07/02/2013 

The new laser wafer processing system Waferlase 200/300/450, is a fully automated modular platform comprising a market-leading handling system for (ultra) thin semiconductor wafers and a choice of laser processing modules, depending on the type of application.

07/02/2013 

Capacity for 200mm wafers forecast to slip more than 10 points during same period.

07/02/2013 

Europe’s recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision — it’s a major opportunity for equipment and material suppliers to participate to large-scale investment projects, increase their holding in key technologies and reach out to new customers and markets.

07/01/2013 

Gigaphoton Inc. announced today that it has completed delivery of its first ArF immersion Excimer laser supporting 450mm multi-patterning, the GT64A.

06/21/2013 

A book-to-bill of 1.08 means that $108 worth of orders were received for every $100 of product billed for the month.

06/20/2013 

Outlook for semiconductor equipment market improves, but remains soft in the short term.

06/20/2013 

Total inventory held by semiconductor suppliers declined significantly in the first quarter as excess stockpiles created during the global economic malaise of 2012 were cleared away, done in anticipation of a resurgence in consumer demand for electronic products expected by the second half of 2013.

06/19/2013 

Markets predicted by Maxtech International to reach >$5B by 2015.

06/19/2013 

Industry’s newfound maturity yields growth amid adversity.

06/17/2013 

Rozich, who previously was a member of the company’s board, succeeds Michael R. Polcari, who served as chairman since November 2009.

06/17/2013 

Single-wafer cleaning solution is suitable for 3D-IC/TSV, advanced packaging, MEMS and compound semiconductor applications.

06/13/2013 

IBM and United Microelectronics Corporation, a global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group's development of 10nm CMOS process technology.

06/12/2013 

A team of researchers has found a way to make the manufacture of crystalline silicon materials faster and more affordable.

06/11/2013 

In an industry where finer features are driving market needs, current deposition processes are no longer sufficient to address challenges like interconnect dimensions below 16/14nm or high aspect ratio TSVs (>8) without experiencing defects, voids, or low reliability.

06/10/2013 

The agreement will broaden the foundry's specialty process portfolio that already includes a range of eMemory eNVM IP solutions from 0.18um and below.

06/10/2013 

Mr. Balasubramanian (known as Bala) brings more than 37 years experience in the semiconductor industry to his new role on Freescale's board of directors.

06/06/2013 

Much has been said of the 450mm transition.  But the description of this inflection is something of a misnomer.

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

06/04/2013 

Dr. Zhihong Liu, Executive Chairman of ProPlus Design Solutions, Inc., says that design-for-yield (DFY) considerations are more important than ever. And yet, we as an industry may not fully understand device modeling and its impact on DFY results.

06/03/2013 

In advance of the 2013 SEMICON West TechXPOTs on lithography and nonplanar transistors beyond 20nm, SEMI asked some of the speakers and industry experts to comment on the challenges they wanted to highlight. Many of the inputs focused on the need for precision in the processes used to form transistors, as well as how EDA can contribute to mitigating variability.