Wafer Processing

WAFER PROCESSING ARTICLES



Solid State Technology and SEMI announce the 2014 “Best of West” Award winner

07/09/2014  Solid State Technology and SEMI, yesterday announced the recipient of the 2014 “Best of West” Award — Nikon Corporation — for its NSR-S630D Immersion Scanner. The award recognizes important product and technology developments in the microelectronics supply chain. The Best of West finalists were selected based on their financial impact on the industry, engineering or scientific achievement, and/or societal impact.

Standards Industry Leaders Honored at SEMICON West 2014

07/09/2014  SEMI honored eight industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The annual SEMI Standards awards were announced at the SEMI Standards reception held during SEMICON West 2014.

SEMI forecasts double-digit business growth in 2014, 2015

07/09/2014  The worldwide semiconductor capital equipment market is forecast to increase 20.8 percent this year to $38.44 billion, compared with 2013’s $31.82 billion, and another 10.8 percent in 2015 to $42.6 billion, according to Semiconductor Equipment and Materials International.

Entegris focused on purification, materials

07/09/2014  Semiconductor devices are manufactured using the most advanced processes and materials known to man and require levels of purity that measures contamination in parts per quadrillion (ppq).

The Future Looks Incredible, But Not If We Stay The Same

07/09/2014  Micron President Mark Adams’ keynote on Tuesday morning at SEMICON West 2014 was both optimistic and challenging, perhaps even unsettling for companies unused to evolving with the times.

Applied Materials unveils CVD and CMP systems

07/08/2014  On Monday, Applied Materials announced two new systems, a Reflexion LK Prime CMP system and a Producer XP Precision CVD system, both aimed at complex devices with 3D architectures.

FinFETs and FDSOI Provide Options

07/08/2014  Everybody loves FinFETs! Well, not everybody, really, is behind double-gate or multiple-gate field-effect transistors.

EUV: Coming but Not Here Yet

07/08/2014  Extreme-ultraviolet lithography is making progress! Well, check that. EUV technology is progressing, yet it remains uncertain when its insertion into volume production of semiconductors will occur.

3DICs Have Finally Arrived

07/08/2014  Intel, Samsung Electronics, and Taiwan Semiconductor Manufacturing have made their moves into three-dimensional semiconductors. Now it remains to be seen how the rest of the semiconductor industry will make the transition to 3DICs.

First 450mm Wafers Patterned with Immersion Lithography Displayed

07/08/2014  A collection of the first fully patterned 450mm wafers are on display at SEMICON West this week at the newly merged SUNY CNSE/SUNYIT exhibit, booth 517, located in the Moscone Center’s South Hall. The wafers will be on display throughout the exhibition and showcased in the 450 mm Technology Development Session on Thursday July 10th.

Entegris launches ultra clean filter for semiconductor manufacturing

07/08/2014  Entegris, Inc. announced the latest addition to its Torrento family of ultra clean liquid filtration solutions used in the semiconductor manufacturing process.

SEMATECH and CNSE/SUNYIT launch CMP Center

07/08/2014  The Center aims to accelerate the development of next generation CMP technology, and to drive improvement in the yield and cost of ownership of CMP processes.

Applied Materials and Tokyo Electron unveil new company name

07/08/2014  Applied Materials, Inc. and Tokyo Electron Limited today unveiled the new name and logo of their combined company which will be used once the merger closes.

Sunny prospects await photovoltaics in 2014

07/08/2014  The long night in solar energy may be coming to an end.

What's next for semiconductor packaging?

07/08/2014  With mobile devices continuing to shrink in size and wearable electronics emerging as a new market for semiconductors, advanced packaging technologies are taking on increasing importance in the global supply chain. Aside from the 3DIC package/system-in-package area, what is going on in semiconductor packaging these days?

Orbotech to acquire SPTS Technologies

07/07/2014  Orbotech Ltd. today announced the acquisition of SPTS Technologies Group Limited, a U.K.-based leading manufacturer of etch, deposition and thermal processing equipment for the microelectronics industry, from European private equity firm Bridgepoint and others.

FinScale’s Quantum FinFET Aims to Revive Moore’s Law

07/07/2014  FinScale Incorporated, the semiconductor device and process innovation company, today announced immediate availability of its qFinFETTM technology, a next generation 3D MOSFET architecture and manufacturable process readily transferable to foundries and integrated device manufacturers

SEMI Announces Results of Board Elections and Leadership Appointments

07/07/2014  SEMI today announced that Martin Anstice, president and CEO, Lam Research Corporation; Kevin Crofton, president and COO, SPTS Technologies; Tien Wu, COO, ASE Group; and Guoming Zhang, executive vice president, Sevenstar Electronics, were elected as new directors to the SEMI International Board of Directors in accordance with the association's by-laws.

SEMI Forecasts Back-to-Back Years of Double-Digit Growth in Chip Equipment Spending

07/07/2014  SEMI projects back-to-back years of double-digit growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released here today at the annual SEMICON West exposition.

With "ribbons" of graphene, width matters

07/03/2014  Using graphene ribbons of unimaginably small widths – just several atoms across – a group of researchers at the University of Wisconsin-Milwaukee (UWM) has found a novel way to "tune" the wonder material, causing the extremely efficient conductor of electricity to act as a semiconductor.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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