11/13/2012 

In the sixth installment in a series called Process Watch, the authors discuss the ins and outs of parametric correlation when using measurements based on reflectometry, ellipsometry, or a combination of the two. Authored by experts at KLA-Tencor, Process Watch articles focus on novel process control solutions.

11/13/2012 

Alchimer SA says it is seeking partnerships with various semiconductor equipment and materials companies as it welcomes two top execs: Bruno Morel is the company's CEO since May of this year, and product development director Fr

11/13/2012 

Soitec says it has more than doubled production of bonded silicon-on-sapphire (BSoS) substrates to meet increased demand from partner Peregrine Semiconductor, which has surged its own production capacity for RF switches used in cellular handsets, including the newest iPhone 5.

11/12/2012 

FEI, Hillsboro, OR, has introduced its new Helios NanoLab 450 F1 DualBeam system designed to provide faster, better images of their most advanced device architectures.

11/12/2012 

imec announced two research collaboration efforts to advance STT-MRAM technology, an alternative high-density memory technology. The developments include working with Canon Anelva Corp. on its deposition tool and working with Tokyo Electron (TEL) on its Tactras etch tool, both installed in imec’s 300mm cleanroom.

11/12/2012 

Wide bandgap semiconductor materials can significantly outperform traditional silicon-based devices in power electronics and light-emitting diodes (LEDs), but they're vastly more expensive. So where's the midpoint where GaN's capabilities and extra costs align to make it the preferred technology for each application?

11/12/2012 

This year's International Conference on Planarization/CMP Technology (ICPT) encompassed five themes describing use of CMP: new device structures, equipment and methods, Cu interconnects, consumables, and new CMP methods and processes.

11/09/2012 

Materials experts from across the supply chain gathered at the 2012 Strategic Materials Conference 2012 in San Jose in October, discussing key materials needs for micromanufacturing outside the CMOS mainstream: OLEDs and GaN-on-silicon power semiconductors, graphene, CNTs, and self-assembling polymers.

11/07/2012 

Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.

10/31/2012 

Applied Materials has announced two new tools for display manufacturing: one with a new design for depositing IGZO films for TFTs, the other handling bigger LTPS-deposited substrates to help lower manufacturing costs.

10/30/2012 

Brooks Automation says it has agreed to acquire privately-held Crossing Automation for $63 million, combining two firms in semiconductor automation technology and services.

10/29/2012 

Lockheed Martin scientists have developed a new "nanotechnology" copper-based solder that it says will produce joints with up to 10

10/24/2012 

Semiconductor manufacturers can expect equipment costs to increase about 15% for each new process node, but previously enjoyed advantages of moving to smaller feature sizes are no longer offsetting those costs -- even with a 450mm wafer transition.

10/23/2012 

Wafer demand is slowly turning back toward growth, and a closer look at the numbers from SEMI and Semico Research shows what's behind the trends -- and why they give purchasing managers headaches.

10/22/2012 

In case anyone needed a reminder or a wake-up, new data from SEMI reiterates chip tool sales are slumping badly in the latter part of this year.

10/18/2012 

Fraunhofer IZM's All Silicon System Integration Dresden (ASSID) center will add SPTS' etch and PECVD process capabilities to investigate low-temperature dielectric films for through-silicon vias (TSV) in 3D IC packaging.

10/18/2012 

At SEMICON Europa, European government representatives, consortia, and suppliers discussed programs to support and participate in the 450mm wafer-size transition -- including a comprehensive presentation from ASML about its roadmap for 450mm EUV platforms.

10/17/2012 

Intel spoke of caution in end markets when discussing its 3Q12 results, but a big dip in capex and lack of 2013 visibility will likely cause concern in the semiconductor manufacturing ecosystem.

10/16/2012 

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

10/16/2012 

The Global Semiconductor Alliance (GSA) says it has formed a Technology Steering Committee to help address key business and technology areas of interest to its members, and "encourage the advancement and adoption of leading technology and practices."