Wafer Processing

WAFER PROCESSING ARTICLES


Diodes Incorporated closes acquisition of BCD Semiconductor

03/06/2013 

Diodes Incorporated today announced that it has completed its acquisition of BCD Semiconductor Manufacturing Limited in an all cash deal, valued at approximately $151 million.
Peregrine Semiconductor to license its UltraCMOS design to Murata

03/05/2013 

Peregrine Semiconductor Corporation, a fabless provider of high-performance radio frequency integrated circuits (RFICs), yesterday announced plans to collaborate with Murata Manufacturing Company on a multisource arrangement for RF switches and other components based on Peregrine’s proprietary UltraCMOS technology
Samsung issues apology for fatal acid spill at its Korean semiconductor plant

03/04/2013 

Samsung Vice-President Kwon Oh-hyun released a statement today, apologizing for the fatal hydrofluoric acid spill that left one worker dead and four others injured.
Deposition Sciences increases photolithography patterning capacity

03/04/2013 

New 200 mm diameter wafer enhances photolithography capability.
Coherent introduces highest power ultrafast laser for materials processing

03/04/2013 

Coherent, Inc. has expanded its family of industrial ultrafast lasers with the new Talisker 1000 series. This new series of high power picosecond lasers is designed for high-throughput, precision materials processing applications in the semiconductor, solar (photovoltaics), medical devices, consumer electronics and automotive industries.
Semiconductor sales rose in January

03/04/2013 

Worldwide sales of semiconductors were $24.05 billion the month of January, up 3.8% from January 2012 and down 2.8% from December 2012, according to the Semiconductor Industry Association (SIA).
India's efforts to appeal to semiconductor manufacturers

02/28/2013 

This week, India’s Finance Minister P Chidambaram offered incentives to chip makers to set up headquarters in India, in an effort to encourage local electronics manufacturing. However, the response from the industry has been less than positive. Many believe that is it is a good start, but far from sufficient.
A single European semiconductor strategy is on its way

02/28/2013 

STM, Imec, CEA-LETI, ASML, Soitec and EU representatives discussed directions at ISS Europe 2013 in Italy.
New Product: Mentor Graphics launches cell characterization and analysis platform

02/27/2013 

Mentor Graphics Corp. today announced availability of the Kronos Cell Characterization and Analysis platform. The Kronos platform quickly produces accurate performance models for standard cells, I/Os, and complex cells within an advanced, integrated environment.
Altera to build FPGAs on Intel’s 14nm tri-gate technology

02/27/2013 

Intel announced Monday a major move to expand its foundry business. Altera Corporation and Intel Corporation have entered into an agreement for the future manufacture of Altera FPGAs on Intel's 14nm tri-gate transistor technology.
World’s first GaN-based high power converter to be demonstrated at APEC 2013

02/27/2013 

Transphorm Inc. today announced at the 2013 ARPA-E Energy Innovation Summit that its novel 600V Gallium Nitride (GaN) module has enabled the world’s first GaN-based high power converter. Transphorm will demonstrate the product built with its customer-partner Yaskawa Electric, Japan at the upcoming APEC 2013 industry conference.
GaN Systems expands with new UK location

02/26/2013 

New marketing and technical support center opened in Reading, UK.
Qualcomm processor first to use TSMC’s 28 HPM advanced process technology

02/26/2013 

Snapdragon 800 processor on 28nm HPM process delivers high performance and low power for mobile devices.
Molecular Imprints’ advanced lithography platform uses Xaar printheads to pattern 450mm wafers

02/26/2013 

Molecular Imprints, Inc. (MII), a developer of advanced semiconductor lithography, has announced the delivery of an advanced lithography platform which uses Xaar 1001 inkjet printheads to pattern 450mm silicon wafer substrates.
Ultra-low power processor operates at near-threshold voltage

02/21/2013 

At this week’s International Solid State Circuits Conference (ISSCC 2013), imec and Holst Centre presented an ultra-low power processor that operates reliably at near-threshold voltages.
STMicroelectronics 28nm FD-SOI technology hits 3GHz operating speed

02/20/2013 

STMicroelectronics announced today another milestone in its testing of its 28nm FD-SOI Technology Platform.
Five IC suppliers to hold one-third of 300mm wafer capacity in 2013

02/20/2013 

Samsung tops list; IC foundries expected to show biggest capacity gains through 2017.
Production process doubles speed and efficiency of flexible electronics

02/20/2013 

Stretched-out clothing might not be a great practice for laundry day, but in the case of microprocessor manufacture, stretching out the atomic structure of the silicon in the critical components of a device can be a good way to increase a processor's performance.
DRS Technologies and Cypress Semiconductor reach agreement to manufacture uncooled detectors

02/19/2013 

DRS Technologies, Inc., a Finmeccanica Company, and Cypress Semiconductor Corp. (NASDAQ: CY) today announced that DRS will transfer its Microbolometer technology for uncooled infrared detectors to Cypress for high-volume manufacturing.
SEMATECH and Cabot Microelectronics to collaborate

02/14/2013 

Cabot will collaborate with SEMATECH to develop advanced solutions for emerging CMP applications.



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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