Wafer Processing

WAFER PROCESSING ARTICLES

Samsung breaks ground for memory manufacturing in China

09/12/2012

Samsung Electronics Co., Ltd., held a groundbreaking ceremony for a major new memory fabrication line in Xi'an, China. Once completed, the new facility will make use of advanced 10-19nm technology to produce NAND flash memory chips, according to the company.

Chip tool demand slumps in 2Q12, though Taiwan shines

09/12/2012

Global demand for semiconductor manufacturing equipment slipped -4% in 2Q12 with softness in just about every region -- except Taiwan which stepped on the pedal during the quarter, according to updated data from SEMI and SEAJ.

GaAs nanowires on graphene focus of NTNU research

09/12/2012

Researchers at the Norwegian University of Science and Technology in Trondheim (NTNU) have patented and are commercializing GaAs nanowires grown on graphene.

Scotch tape induces high-temp superconductivity

09/12/2012

A team led by University of Toronto physicists has developed a simple new technique using Scotch poster tape that has enabled them to induce high-temperature superconductivity in a semiconducto.

SRC honors professors from UC Berkeley and MIT

09/12/2012

Semiconductor Research Corporation (SRC) recognized two outstanding professors in SRC-supported, chip-related research and education for 2012.

EVG updates modular coater/developer with OmniSpray, NanoSpray coating options

09/10/2012

EV Group's updated modular EVG150 high-volume coater/developer adds new modules for conformal coating of high topography surfaces, and coating surfaces with vertical sidewall angles, such as through-silicon vias (TSV).

Intel lowers 3Q outlook: What's the real driving factor?

09/07/2012

Analysts weigh the reasons behind Intel's downwardly-revised 3Q12 results, from macroeconomic sluggishness to tablet-PC cannibalization -- and whether its pullback in 2012 capex plans spells trouble for the market overall.

Intel lowers 3Q outlook: What's the real driving factor?

09/07/2012

Waiting for the next "golden year"

09/07/2012

While various industry segments appear to be tapping the brakes, others are revving their engines, observes SEMI's Christian Gregor Dieseldorff -- and a 2012 stall could pave the way for a record-breaking 2013.

Semiconductor R&D spending rising 10% in 2012 to meet design, process challenges

09/06/2012

Spending on R&D by semiconductor companies worldwide is expected to grow 10% in 2012 to a record $53.4 billion, as companies all across the ecosystem try to keep up with more complex IC designs and new process technologies, according to data from IC Insights.

Technology alliance formed for glass and brittle materials processing

08/31/2012

Three leaders in their respective fields have formed a technology alliance to bring a new glass cutting technology to market. InnoLas Systems GmbH licensed process technology developed by FiLaser LLC and will use ultra-short pulse lasers produced exclusively for InnoLas by LUMERA LASER GmbH.

Gas systems firms unite: Matheson takes majority stake in RASIRC

08/30/2012

Matheson has acquired a majority stake in RASIRC, supplementing its gas purification and material businesses with RASIRC's water vapor systems.

SRC to host TECHCON conference in September

08/29/2012

Semiconductor Research Corporation (SRC), a university-research consortium for semiconductors and related technologies, is poised to celebrate its 30^th anniversary at its annual TECHCON conference Sept. 10-11.

Brooks Automation updates vacuum monitoring equipment

08/28/2012

Two extensions to Brooks Automation's vacuum quality monitoring (VQM) components make it easier to measure gases and conditions inside a vacuum chamber.

SEMI builds portal for 450mm info

08/27/2012

SEMI's new "450 Central" information portal offers news and perspectives about the 450mm wafer-size transition.

Q2 semiconductor revenue may be troubling indicator of market health

08/23/2012

Global semiconductor market revenue in Q2 2012 fell by 3% Y/Y to $75.2 billion, and grew sequentially <3%, resulting in widespread revenue declines for chip suppliers, particularly those headquartered in Japan and Europe, according to IHS.

GaAs faces slowing demand from 2011 on

08/22/2012

H2 2011 saw slow growth for gallium arsenide (GaAs) substrates in semiconductor and related devices, as well as a shift away from GaAs as a handset switch technology. However, the March 2011 earthquake and tsunami in Japan disrupted the supply chain, driving up substrate pricing and overall revenue to nearly $230 million.

UMC to close semiconductor foundry in Japan, dissolve subsidiary

08/22/2012

Semiconductor foundry United Microelectronics Corporation (NYSE:UMC; TWSE:2303) will close its fab operation in Japan through the dissolution and liquidation of its wholly-owned subsidiary, UMC Japan.

Dynamic changes impacting advanced electronic materials industry

08/22/2012

Learn about the changes in semiconductor manufacturing as well as related markets -- photovoltaics, displays, LEDs, etc -- at the 2012 Strategic Materials Conference (SMC), to be held on October 23-24 in San Jose, CA. SEMI reports.

Present on semiconductor metrology and more at ASMC 2013

08/22/2012

ASMC 2013, the leading international technical conference for exploring solutions to improve collective microelectronics manufacturing expertise, has issued a call for papers.

Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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