08/07/2013 

Solid-state drives (SSD) got a huge push in the first quarter from greatly expanded usage in ultrathin/Ultrabook PCs as well as in PC tablets, where shipment volume to those sectors tripled within a year’s time in a mighty display of growth,

08/06/2013 

Brooks Instrument, a provider of advanced flow, pressure, vacuum and level solutions, has made a new investment in its technology center in Irvine, California.

08/05/2013 

Graphene has moved swiftly from the research laboratory to the marketplace, driven by demand from markets where advanced materials are required.

08/05/2013 

Researchers from North Carolina State University and the University of Texas have revealed more about graphene's mechanical properties and demonstrated a technique to improve the stretchability of graphene – developments that should help engineers and designers come up with new technologies that make use of the material.

08/01/2013 

Micron Technology, Inc. and Elpida Memory, Inc. trustees announced today the closing of Micron’s acquisition of 100 percent of Elpida’s equity, pursuant to a Sponsor Agreement entered into on July 2, 2012 in connection with Elpida's corporate reorganization.

07/30/2013 

Semiconductor revenue worldwide will see improved growth this year of 6.9 percent and reaching $320 billion according to the mid-year 2013 update of the Semiconductor Applications Forecaster (SAF) from International Data Corporation (IDC).

07/24/2013 

Who knew that mask process correction (MPC) would again become necessary for the manufacturing of deep ultraviolet (DUV) photomasks?

07/23/2013 

Dialog Semiconductor plc, a provider of highly integrated power management, audio, AC/DC and short-range wireless technologies today announced that Richard Beyer, appointed to the board in February this year, as an independent non-executive director, will succeed Gregorio Reyes as chairman of the board. Greg will continue to serve as a board member.

07/22/2013 

After a flat year in 2012, global purchasing of semiconductors by the world’s top electronic brands is set to return to growth in 2013, as Apple Inc. and Samsung Electronics contend to claim the title of biggest spender.

07/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.33 billion in orders worldwide in June 2013 (three-month average basis) and a book-to-bill ratio of 1.10.

07/18/2013 

A variety of techniques and materials have been developed to successfully achieve bonding/debonding for 3D integration, but Tony Flaim, chief technology officer of Brewer Science (Rolla, MO) says they are still too complicated.

07/18/2013 

DAS Environmental Expert GmbH of Dresden, Germany, has developed SALIX, a point-of-use system for removing waste gas pollutants in semiconductor wafer manufacturing wet bench applications.

07/16/2013 

Researchers sponsored by Semiconductor Research Corporation (SRC), the world's leading university-research consortium for semiconductors and related technologies, today announced that they have developed a more efficient purge technique that reduces the consumption of ultra-high purity (UHP) purge gases by more than 20 percent during the production of semiconductors.

07/15/2013 

SEMATECH's Mark Neisser provided a sobering overview of the challenges associated with extending Lithography technology to pattern device structures below a half-pitch of 20nm.

07/11/2013 

At SEMICON West 2013, Boston Semi Equipment (BSE), LLC announced the expansion of its semiconductor front end and back end equipment businesses in Tempe, Ariz. into a new and larger facility.

07/10/2013 

SEMICON West 2013 included a robust set of technical and marketing presentations on the general theme of developing new semiconductor devices in the session “Lab to Fab: From R&D to High Volume Manufacturing” held 1:30-3:30PM on July 9.

07/09/2013 

At SEMICON West 2013, Element Six today announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.

07/09/2013 

New method allows IC manufacturers to reach scaling levels at 20nm and beyond, without compromising speed and device cross-talk.

07/03/2013 

Fab 5 second phase construction will start at the end of August this year and be completed in summer next year. Decisions on equipment investment and production will reflect market trends.

07/03/2013 

Following last week’s formal announcement from Governor Cuomo of the formation of the Facility 450 Consortium (F450C), ten leading nanoelectronics facility companies from around the world will collaborate at CNSE to lead the global effort to design and build the next-generation 450mm computer chip fabrication facilities.