02/13/2013 

The global market for MEMS microphones has reached approximately $422 million in 2012. The market is predicted to increase to $865 million in 2017.

02/13/2013 

Microelectromechanical (MEMS) devices are shaping the competitive landscape in the global medical device industry.

02/12/2013 

Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

02/08/2013 

In the second of two installments, Linx Consulting reports a steady growth in semiconductor production, as released in The Econometric Semiconductor Forecast.

02/08/2013 

Mitsubishi Electric Corporation announced this week that is has developed a prototype to improve productivity of SiC slice processing for semiconductor wafers.

02/07/2013 

Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.

02/07/2013 

In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.

02/07/2013 

A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.

02/07/2013 

To help the Taiwan LED industry tackle the increasing challenges, an in-depth analysis of LED global market opportunities and technology breakthroughs were recently provided at the 2013 LED Market and Outlook seminar held by SEMI Taiwan.

02/06/2013 

Dow Electronic Materials launched the first pads from its new IKONIC 2000 and IKONIC 3000 polishing pad series.

02/06/2013 

SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.

02/05/2013 

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.

02/01/2013 

Scientists at RTI International are advancing the state of science in electronic devices for optical systems by using superlattice structures to optimize the performance of germanium optical detectors on silicon chips.

01/30/2013 

The Global Semiconductor Alliance (GSA) announced the appointment of three new members to the GSA Board of Directors.

01/30/2013 

SEMI announced that Joung Cho (JC) Kim, chairman, Edwards Korea Limited, is the recipient of the 14th annual SEMI Sales and Marketing Excellence Award.

01/29/2013 

Dr. Zhihong Liu, Executive Chairman, ProPlus Design Solutions, blogs about dealing with increased random variations and layout-dependent effects.

01/25/2013 

A particle as small as three microns in diameter, attached to the back side of the wafer—the dark side, if you will—can cause yield-limiting defects on the front side of the wafer during patterning of a critical layer.

01/17/2013 

In the ranks of top foundries, there's a new Number Three in town: Samsung, which climbed up the ranks again in 2012 thanks to its ubiquity in smart phone technology, according to updated rankings by IC Insights.

01/15/2013 

The rise in mobile computing, changes to the fabless-foundry model, uncertainties in technical innovation, and global macroeconomic trends are becoming the dominant forces in 2013 and beyond, according to industry leaders speaking at this week's SEMI Industry Strategy Symposium (ISS).

01/11/2013 

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."