Wafer Processing

WAFER PROCESSING ARTICLES



Catching the (invisible) wave

04/11/2014  UC Santa Barbara researchers create a unique semiconductor that manipulates light in the invisible infrared/terahertz range, paving the way for new and enhanced applications.

Scalable CVD process for making 2-D molybdenum diselenide

04/10/2014  Nanoengineering researchers at Rice University and Nanyang Technological University in Singapore have unveiled a potentially scalable method for making one-atom-thick layers of molybdenum diselenide — a highly sought semiconductor that is similar to graphene but has better properties for making certain electronic devices like switchable transistors and light-emitting diodes.

Sunlight generates hydrogen in new porous silicon

04/10/2014  Porous silicon manufactured in a bottom up procedure using solar energy can be used to generate hydrogen from water, according to a team of Penn State mechanical engineers, who also see applications for batteries, biosensors and optical electronics as outlets for this new material.

SEMI releases fourth quarter 2013 worldwide photovoltaic equipent market statistics report

04/09/2014  Billings and bookings show improvement in the fourth quarter.

February semiconductor sales up 11.4 percent compared to last year

04/09/2014  The Semiconductor Industry Association (SIA) today announced that worldwide sales of semiconductors reached $25.87 billion for the month of February 2014, an increase of 11.4 percent from February 2013 when sales were $23.23 billion.

Global Semiconductor Alliance celebrates 20 years of industry collaboration

04/08/2014  The Global Semiconductor Alliance (GSA) is celebrating 20 years of industry collaboration this year.

SEMI reports 2013 global semiconductor materials sales of $43.5B USD

04/07/2014  The global semiconductor materials market decreased 3 percent in 2013 compared to 2012 while worldwide semiconductor revenues increased 5 percent.

Park Systems introduces automatic defect review for semiconductor wafers

04/03/2014  Park Systems this week introduced the Automatic Defect Review (ADR)AFM for 300mm bare wafers, a fully automated AFM solution that improves throughput of AFM defect review by up to 1,000 percent.

Quantum Polymers announces 8 inch diameter carbon and glass filled PEEK rod products

04/01/2014  These products work well for applications requiring a balance of chemical resistance and mechanical strength in high temperature environments like those frequently found in the oil and gas, chemical processing, and semiconductor industries.

MACOM announces IP licensing program for GaN-on-Si technology

04/01/2014  M/A-COM Technology Solutions Inc. this week announced an IP licensing program for Gallium Nitride (GaN) on Silicon technology.

Fabricating nanostructures with silk could make clean rooms green rooms

04/01/2014  Tufts University engineers have demonstrated that it is possible to generate nanostructures from silk in an environmentally friendly process that uses water as a developing agent and standard fabrication techniques.

Researchers improve performance of III-V nanowire solar cells on graphene

04/01/2014  Researchers at the University of Illinois at Urbana-Champaign have achieved new levels of performance for seed-free and substrate-free arrays of nanowires from class of materials called III-V (three-five) directly on graphene

University of Washington selects Altatech’s CVD system to develop new process materials

03/31/2014  Altatech, a subsidiary of Soitec, has received an order from the University of Washington in Seattle for an AltaCVD chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value.

SEMATECH announces leadership changes

03/31/2014  SEMATECH, the global consortium of semiconductor manufacturers, announced today that Ronald Goldblatt, vice president of Technical Strategy and Operations, has been appointed by the board of directors as acting president and chief executive officer, effective immediately.

Silicon Valley specialty foundry Noel Technologies names Joe Medeiros Director of Reclaim

03/27/2014  Noel Technologies, a Silicon Valley specialty foundry offering process development and substrate fabrication, has added semiconductor industry veteran Joe Medeiros to its growing management staff.

Nanolab Technologies expands services with new analytical and surface measurement tools

03/26/2014  Nanolab Technologies, a Silicon Valley-based analytical services lab, has purchased and installed new tools and moved to a seven-day workweek.

Particle Measuring Systems joins SEMATECH

03/26/2014  This collaboration will address many of the profound changes taking place in the semiconductor industry that are impacting fundamental aspects of process and equipment design, including integration of new materials and process technology for sub-20nm node manufacturing, next-generation lithography requirements.

eInfochips opens new design services specializing in 16nm geometry

03/26/2014  eInfochips, a semiconductor and product engineering company, today launched design services for chips based on 16nm geometry.

Discovery of new semiconductor holds promise for 2D physics and electronics

03/21/2014  From super-lubricants, to solar cells, to the fledgling technology of valleytronics, there is much to be excited about with the discovery of a unique new two-dimensional semiconductor, rhenium disulfide, by researchers at Berkeley Lab’s Molecular Foundry.

Equipment bookings and billings continue along a steady trend

03/20/2014  North America-based manufacturers of semiconductor equipment posted $1.29 billion in orders worldwide in February 2014 (three-month average basis) and a book-to-bill ratio of 1.00.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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