Wafer Processing

WAFER PROCESSING ARTICLES



SEMI approves first HB-LED standards

01/09/2013 

SEMI's HB-LED Standards Committee has approved its first standard, specifying sapphire wafers used in making high-brightness light-emitting diode (HB-LED) devices.

Cymer hires AMAT roadmap exec to lead EUV development

01/08/2013 

Klaus Schuegraf, former exec at Applied Materials responsible for the company's semiconductor products technology roadmap, will now lead Cymer's EUV engineering and development programs.

2013: Advanced chemistry moves center stage

01/04/2013 

We are in an age where chemistry is center stage in the race to advance Moore’s Law and More Than Moore.

IDC: Semiconductor revenues will grow 4.9% in 2013

01/04/2013 

The International Data Corporation is forecasting that semiconductor revenues worldwide will improve by 4.9% to $319 billion in 2013 and log a compound annual growth rate (CAGR) of 4.1% from 2011-2016.

2013: Healthy revenue growth, but capex likely flat

01/04/2013 

Based on current indications, capital spending would seem to be flat in 2013.  However, Semico predicts healthy revenue growth this year, which may encourage more spending, particularly in the second half of the year.  This may bring total capex for 2013 into the positive range.

2013: An economic outlook for the global IC market

01/03/2013 

Predictions for 2013 show several notable trends: overall silicon area growth for 2013 should average approximately 6%; the first quarter and the second half are likely to show slower growth than the second quarter; and the modest growth forecast for 2013 is predominantly demand driven.

2013: The New New York

01/03/2013 

New York represents Exhibit A of a new way of thinking; a true 21st century model for technology, workforce and economic development.

2013: 450mm is the next big opportunity

01/03/2013 

In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.

2013: Continued strength in 200mm

01/03/2013 

80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.

2013: Facing unprecedented precision engineering challenges

01/02/2013 

Unprecedented precision engineering will be needed to manufacture chips features measured in nanometers.  At these dimensions every atom counts and controlling variability is vital to meet performance and productivity targets.

2013: Thriving in the transition to 450mm

01/02/2013 

The development of innovative technologies that solve the critical issues for the transition and adoption of 450-mm manufacturing will be the defining factor for whether a company merely survives or thrives.

2013: Multiple inflection points provide opportunity to extend benefits of Moore’s Law

01/02/2013 

While solutions are available to extend Moore’s Law, these solutions come at considerable increases in cost and complexity. As it has in the past, this industry will find more innovative solutions to overcome the challenges of inflection.

2013: Building the internet of things with MEMS and 3D advances

01/02/2013 

It is becoming increasingly clear that new MEMS and 3D high-volume, low-cost manufacturing technologies will accelerate a radical change to society’s cyber skyline.

2013: Fab Equipment Spending Shrinks Back to Flat

01/02/2013 

The SEMI Consensus Forecast and the SEMI World Fab Forecast, with data collected from two different methodologies, point to the same conclusion: 0% growth for 2013.

Semi execs see a bright 2013, says survey

12/28/2012 

Industry watchers have been lowering their outlooks for 2013 over the past few weeks, but there's one set of opinions that still see optimism for an industry rebound in 2013 -- chip industry executives themselves.

Low-cost MEMS fabrication using injection molding

12/28/2012 

Researchers in Japan have devised a MEMS fabrication technology using lower-cost production methods of printing and injection molding, enabling MEMS devices to be applied for fields such as lighting -- and producable by firms outside the semiconductor sector.

Singapore IME, Nikon building R&D lab for sub-20nm semiconductor litho

12/27/2012 

Nikon and the Singapore A*STAR IME are jointly setting up a R&D lab to develop optical ArF lithography technology for semiconductor manufacturing to and below the 20nm device node.

Lifting the veil on silicon interposer pricing

12/24/2012 

Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.

Gartner: Fab equipment still getting softer, next upcycle starts in 2014

12/20/2012 

Global spending on wafer fab equipment (WFE) is now on pace to finish 2012 with a -17% annual decline, and 2013 now looks like it'll only be slightly better at a -10% dropoff, before the next cyclical spending upturn begins in 2014, according to an updated forecast from Gartner.

Ultratech buys Cambridge Nanotech assets, adds ALD tech

12/20/2012 

Ultratech has acquired the assets of Cambridge Nanotech, a developer and supplier of atomic-layer deposition (ALD) technology, which had quietly been put on the auction block after ceasing operations in November.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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