12/20/2013  TowerJazz, a global specialty foundry, and Panasonic Corporation today announced the signing of a definitive agreement to create a joint venture (JV) to manufacture Panasonic’s products, using Panasonic's three semiconductor manufacturing facilities in Japan

12/20/2013  North America-based manufacturers of semiconductor equipment posted $1.24 billion in orders worldwide in November 2013 (three-month average basis) and a book-to-bill ratio of 1.11.

12/18/2013  This new contract aims to support Soitec's strategy for the electronics, solar energy and lighting markets.

12/18/2013  ABI Research verified that Intel has a leading position in the mobile processor technology race; launching the first 22nm mobile application processor.

12/17/2013  Molecularly thin two-dimensional crystals can alleviate the lattice matching restrictions of epitaxial crystalline thin film growth, as reported by researchers in Japan.

12/16/2013  Mindspeed Technologies, Inc., a supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation.

12/16/2013  Avago Technologies Limited and LSI Corporation today announced that they have entered into a definitive agreement under which Avago will acquire LSI for $11.15 per share in an all-cash transaction valued at $6.6 billion.

12/13/2013  TSI Semiconductors, LLC, a specialty foundry services company offering flexible technology development and high-quality manufacturing solutions, today announced that Deborah Harvey has joined the company in the newly created position of executive vice president of Worldwide Foundry Sales.

12/12/2013  A new type of transistor that could make possible fast and low-power computing devices for energy-constrained applications such as smart sensor networks, implantable medical electronics and ultra-mobile computing is feasible, according to Penn State researchers.

12/12/2013  The agreement includes a technology license granted by Soitec to IntelliEPI, which may be extended to address future business opportunities in the GaAs market, including equipment transfer.

12/12/2013  Research by Professor Yoshihiro Kubozono at Okayama University has potential for innovative applications of solid picene and organic superconductors, graphene and other functional materials.

12/12/2013  Zhihong Liu of ProPlus Designs reflects on the history of the MOSFET SPICE model called BSIM3.

12/11/2013  Soitec announced this week that the European Commission has approved the financing for the Guépard program, coordinated by Soitec.

12/10/2013  SMART, which is a leading research center established by the Massachusetts Institute of Technology (MIT) in partnership with the National Research Foundation of Singapore, will utilize the EVG850LT system to support its advanced substrate development efforts.

12/09/2013  CEA-Leti today announced an agreement with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to assess the feasibility and the value of Leti’s sequential 3D technology.

12/06/2013  GIA invites senior industry executives, domain experts, technologists and market strategists to participate in a comprehensive global research initiative studying the “Thin Films” markets.

12/06/2013  While searching for an ideal growth platform for the material, investigators developed a promising new recipe for a graphene substrate: a thin film of copper with massive crystalline grains.

12/06/2013  Fab construction projects boom in 2013 but slow in 2014.

12/06/2013  Brewer Science, a supplier of thin-wafer-handling materials, processes, and equipment to the microelectronics industry, announced today the first commercial placement of its Cee 1300CSX thermal slide debonder.

12/05/2013  Worldwide sales increase for eighth straight month and top $27 billion for first time ever in October; WSTS forecast projects growth of 4.4 percent in 2013 and 4.1 percent in 2014.