Wafer Processing

WAFER PROCESSING ARTICLES



Worldwide semiconductor equipment billings reach $16.7B in second quarter 2018

09/10/2018  Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago.

ASMC 2019 Call for Papers deadline is October 9, 2018

09/07/2018  Educate the industry about the latest in advanced processes and materials.

Top 10 semiconductor industry innovations

09/07/2018  Over the past three decades, most of the world’s innovations have centered largely on business models and involved iterative advances of existing technologies, with none matching the global impact of the top 10 semiconductor industry discoveries and advances, Dr. Morris Chang, founder of TSMC and the IC foundry model, said at SEMICON Taiwan 2018 this week.

Global semiconductor sales increase 17.4% year-to-year in July

09/06/2018  Global industry posts highest-ever monthly sales; year-to-year growth seen across all major semiconductor product categories and regional markets.

GLOBALFOUNDRIES CTO Gary Patton to deliver opening keynote at GSA Silicon Summit

09/06/2018   Dr. Gary Patton, Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES, will deliver the opening keynote address at the inaugural GSA Silicon Summit – East, being held Tuesday, October 9 in Saratoga Springs, NY. 

OEM Group introduces next-generation Spin Rinse Dryer (SRD)

09/05/2018  OEM Group announced a major engineering design upgrade of its Semitool Spin Rinse Dryer, a platform for removing residual chemicals from semiconductor substrates and other materials such as optical lenses.

Lattice Semiconductor appoints Steve Douglass as Corporate VP, R&D

09/05/2018  Lattice Semiconductor Corporation, a provider of customizable smart connectivity solutions, announced the appointment of Steve Douglass as the Company's Corporate Vice President, R&D, effective immediately.

Veeco announces changes to executive leadership team

09/05/2018  John Peeler to remain as Executive Chairman as Bill Miller becomes CEO on October 1, 2018.

SEMI Europe and AENEAS collaborate to support European electronics industry growth

09/05/2018  SEMI Europe and AENEAS today announced that they have signed a Memorandum of Understanding (MOU) to form a strategic partnership to support the European electronics industry's growth.

China's semiconductor fab capacity to reach 20% worldwide share in 2020

09/04/2018  The China IC Ecosystem Report, a comprehensive report for the IC manufacturing supply chain, reveals that front-end fab capacity in China will grow to account for 16 percent of the world's semiconductor fab capacity this year, a share that will increase to 20 percent by the end of 2020.

Cadence full-flow digital tool suite achieves GLOBALFOUNDRIES 22FDX certification

08/30/2018  Cadence Design Systems, Inc. today announced that its full-flow digital tool suite has achieved certification for the GLOBALFOUNDRIES (GF) 22FDX process technology.

Micron Foundation establishes $1M fund for Virginia colleges and universities

08/30/2018  The Micron Foundation announced that it will commit $1 million to higher education institutions in Virginia as it invests in the next generation of technicians, scientists and engineers with a focus on women and underrepresented minorities in these fields.

Micron announces $3B investment in U.S. for DRAM and NAND

08/29/2018  Micron Technology, Inc. today announced plans to invest $3 billion by 2030 to increase memory production at its plant in Manassas, Virginia, creating 1,100 new jobs roughly over the next decade.

Edwards to expand semiconductor offering with the planned addition of Brooks Automation's cryogenic business

08/28/2018  Atlas Copco Group has announced its agreement to acquire the cryogenic business of Brooks Automation, Inc through its wholly owned US entity Edwards Vacuum LLC.

GlobalFoundries reshapes technology portfolio

08/28/2018  GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.

SEMI testifies against third round of U.S. tariffs citing damage to semiconductor supply chain

08/27/2018  In testimony last week before a U.S. government interagency panel considering tariffs on $200 billion worth of Chinese goods, SEMI called for the removal of nearly 100 tariff lines, all of which cover items critical to the semiconductor manufacturing process, including materials and machines.

TSMC WannaCry infection forces shutdowns, financial losses

08/24/2018  On August 3, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC), the largest chip fabricator globally introduced a WannaCry Ransomware cryptowormvariant onto its information technology/operational technology (IT/OT) networks.

North American semiconductor equipment industry posts July 2018 billings

08/24/2018  Global billings declined for the second month in a row, indicative of customer push-outs.

The largest compound semiconductor device maker in China selects ClassOne Solstice CopperMax electroplating system

08/23/2018  ClassOne Technology today announced a multi-tool sale of its flagship Solstice CopperMax electroplating system to China’s premier compound semiconductor manufacturer.

Worldwide semiconductor revenue hit record $120.8B in Q2 2018

08/22/2018  Samsung Electronics, Intel and SK Hynix continued to lead the semiconductor market in Q2 2018.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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