous operation of its prototype LPP EUV light source at 50 percent duty cycle and 42-W output, equivalent to usage in a high-volume-manufacturing (HVM) environment.

10/20/2014  IBM and GLOBALFOUNDRIES today announced that GLOBALFOUNDRIES will acquire IBM's global commercial semiconductor technology business.

10/17/2014  The U.S. Patent Office has issued US Patent No. 8,859,310 to Versatilis LLC that shows how fine semiconductor particles, powders or fines, often the waste byproduct of dicing semiconductor wafers into ever smaller chips, can be processed into a sea of low cost solar cells or micro-LEDs.

10/17/2014  The 2nd annual SEMI Vietnam Semiconductor Strategy Summit, co-organized with the Saigon Hi-Tech Park and with FabMax as the premier sponsor, was held September 16-17, 2014 in Ho Chi Minh City.