12/19/2012 

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.

12/18/2012 

Canon U.S.A., Inc. recently launched the FPA-3030i5+ i-line stepper, designed for the manufacturing of LEDs, MEMS and power semiconductors.

12/17/2012 

Samsung's reaffirmation of its planned $4B investments in its Austin, TX facilities don't offer much extra info, but do serve as a message to the market about its future plans -- with or without Apple.

12/17/2012 

Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.

12/11/2012 

In the seventh installment in a series called Process Watch, the authors discuss cycle time and the impact of inspection. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

12/11/2012 

With this week's IEEE International Electron Devices Meeting (IEDM 2012) now underway, here are four of the papers that were accepted late: on 90nm integrated silicon photonics, ZnNO for next-gen displays, and III-V TFETs for the 7nm node.

12/11/2012 

At the International Electron Devices Meeting in San Francisco, An Chen of GLOBALFOUNDRIES presented a survey of emerging nanoelectronic devices, which he divided into two categories: Charge-based and non-charge based.

12/11/2012 

Attendees at this year’s International Electron Devices Meeting (IEDM) were delighted and perhaps somewhat horrified when the plenary speaker popped some electronics gear in his mouth and proclaimed, “It tastes like chicken!”

12/10/2012 

STMicroelectronics has a new strategic plan that will focus on five product areas (MEMS/sensors, smart power, automotive products, microcontrollers, and application processors), and also exit its mobile chip JV with communications giant Ericsson.

12/06/2012 

Semiconductor equipment demand is persistently sluggish as the industry takes a break from a "multiyear expansion period" to digest recent investments and wrestle with a broader economic slowdown, acknowledges SEMI in its updated year-end forecast. But make no mistake: leading-edge technology investments are still happening, and growth will return in the typical cyclical pattern.

12/06/2012 

Axcelis Technologies, Inc. (NASDAQ: ACLS) and Lam Research Corp., (NASDAQ: LRCX) announced a strategic collaboration agreement focusing on the interrelationship between ion implantation, etch processes, and photoresist strip applications.

12/06/2012 

KLA-Tencor says its new fourth-generation LED wafer inspection system achieves greater flexibility, increased throughput, and improved efficiency for inspecting defects and performing 2D metrology in LED applications, as well as MEMS and semiconductor wafers.

12/05/2012 

The global market for consumables used in chemical mechanical planarization (CMP) operations continues to rebound, as "magic triangle" combinations of slurry, pad, and conditioner are emerging to improve performance for ≤45nm requirements, reports TechCet Group.

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