Wafer Processing

WAFER PROCESSING ARTICLES



Test Vision 2020 at SEMICON West to address emerging test strategies, technologies and challenges

05/31/2013 

Critical trends and developments in the technologies, methodologies, and applications challenges in semiconductor test will be presented at the 6th annual IEEE Test Vision 2020 Workshop held in conjunction with SEMICON West 2013, on July 10-11 at the San Francisco Marriot Marquis Hotel.

GLOBALFOUNDRIES unveils plans to accelerate adoption of 20nm-LPM and 14nm-XM FinFET processes

05/31/2013 

At next week's 50th Design Automation Conference in Austin, Texas, GLOBALFOUNDRIES will unveil a comprehensive set of certified design flows to support its most advanced manufacturing processes.

Element Six acquires assets of Group4Labs

05/29/2013 

Element Six today announced it has acquired the assets and intellectual property of Group4 Labs, Inc. (Group4), a semiconductor wafer materials company that manufactured gallium nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.

IDC predicts semiconductor market to experience 3-4% revenue growth in 2013

05/22/2013 

IDC expects the semiconductor market to return to growth in 2013 with revenues forecast to increase by 3.5 percent this year.

Eleven companies move up in Q1’13 top 20 semi supplier ranking

05/21/2013 

Qualcomm, TSMC, and SK Hynix each register greater than 20 percent year-over-year growth.

Extending optical lithography; outlook for DSA

05/20/2013 

This year’s SEMICON West front-end processing TechXPOTs on lithography and transistors below 20nm will provide critical updates on how technologists are coping with the next scaling challenges.

Samsung announces industry-first 45nm embedded flash logic process development

05/17/2013 

Samsung Electronics Co., Ltd., a provider of advanced semiconductor solutions, today announced the industry’s first 45nm embedded flash logic process development called eFlash. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.

SMIC deploys NanoYield High-Sigma for 28nm process development

05/16/2013 

ProPlus Design Solutions, Inc. announced today that Semiconductor Manufacturing International Corporation has deployed ProPlus' NanoYield High-Sigma (HS) within its advanced technology development flow.

Surface Cleaning and Preparation

05/16/2013 

This introduction requires the development of new critical and selective cleans tackling galvanic corrosion, pattern collapse both in FEOL and BEOL process steps.  An additional challenge is that the reduction in device size and an increase in device topography makes the removal of small particles even more challenging.

EU announces achievements of three-year power microelectronics program

05/16/2013 

LAST POWER, the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements.

Global semiconductor sales outpace last year through Q1 of 2013

05/14/2013 

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

Chip Memory Technologies Inc. reveals unique embedded NV memory solution

05/14/2013 

Chip Memory Technology Inc. (CMT), a new embedded memory technology developer, has emerged from stealth mode to reveal company details and its latest product.

HELIOS develops supply chain for integrating photonics with CMOS circuit

05/14/2013 

The €8.5 million European Commission project developed a complete design and fabrication supply chain for integrating a photonic layer with a CMOS circuit, using microelectronics fabrication processes.

Studying 1/f noise

05/13/2013 

1/f noise is an important characteristic for various semiconductor devices, such as MOSFETs, BJTs, JFETs, Diode, and IC resistors. Not only does it directly impact the circuit performance of modern ICs, but it has been used also as an important technique to characterize the manufacturing process quality.

IQE and II-VI Inc. launch 150mm GaN HEMT epi wafers on SiC substrates

05/13/2013 

IQE plc announces the launch of gallium nitride-based, high electron mobility transistor (GaN HEMT) epitaxial wafers on 150mm diameter semi-insulating silicon carbide (SiC) substrates.

North American Semiconductor Industry: Continuing with high levels of investments

05/09/2013 

While investments and capital spending in Asia-Pacific garner much of the attention regarding semiconductor manufacturing, spending on equipment and materials in North America has totaled more than $100 billion over the past decade as leading device manufacturers expand capacity and invest in new facilities.

Top industrial electronics semiconductor suppliers suffer declining revenue in 2012

05/09/2013 

The eight leading suppliers of industrial electronics suffered revenue declines in 2012, reflecting weak conditions for the beleaguered market.

A new way to discover and monitor defects

05/09/2013 

In the world of optical defect inspection, finding on defect on a 300mm wafer can be like trying to find a single coin on the island of Taiwan. Now imagine being able to find that coin in just an hour, along with any other coins that look exactly like it.

First quarter 2013 reports slight decrease in silicon wafer shipments

05/09/2013 

Worldwide silicon wafer area shipments decreased during the first quarter 2013 when compared to fourth quarter 2012 area shipments, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Second phase of Nanoelectronics Research Initiative to focus on post-CMOS electronics

05/08/2013 

SRC and NIST will provide a combined $5 million in annual funding for three multi-university research centers tasked with demonstrating non-conventional, low-energy technologies that outperform current technologies on critical applications in 10 years and beyond.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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