Wafer Processing

WAFER PROCESSING ARTICLES



Applied Materials honored as a 2014 World's Most Ethical Company

03/20/2014  Applied Materials, Inc. today announced that it was named a 2014 World's Most Ethical Company by the Ethisphere Institute, an independent center of research promoting best practices in corporate ethics and governance.

SMIC CEO is awarded SEMI Outstanding EHS Achievement Award

03/19/2014  Dr. Tzu-Yin Chiu, Chief Executive Officer & Executive Director of SMIC presented the SEMICON China 2014 opening keynote yesterday and was given a SEMI Outstanding EHS Achievement Award.

GaN Systems appoints Jim Witham as CEO

03/17/2014  GaN Systems, a developer of gallium nitride power switching semiconductors, today announced the appointment of Jim Witham as CEO of the corporation.

Mega Fluid Systems and Entrepix join forces to offer complete CMP system

03/17/2014  Mega Fluid Systems Inc., a supplier of chemical and slurry delivery equipment, and Entrepix Inc., a provider of chemical mechanical polishing (CMP) equipment and process services, today announced a partnership agreement.

Creating a graphene-metal sandwich to improve electronics

03/14/2014  Researchers have discovered that creating a graphene-copper-graphene “sandwich” strongly enhances the heat conducting properties of copper, a discovery that could further help in the downscaling of electronics.

Surface characteristics influence cellular growth on semiconductor material

03/14/2014  Changing the texture and surface characteristics of a semiconductor material at the nanoscale can influence the way that neural cells grow on the material.

Imec achieves record 8.4 percent conversion efficiency in fullerene-free organic solar cell

03/12/2014  In this week’s Nature Communications, imec presents the development of fullerene-free organic photovoltaic (OPV) multilayer stacks achieving a record conversion efficiency of 8.4 percent.

Fab productivity and process technologies addressed at upcoming semiconductor manufacturing conference

03/12/2014  The 25th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2014) will be held May 19-21 in Saratoga Springs, New York.

EV Group boosts 2.5D and 3D IC/TSV performance with new NanoSpray application

03/12/2014  EV Group today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.

Cadence PVS certified for GlobalFoundries' 65nm to 14nm processes

03/11/2014  Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES certified the Cadence Physical Verification System (PVS) for custom/analog, digital and mixed-signal design physical signoff for 65nm to 14nm FinFET process technologies.

DSA, EUV, nanopatterning are top themes at SPIE Advanced Lithography

03/10/2014  Progress through collaborative efforts in directed self-assembly (DSA), the state of the art in nanoimprint technology, 3D approaches to scaling, and the latest on extreme ultraviolet (EUV) lithography research were hot topics at the recent SPIE Advanced Lithography symposium in San Jose.

Promising news for solar fuels from Berkeley Lab researchers at JCAP

03/07/2014  A JCAP study shows that nearly 90-percent of the electrons generated by a semiconductor/cobaloxime hybrid catalyst designed to store solar energy in hydrogen are being stored in their intended target molecules.

Semtech Corporation announces the appointment of new Executive VP

03/07/2014  Semtech Corporation, a supplier of analog and mixed-signal semiconductors, today announced the appointment of Charles B. Ammann as Executive Vice President, General Counsel and Corporate Secretary.

Weaker yen impact on the 2013 material and equipment market size

03/06/2014  Semiconductor industry revenues reported by the World Semiconductor Trade Statistics (WSTS) reached a record high in 2013 with global revenues totaling over $305 million.

Fab equipment spending to increase 20-30% in 2014

03/06/2014  The release today of the SEMI World Fab Forecast update reveals a 20 to 30 percent projected increase in semiconductor fab equipment spending in 2014.

Failure analysis and the innovative pinpoint conductive AFM

03/04/2014  One of the most challenging issues in the semiconductor industry is the failure analysis (FA) investigation of devices with enduringly shrinking geometries down to single digit nanometer trench widths.

Busch Vacuum Pumps and Systems joins F450C Consortium

03/04/2014  The Facilities 450mm Consortium (F450C), a partnership of nanoelectronics facility companies guiding the effort to design and build the next-generation 450mm computer chip fabrication facilities, today announced Busch Vacuum Pumps and Systems as the eleventh member company to join the consortium.

New SEMICON Europa in Grenoble to emphasize innovation and applications

03/03/2014  SEMICON Europa, the region’s largest event for the microelectronics manufacturing and innovation supply chain, will be held 7-9 October 2014 in Grenoble.

GlobalFoundries and Fraunhofer IIS to collaborate on EUROPRACTICE, Europe's MPW wafer shuttle program

02/26/2014  GLOBALFOUNDRIES and Fraunhofer Institute for Integrated Circuits IIS today announced the extension of their long-term collaboration, focusing on 40nm and 28nm processes. GLOBALFOUNDRIES will also join the European Multi Product Wafer (MPW) Program EUROPRACTICE.

JILA physicists discover "quantum droplet" in semiconductor

02/26/2014  JILA physicists used an ultrafast laser and help from German theorists to discover a new semiconductor quasiparticle—a handful of smaller particles that briefly condense into a liquid-like droplet.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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