Wafer Processing

WAFER PROCESSING ARTICLES



Noise cancellation: The new failure and yield analysis superpower

06/22/2014  Root cause deconvolution is a quick and cost effective way to determine the underlying root causes represented in a population of failing devices from test data alone.

HVM production and challenges of UHP PDMAT for ALD-TaN

06/22/2014  For sub-22nm device generations, device manufacturers are likely to adopt PDMAT precursor for ALD-TaN barrier films for copper interconnect structures.

450mm transition toward sustainability: Facility and infrastructure requirements

06/19/2014  Design and construction professionals are showing unprecedented levels of collaboration through the G450C.

Semiconductor wet chemicals fall short of 2008 levels

06/14/2014  Techcet forecasts $1B electronic chemicals business by 2015.

On the road to recovery: Semiconductor growth expected for the next two years

06/09/2014  According to the IMF and predictions by many other market research firms, 2014 and 2015 are expected to be growth years, comparable to or even better than the past few years.

2D transistors promise a faster electronics future

06/03/2014  Faster electronic device architectures are in the offing with the unveiling of the world’s first fully two-dimensional field-effect transistor (FET) by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab).

Critical test issues up for debate at Test Vision 2020

06/02/2014  Test professionals who want to learn, forecast and debate the future of semiconductor test will attend the 7th annual IEEE Test Vision 2020 Workshop, held in conjunction with SEMICON West 2014 (July 8-10) in San Francisco.

Down to 5nm: Scaling with the usual suspects - performance, cost

05/29/2014  The semiconductor industry never lacks for challenges and/or controversy as it forges ahead from one technology node to the next.

KLA-Tencor announces new Teron SL650 reticle inspection system

05/23/2014  Today, KLA-Tencor Corporation announced the Teron SL650, a new reticle quality control solution for IC fabs that supports 20nm design nodes and beyond.

Sales of semiconductor equipment in North America continue to demonstrate strong growth

05/23/2014  A book-to-bill of 1.03 means that $103 worth of orders were received for every $100 of product billed for the month.

SPTS Technologies announces the Omega Rapier XE System for 300mm wafer silicon etch processing

05/22/2014  SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets, today announced the launch of its Rapier XE system for 300mm wafer silicon etching.

Global market for CVD to reach $6.8B in 2019

05/21/2014  BCC Research reveals in its new report, Thin-layer Deposition: CVD, Ion Implantation and Epitaxy, the global market for chemical vapor deposition (CVD) is expected to grow to $6.8 billion by 2019, with a five-year CAGR of 6.3%.

Lighting the way to graphene-based devices

05/19/2014  Berkeley Lab researchers use light to dope graphene boron nitride heterostructures.

MediaTek, SK Hynix, AMD, and Micron sales surge in first quarter

05/19/2014  Top 20 ranking shows that semiconductor industry company consolidation continues to accelerate.

New materials and processes for advanced interconnects

05/16/2014  Although on-chip interconnects have not been scaling at the same speed as other parts of the chip, new capabilities enabled by graphene and CNTs, among other materials, could soon change that.

Noel Technologies reducing costs of nanoimprint stamps

05/15/2014  Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, is now offering services for nanoimprint technology that reduce the costs of the nanoimprint stamps.

Improving financial predictability – is it chasing a mirage?

05/15/2014  There is continued evidence that despite spending several millions on IT transformations, improving internal planning processes, maturing supply chains, and streamlining product development processes- several companies still struggle with predicting their financial and operational performance.

SEMATECH appoints Satyavolu Papa Rao to lead process technology

05/13/2014  In this key role, Papa Rao will serve as the operational lead, overseeing the strategic development of SEMATECH’s manufacturing, process, materials and ESH-related activities.

Taking the lead out of a promising solar cell

05/09/2014  Environmentally friendly solar cell pushes forward the "next big thing in photovoltaics."

BASF opens facility in Oregon

05/08/2014  BASF today inaugurated a new Electronic Materials Sampling and Development facility in Hillsboro, Oregon. The new facility is a strategic step towards establishing a North American footprint to supply materials for semiconductor manufacturing applications related to the electronics industry.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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