04/01/2013 

Intermolecular, Inc. today announced that Dr. Raj Jammy has joined the company as senior vice president and general manager of the semiconductor group.

03/21/2013 

Researchers sponsored by Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, today announced development of a modeling process designed to simulate atomic-level etching with chemicals that are effective alternatives to widely used perfluorocarbon (PFC) gases.

03/21/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.

03/20/2013 

Brion Technologies, a division of ASML, announced a major milestone today in its partnership with GLOBALFOUNDRIES. The companies are collaborating to deliver high-volume computational lithography capabilities for 28 nm and 20 nm tapeouts, while also accelerating the development of future nodes, including extreme ultraviolet (EUV) lithography.

03/20/2013 

Semiconductor manufacturers, suppliers and academia to collaborate on real-world issues at SEMI event.

03/20/2013 

Wafers with a diameter of 450mm enable the micro-chip industry an increase in yield of up to 80%. This leads to an enormous increase in productivity. In order to control the product quality, these wafers receive a specific marking from the manufacturer.

03/19/2013 

Kotura inks fab agreement; announces relationships with Mindspeed and BinOptics.

03/19/2013 

MV Products has announced that their high-capacity, modular vacuum pump inlet-exhaust traps can be stacked for semiconductor wafer fabrication processes which produce a lot of heavy particulates.

03/15/2013 

OneChip Photonics this week revealed strategic, outsourcing plans to expand into new markets, with announcements of newly-established relationships with semiconductor foundry GCS and wafer supplier IQE. Both announcements related to OneChip’s bigger, strategic plan to expand its services into the high-volume DCI market.

03/14/2013 

Imec announced today the launch of its fully integrated silicon photonics platform through a cost-sharing Multi-Project Wafer (MPW) service via ePIXfab.

03/14/2013 

Nanoplas, a global supplier of plasma processing equipment to the semiconductor industry, today announced a new dry-etch process offering virtually unlimited etch selectivity for removing dielectric films on microprocessors and memories at high throughput.

03/13/2013 

After reaching a worrisome high in the third quarter of 2012, global semiconductor inventories held by chip suppliers fell at a surprisingly fast rate in the fourth quarter, led by dramatic reductions for market leader Intel Corp.

03/12/2013 

Cadence Design Systems, Inc. today announced plans to aquire Tensilica, Inc. for approximately $380 million in cash. Tensilica had approximately $30 million of cash as of December 31, 2012.

03/12/2013 

Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

03/08/2013 

Everyone wants faster access to stored data, and the issue is becoming critical with Big Data and cloud initiatives. With the speed of DRAM and the non-volatility of storage, Magnetoresistive Random Access Memory (MRAM) encourages a new way of thinking about storage applications. Storage is associated with longer latencies, but with MRAM storage can have similar latencies to memory. These capabilities and others make MRAM a catalyst for new thinking about how we design storage applications.

03/07/2013 

More than 100 representatives from government and the photonics industry convened in Washington, D.C., on February 28 to identify focus areas for a national photonics initiative (NPI), engaging academia, industry, and government in a collaboration to address barriers to continued U.S. leadership in photonics.

03/07/2013 

Over 2,000 industry professionals attended last week’s SPIE Advanced Lithography, where important progress reports were revealed on extreme ultraviolet (EUV), lithography, directed self-assembly (DSA), metrology, and related topics. The event ran February 24-28 in San Jose, California.

03/07/2013 

Semiconductor technology leaders ST and CMP help universities, research labs and companies prototype next generation of Systems-on-Chip.

03/07/2013 

LFoundry to manufacture wafers for Aptina following LFoundry’s purchase of Micron’s Avezzano, Italy semiconductor fabrication facility.

03/06/2013 

Following a healthy expansion in 2012, the growth of the global automotive semiconductor market will decelerate slightly this year because of a slowdown in the aftermarket and portable navigation device (PND) segments.