Wafer Processing

WAFER PROCESSING ARTICLES



SRC and MIT extend high resolution lithography capabilities

02/26/2014  MIT researchers sponsored by Semiconductor Research Corporation have introduced new directed self-assembly (DSA) techniques that promise to help semiconductor manufacturers develop more advanced and less expensive components.

International Rectifier opens ultra-thin wafer processing facility in Singapore

02/24/2014  International Rectifier, IR, today announced that the company has commenced initial production at its new ultra-thin wafer processing facility in Singapore (IRSG).

North American semiconductor equipment industry posts January 2014 book-to-bill ratio of 1.04

02/21/2014  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Semiconductor industry posts record sales in 2013

02/20/2014  The Semiconductor Industry Association announced that worldwide semiconductor sales for 2013 reached $305.6 billion, the industry’s highest-ever annual total and an increase of 4.8 percent from the 2012 total of $291.6 billion.

Plasma-Therm signs cross-licensing agreement with ON Semiconductor

02/20/2014  Plasma-Therm announced today that it has entered into a new cross licensing agreement with ON Semiconductor to enable wafer singulation processes.

Avantor Performance Materials names Jean-Paul Mangeolle to Board of Directors

02/19/2014  Avantor Performance Materials, a global manufacturer and supplier of high-performance chemistries, announces the appointment of Jean-Paul Mangeolle to its Board of Directors.

GaN Systems appoints Tony Astley as Director of European Operations

02/18/2014  GaN Systems Inc, a developer of gallium nitride power switching semiconductors, has announced the appointment of Tony Astley as Director of European Operations.

MACOM acquires Nitronex

02/18/2014  M/A-COM Technology Solutions Inc., a supplier of high performance analog, RF, microwave and millimeter wave products, last week announced that it has acquired Nitronex, LLC.

Dow Electronic Materials launches CMP polishing pads

02/14/2014  Dow Electronic Materials, a business unit of The Dow Chemical Company, today introduced the IKONIC 4000 series of chemical mechanical planarization (CMP) polishing pads.

Silicon wafer revenues decline in 2013

02/11/2014  Worldwide silicon wafer revenues declined by 13 percent in 2013 compared to 2012 according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

IBM continues to evolve: Semiconductor business up for sale; moving into the cloud

02/07/2014  The Financial Times (FT) is reporting that IBM Corp is exploring the sale of its semiconductor business and has hired Goldman Sachs to find potential buyers.

A square peg in a round hole: The economics of panel-based lithography for advanced packaging

02/07/2014  Moving from round wafers to rectangular panels saves corner space, delivering a roughly 10% improvement in surface utilization.

The impact on OPC and SRAF caused by EUV shadowing effect

02/07/2014  EUV’s off-axis mask illumination introduces a special problem in EUV OPC – the shadowing effect.

Intel elects five new corporate vice presidents

02/06/2014  Intel Corporation today announced that its board of directors elected five new corporate vice presidents.

New theory may lead to more efficient solar cells

02/04/2014  A new theoretical model developed by professors at the University of Houston (UH) and Université de Montréal may hold the key to methods for developing better materials for solar cells.

Diamond defects boosts quantum technology

02/04/2014  New research shows that a remarkable defect in synthetic diamond produced by chemical vapor deposition allows researchers to measure, witness, and potentially manipulate electrons in a manner that could lead to new "quantum technology" for information processing.

Entegris to acquire ATMI

02/04/2014  Entegris, Inc. and ATMI today announced Entegris will acquire ATMI for approximately $1.15 billion, or approximately $850 million net of cash acquired, including the net cash proceeds from the sale of ATMI’s LifeSciences business of $170 million.

University of Strathclyde demonstrates world’s first continuously operating diamond Raman laser

01/31/2014  Achievements prove diamond’s viability as a material for solid-state laser engineering, even in the most demanding intracavity applications.

Apple and Samsung are top OEMs, again, in semiconductor spending for 2013

01/27/2014  Apple and Samsung remained the world’s largest buyers of semiconductor chips in 2013, but the intensifying battle between the two for the hearts and minds of consumers in their product offerings could presage another mighty showdown this year for the top ranking, according to a new report from IHS Technology.

SMIC unveils 28nm readiness

01/27/2014  Semiconductor Manufacturing International Corporation, China's largest and most advanced semiconductor foundry, announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate processes.




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Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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