10/04/2013  The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide sales of semiconductors reached $25.87 billion for the month of August 2013, an increase of 6.4 percent compared to August 2012, marking the industry's largest year-over-year growth since March 2011.

10/02/2013  Intermolecular, Inc. today announced that it has named C. Richard Neely, Jr. as the company's chief financial officer (CFO) and senior vice president.

10/02/2013  Emphasis on fabless and fab-lite models in U.S. contributes to 62% marketshare.

10/01/2013  Fairchild Semiconductor, a global supplier of high performance power and mobile semiconductor solutions, has appointed Chris Allexandre to the position of Senior Vice President of Worldwide Sales.

09/20/2013  New technique could one day help improve the performance of microelectronics in devices ranging from batteries to spacecraft.

09/20/2013  Mentor Graphics Corp. today announced that it has completed enhancements to its digital tool set for TSMC’s 16nm FinFET manufacturing processes.

09/19/2013  Worldwide semiconductor manufacturing equipment spending is projected to total $34.6 billion in 2013, an 8.5 percent decline from 2012 spending of $37.8 billion, according to Gartner, Inc.

09/19/2013  RFMD today introduced the world's first 6-inch GaN-on-Silicon Carbide (SiC) wafers for manufacturing RF power transistors for both military and commercial use.

09/18/2013  Megasonics has been used considered and used for many years to meet many of the cleaning challenges, but it has been shown to cause damage to nanoscale device structures such as polysilicon lines.

09/17/2013  TSMC forecast to sell $6.33 billion worth of ?28nm devices this year, a 3x increase over 2012.

09/17/2013  Tensile-strained GeSn MOSFET devices on Si developed using solid phase epitaxy.

09/16/2013  Entegris, Inc. and SEMATECH announced they have partnered to move forward the development of advanced nanoscale particle removal processes and cleaning technologies for next-generation wafers and devices.

09/13/2013  The worldwide semiconductor market is expected to grow three percent from 2012 to 2013. There has been sequential market growth from 1Q13 to 2Q13 and the vast majority of the top 20 vendors are expecting 3Q13 to grow revenues again.

09/13/2013  Brewer Science announced today that the next generation of carbon nanotube materials, the CNTRENE 1020 material series, is officially qualified for NRAM nanotube random access memory device manufacturing by Nantero Inc.

09/13/2013  Bruker Corporation today announced that it has acquired Prairie Technologies, Inc. (Prairie), a provider of life science fluorescence microscopy products.

09/12/2013  Scan testing is the standard practice for test of integrated circuits. The vast majority of IC production test is based on automatic test pattern generation (ATPG) using the scan logic.

09/10/2013  By blending their expertise, two materials science engineers at Washington University in St. Louis changed the electronic properties of new class of materials — just by exposing it to light.

09/10/2013  SEMI today reported that worldwide semiconductor manufacturing equipment billings reached US$ 7.55 billion in the second quarter of 2013

09/10/2013  More material could be saved when manufacturing wafers in future. Ultra-thin saws made of carbon nanotubes and diamond would be able to cut through silicon wafers with minimum kerf loss. A new method makes it possible to manufacture the saw wires.

09/10/2013  The Surface Mount Technology Association (SMTA)’s Intermountain Chapter will hold its annual technical symposium on September 19 at the University of Utah in the Warnock Engineering Building, Salt Lake City, Utah.