Wafer Processing

WAFER PROCESSING ARTICLES



Total fab equipment spending reverses course, growth outlook revised downward

12/17/2018  Total fab equipment spending in 2019 is projected to drop 8 percent, a sharp reversal from the previously forecast increase of 7 percent as fab investment growth has been revised downward for 2018 to 10 percent from the 14 percent predicted in August.

DRAM growth tops industry ranking in 2018; Outlook dims for 2019

12/14/2018  DRAM fastest growing market in four of past six years, demonstrating very cyclical market.

Ferdinand-Braun-Institut chooses ClassOne for three additional wet processing tools

12/13/2018  ClassOne Technology, global supplier of wet processing equipment for <200mm semiconductor manufacturing, announced the sale of three more tools to the Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik (FBH) in Berlin, Germany.

General industry slowing coupled with geopolitical strife

12/12/2018  Now that most companies in our sector analyses have reported their calendar third quarter 2018 financial results, we have final or 3Q'18/2Q'17 growth estimates for the world electronic supply chain.

Semiconductor equipment sales forecast: $62B in 2018 a new record

12/12/2018  The equipment market is expected to contract 4.0 percent in 2019 but grow 20.7 percent to reach $71.9 billion, an all-time high.

Rudolph’s NovusEdge selected by wafer manufacturers for bare wafer edge and backside inspection

12/11/2018  Rudolph Technologies, Inc. today announced the receipt of over $12M in new orders for its recently-released NovusEdge system for edge and backside inspection on bare silicon wafers.

SEMICON Japan 2018 opens tomorrow focusing on SMART applications

12/11/2018  SEMICON Japan 2018, the largest and most influential event for the electronics manufacturing supply chain in Japan with more than 70,000 attendees expected, opens tomorrow at Tokyo Big Sight.

GOWIN Semiconductor opens European office

12/11/2018  GOWIN Semiconductor Corp., an innovator of programmable logic devices, announces the expansion of its global sales operations into the EMEA region.

Topological matters: Toward a new kind of transistor

12/10/2018  X-ray experiments at Berkeley Lab provide first demonstration of room temperature switching in ultrathin material that could serve as a 'topological transistor'.

Microtronic announces new informational tech bulletin series on optimizing semiconductor macro defect wafer inspection

12/07/2018  Microtronic, Inc., a maker of high-speed full-wafer semiconductor macro defect inspection systems, wants to shed new light on a topic that is frequently misunderstood in the industry: macro vs. micro inspection.

Global Semiconductor Alliance announces 2018 GSA Award recipients

12/07/2018  The Global Semiconductor Alliance (GSA) is proud to announce the award recipients honored at the 2018 GSA Awards Dinner Celebration that took place last evening in Santa Clara, California.

Iron-rich lamellae in the semiconductor

12/07/2018  HZDR researchers produce unusual crystal structure.

Global semiconductor sales increase 12.7% year-to-year in October

12/06/2018  The global semiconductor industry posted solid year-to-year growth in October and is on pace for its highest-ever annual sales in 2018, but growth has moderated in recent months.

Lam Research announces Martin Anstice resigns as CEO

12/06/2018  Tim Archer appointed as president and CEO.

SEMI Industry Strategy Symposium leads microelectronics into new era

12/06/2018  SEMI ISS 2019 kicks off Technology Leadership Series of the Americas.

SEMI launches new semiconductor manufacturing workforce development campaign

12/05/2018  The semiconductor manufacturing industry is fighting to attract, educate, and retain the necessary talent for its continued growth.

SEMI welcomes efforts to reduce U.S.-China trade tensions

12/04/2018  The U.S. plans to delay tariff increases on $200 billion worth of Chinese imports, China has vowed to increase U.S. market access, and both parties are planning talks over the course of 90 days to address current frictions.

Global microelectronics experts develop SEMI's technology leadership series of the Americas

12/04/2018  World's largest lineup to advance industry roadmap in seven major conferences.

Silicon Labs joins Semiconductor Industry Association

12/03/2018  Silicon Labs President and CEO Tyson Tuttle elected to SIA board of directors.

EVG unveils next-generation fusion wafer bonder for "More Moore" scaling and front-end processing

12/03/2018  New BONDSCALE system provides a significant boost in wafer bond productivity; addresses logic transistor scaling and 3D integration challenges outlined in IRDS Roadmap.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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