12/05/2013  Nanowire lasers could work with silicon chips, optical fibers, even living cells.

12/04/2013  Worldwide semiconductor revenue totaled $315.4 billion in 2013, a 5.2 percent increase from 2012 revenue of $299.9 billion, according to preliminary results by Gartner, Inc.

12/04/2013  Soitec, a manufacturer semiconductor materials for the electronics and energy industries, today announced it has reached high-volume manufacturing of its new Enhanced Signal Integrity (eSI) substrates, enabling cost-effective and high-performance radio-frequency (RF) devices.

12/03/2013  The cells achieved average conversion efficiencies of 20.2%.

12/03/2013  SEMI projects that worldwide sales of new semiconductor manufacturing equipment will contract 13.3 percent to $32.0 billion in 2013.

11/27/2013  Semiconductor Industry Association (SIA) president and CEO Brian Toohey has announced his plans to leave the association in 2014 to join New Hampshire-based DEKA Research & Development Corporation as executive vice president.

11/26/2013  Soitec and SunEdison, Inc. announced today that they have entered into a patent cross-license agreement relating to silicon-on-insulator (SOI) wafer products.

11/25/2013  For all the promise of graphene as a material for next-generation electronics and quantum computing, scientists still don't know enough about this high-performance conductor to effectively control an electric current.

11/25/2013  It would seem that if Intel could scale transistor cost as they have done in the last 40 years then they could win these super high volume consumer-oriented designs where cost is extremely important. And TSMC is clearly taking this seriously.

11/18/2013  Micron Technology, Inc. today announced the development of a fundamentally new computing architecture capable of performing high-speed, comprehensive search and analysis of complex, unstructured data streams.

11/15/2013  Despite their almost incomprehensibly small size – a diameter about one ten-thousandth the thickness of a human hair – single-walled carbon nanotubes come in a plethora of different “species,” each with its own structure and unique combination of electronic and optical properties.

11/15/2013  Semiconductors, the foundation of modern electronics used in flat-screen TVs and fighter jets, could become even more versatile as researchers make headway on a novel, inexpensive way to turn them into thin films.

11/13/2013  SEMI Standards task forces are working on encouraging the industry to collaborate on key issues like the technical parameters for 450mm silicon wafers, physical interfaces, carriers, assembly and packaging. To date, SEMI has 13 task forces working on 450mm and has published nineteen (19) 450mm standards with 14 more in the pipeline.

11/11/2013  Tosoh Corporation announced today that Tosoh Group company Tosoh SMD, Inc., will implement a major expansion at its Grove City, Ohio, operations to develop, produce, and support physical vapor deposition (PVD) sputtering targets for the new 450mm wafer semiconductor market.

11/11/2013  The Semiconductor Industry Association (SIA) today announced that Mike Splinter, former CEO and current executive chairman of the board of directors at Applied Materials, has been named the 2013 recipient of SIA's highest honor, the Robert N. Noyce Award.

11/11/2013  Xilinx today announced first customer shipment of the semiconductor industry's first 20nm product manufactured by TSMC, and the PLD industry's first 20nm All Programmable device.

11/07/2013  Efforts make embedded memory faster, cooler and simpler.

11/07/2013  Global semiconductor capital equipment manufacturer OEM Group, Inc. announced the opening of its new Sales and Service Center in Yokohama, Japan.

11/07/2013  SK Hynix, MediaTek, Micron, and Qualcomm each forecast to show ?30% year-over-year growth.

11/05/2013  Technology achievement marks significant step towards monolithic heterogeneous integration and non-silicon devices.