05/07/2013 

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont.

05/06/2013 

LFoundry confirmed the signature of the final agreement regarding the acquisition of Avezzano (Italy) manufacturing facility.

05/02/2013 

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.

05/01/2013 

DARPA's Near Junction Thermal Transport (NJTT) effort recently demonstrated the first-ever GaN-on-diamond high electron mobility transistor (HEMT).

04/30/2013 

Axcelis Technologies, Inc. today announced the introduction of the Purion XE next generation single wafer high energy implanter, the second tool in its expanding family of Purion ion implanters. 

04/30/2013 

Spansion Inc. and Fujitsu Semiconductor Limited today announced they have executed a definitive agreement for Spansion to acquire the Microcontroller and Analog Business of Fujitsu Semiconductor for approximately $110 million, plus approximately $65 million for inventory.

04/29/2013 

SEMI today announced that Philip Yeo, chairman of SPRING Singapore, and Lee Kok Choy, country manager of Micron Technology Inc. Singapore, have been voted by the SEMI Singapore Regional Advisory Board as recipients of two prestigious awards recognizing their contributions to the development and success of the Southeast Asian semiconductor industry.

04/29/2013 

Cadence Design Systems, Inc. announced today that GLOBALFOUNDRIES has collaborated with Cadence to provide pattern classification data for manufacturing processes of 20 and 14 nanometers.

04/29/2013 

Morgan Advanced Materials has joined SEMATECH’s International SEMATECH Manufacturing Initiative (ISMI), a program designed to improve semiconductor equipment manufacturing productivity, yield, and cost.

04/29/2013 

Infineon Technologies and GLOBALFOUNDRIES Inc. today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology.

04/26/2013 

Global macroeconomic developments and technological advances, personal computers, and memory markets are expected to drive demand over the forecast period, Research and Markets predicts in their report, “Global Semiconductor Industry 2012-2017: Trend, Profit and Forecast Analysis.”

04/26/2013 

Hitachi Cable, Ltd. announced today that it has developed a new mass-production technology for GaN-templates, in which a high-quality gallium nitride (GaN) single-crystal thin film is grown on a sapphire substrate.

04/24/2013 

EPIC, the European Photonics Industry Consortium, has published a public database of more than 5000 company entries, an interactive map, and a report on the photonics ecosystem in Europe.

04/23/2013 

The critical processes and technologies necessary to continue Moore’s Law are currently more uncertain than ever before in the history of advanced semiconductor manufacturing.

04/22/2013 

SAMCO Inc, head quartered in Kyoto, Japan, has expanded its OPTO Films Research Laboratory in California’s Silicon Valley in order to strengthen its research structure and after-sale process support.

04/19/2013 

The market for Bluetooth semiconductors is expected to boom by nearly 100 percent from 2011 to 2017, with the majority of the growth driven by demand for wireless combination integrated circuits (ICs) and mobile system-on-chip (MSoC) devices with integrated wireless connectivity that are used in mobile devices like smartphones and media tablets.

04/19/2013 

The semiconductor chip giant revealed plans to branch out beyond PCs. Will it work?

04/19/2013 

In order to meet the rapidly growing business demands in the Chinese market and further expand the mass market in that region, Freescale Semiconductor announced today that the company plans to open ten new sales offices covering key areas across the mainland area.

04/18/2013 

AIXTRON SE today announced that the University of Cambridge has successfully commissioned another multi-wafer Close Coupled Showerhead (CCS) MOCVD reactor at its new facility at the Department of Material Science and Metallurgy. The CCS 6x2-inch system will be configured to handle single 6-inch (150mm) wafers (1x6-inch).

04/18/2013  The IC fabrication industry is approaching the end of the road for device miniaturization, with both atomic and economic limits looming on the horizon.