Monthly Archives: September 2004

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Sept. 9, 2004 – MesoSystems Technology Inc. has a number of products in its pipeline, one an upgrade, and two in beta testing. The company, headquartered in Albuquerque, N.M., began shipping its new and improved BioCapture 650 in June, said CEO Charles Call.

The firm’s upgraded product has been completely re-engineered from the ground up, he said, and recently won an innovation award for new products and technology from R&D Magazine.

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The BioCapture 650 samples air, looking for possible toxic threats like anthrax, plague, smallpox and tularemia. It collects micron and submicron airborne particles, as well as soluble vapors, from indoor or outdoor sites. Technicians responding to an alarm can use the capture tool when they arrive at a site.

The key to the product is its integrated, disposable collector cartridge. It has been improved by its higher flow rate, achieved with a rotating impactor, fluid chamber, fluid lines and sample vial pre-assembled in one cartridge, so the system is immediately ready to use.

“It does about ten times better in concentrating particles out of the air,” than the original product, Call said, “It uses a technology called rotating impaction that has a high-speed fan to sweep particles out of the air, then rinses fan blades to extract particles into the fluid.”

The disposable cartridge eliminates the possibility of contamination and cross-contamination between samples, making it useful for emergency responses by Hazmat, firefighting and law enforcement teams.

“We do a lot of small tech in nearly everything we do, but that’s not the selling feature,” Call said. With injection-molded parts, the product can produce sampling results at a lower cost and with a higher reliability.

He cites three popular uses for the product. First, technicians at the incident can have field-testing equipment, so they can analyze samples on the spot. A second use for the sample is its ability to confirm a previous test. The third is for forensics for evidence.

Beta testing for a new bio-aerosol sensor called AirSentinel is nearly completed, Call said. MesoSystems has built 20 units that are installed in critical infrastructure buildings on both coasts, and in Washington D.C. and New York City. Brand-new technologies are incorporated in several parts of the AirSentinel.

“It is an optical sensor that uses microfluidics for particle capture and size sorting. The optical piece of it uses state-of-the-art ultraviolet (UV) light emitting diodes made by Cree Inc., a world leader in LEDs,” Call said.

Durham, N.C.-based Cree developed these particular LEDs under a Defense Advanced Research Projects Agency (DARPA) contract called the Semiconductor UV Optical Sources (SUVOS) program for developing a nanofabrication-based light source.

The SUVOS LED is a small-niche application for Cree, since the company’s primary market is backlighting LEDs for cell phones, according to Cree company spokesperson, Cindy Merrill.

The AirSentinel is a continuous monitor, much like a smoke alarm, that looks for bioparticles in the air. The device uses optical scanning, so there are no samples or fluids consumed that would drive up costs. The product can be tied into a smoke-alarm system, so it can send an alarm if it detects smoke or bioparticles in the air.

A third product that may be ready for beta testing in October, Call said, involves lab-on-a-chip technology. This multi-tasking chip performs sample preparation and cleanup, label and target isolation and label and readout tasks on one card-sized chip.

“We’re also working on a biosensor technology that is an advanced microfluidics-based immunoassay,” he said.

Call, who was formerly associated with Pacific Northwest National Labs in central Washington, has moved MesoSystems’ corporate headquarters to Albuquerque, N.M. The company employs 25 people, and still does some manufacturing in Richland and Kennewick, Wash., where the firm originated.

Ardesta LLC, the parent company of Small Times Media, is an investor in MesoSystems.

Sept. 9, 2004 – Epoch Biosciences Inc. has agreed to merge into Nanogen Inc., according to a news release.

Nanogen, a San Diego developer of microarrays with integrated electronics and workstations, will offer a price of $2 per Epoch share. Epoch shareholders will receive a number of Nanogen shares based on an exchange ratio determined by dividing the offering price by Nanogen’s issue price at closing.

The merger, subject to stockholder approval and other conditions, is expected to close by year’s end. Nanogen said the deal would expand its reach in clinical lab and research markets.

Epoch, a developer of genomic and molecular diagnostic technologies, will maintain research and development, as well as reagent manufacturing operations in Bothell, Wash. Administrative, marketing and sales departments will move to Nanogen’s San Diego headquarters, the release said.

September 8, 2004 – A slew of earnings updates from chipmakers suggest that the march of sustained strong growth for the industry is nearing an end.

On Sept. 2, Intel chopped its 3Q04 sequential growth projection to 5% from a prior forecast of more than 10%, claiming PC demand is weak, particularly in the consumer retail space. “We don’t sense a building momentum right now,” said Intel CFO Andy Bryant, adding that the company is hoping for a “fairly typical September” to bring third-quarter growth “at the low-end of historical expectations.”

To help burn off inventories–Bryant admitted the company was caught off guard by excess inventories in the PC channel during the second quarter–Intel is lowering wafer starts in fabs, and is closely monitoring PC processor and chip-set demand for the next four or five weeks to determine if it should adjust capital spending plans. “Certainly, I’m not in that frame of mind today, but if it gets worse than I think it will, capital is the place I would go,” Bryant said in a conference call with analysts, and suggested most of the belt-tightening would occur in 200mm fabs, “driving the transition into 300mm factories” and leading-edge processes.” Intel continues to estimate 2004 capital expenditures in a range of $3.6-$4 billion and R&D spending is budgeted at $4.8 billion this year.

Intel is not alone in trimming expectations for 3Q. Texas Instruments Inc., Dallas, TX, has pared its 3Q04 revenue estimates to $3.10-$3.24 billion, below earlier estimates of $3.20-$3.44 billion, due to growing inventory levels as the company’s customers move to shrink their own levels. Semiconductor revenue also was lowered, from $2.78-$2.89 billion to $2.67-$2.79 billion.

Also, National Semiconductor Corp., Santa Clara, CA, posted fiscal 1Q05 revenues of $548 million and a $117.7 million profit, compared with $424.8 million and $29.7 million in 1Q04. Sequentially, revenues dipped by 4% and bookings were down 29%, due to supply-chain inventory corrections in Asia slower-than-anticipated order activity over the summer, according to chairman/president/CEO Brian Halla. National said it expects distributor and customer inventories will continue to be adjusted in 2Q05, resulting in a revenue decline of 8%-10% sequentially.

Taiwan’s two foundry juggernauts, TSMC and UMC, posted another month of record sales in August, year-on-year growth has leveled off, and sequential growth has slowed to a trickle–2.8% for UMC, and 1.1% for UMC.

Not everyone is backing off the line, however. Freescale Semiconductor Inc., Austin, TX, the former chipmaking arm of Motorola, said its 3Q04 sales would be between $1.40-$1.45 billion, roughly in line with analysts’ estimates. Gross margins are expected to be 38%, up from 30.3% a year ago. The company posted sales of $1.23 billion in 3Q03. Freescale also noted a change in its reporting schedule: instead of providing mid-quarter updates, it now will offer the next quarter’s guidance at the time it reports results from the current quarter.

Also, Singapore’s Chartered Semiconductor Manufacturing has reaffirmed its 3Q04 predictions from mid-July: revenues of $255.8 million, an 86% increase from a year ago and flat with 2Q, and a net profit of $9.5 million, a 38% decline sequentially. Approximately 40% of revenues will come from 0.18-micron and below process technologies, and slightly above 15% from 0.13-micron and below. Utilization rates are unchanged from the previous quarter, at about 90%, +/-2%. J. Robert Lineback, Senior Technical Editor, and James Montgomery, News Editor

September 8, 2004 – EV Group, Scharding, Austria, is expanding its operations in North America in response to increased business and customer demand. EV Group Inc., the company’s US subsidiary, will combine its headquarters, Technology Center, and Customer Support Division in the ASU Research Park in Tempe, AZ.

The new facility offers a state-of-the-art Class 10 production cleanroom. An onsite lab will include the company’s entire equipment range for demonstrations, customer training and process development.

In addition to being a tenant in the facility, EV Group has accepted an offer to become a principal partner in the Flexible Display Center, a research project between Arizona State University and the US Army. The company will work closely with all other partners to develop commercial solutions for the flexible display industry.

Along with its expansion in the ASU Research Park, EV Group will move its East Coast operations from Cranston, RI, to the Albany NanoTech facility at the University at Albany-State University of New York. The facility, which uses EVG equipment for nano-science and nano-engineering research, provides a more centralized location for serving customers in the Northeast.

This one-day workshop will feature a variety of materials and equipment suppliers who will present the latest innovations in semiconductor materials and equipment innovative products. Many of the presenters received 2004 Advanced Packaging Awards for innovations in advanced packaging technology. Each supplier will give a short, concise presentation, followed by an open question-and-answer session.

(September 9, 2004) Washington, D.C.&#8212IMAPS will sponsor an optoelectronics device packaging workshop and exhibition from October 11 through 14, 2004, at the Radisson Hotel in Bethlehem, Penn. The event will focus on advances in optoelectronics, opto device packaging and associated technologies.

“Although this package still represents less than 5% of the IC packages assembled world wide it continues to be a very popular choice for many of the new generation devices, especially in the area of RF applications,” stated Paul Smith, Carsem’s director of marketing.

(September 8, 2004) Mountain View, Calif.&#8212The MicroElectronics Packaging and Test Engineering Council (MEPTEC) will host a technical symposium titled “Innovations in Equipment and Materials for Microelectronics Packaging: Complexity Drives Collaboration,” on November 11, 2004 at the Hyatt San Jose in San Jose, Calif.

Sept. 8, 2004 – The Defense Advanced Research Projects Agency (DARPA) has awarded a $9.5-million contract to a team led by Lucent Technologies to develop a MEMS-based system that would enable faster and cheaper fabrication of integrated circuits, according to a news release.

The four-year contract, awarded by the Space and Naval Warfare Systems Center San Diego calls for the team to design and demonstrate spatial light modulators (SLM) for maskless optical lithography equipment. Masks, required in the process of imprinting patterns on semiconductor materials, are especially costly in low-volume applications, the release said.

The nanofabricated SLM technology, developed by Bell Labs, has features as small as 50 nanometers. Potential applications for the technology include homeland security and military communications. Lucent is working with Corning Tropel Corp., DuPont Photo Masks Inc., Lincoln Laboratories and ASML Holding NV.

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Sept. 8, 2004 — The scientific community often focuses on the researchers working with atoms and molecules. But often overlooked are the outside people working to lay the groundwork for this research, those with bottom-up approaches of their own.

One team in particular has built a niche in nanotechnology. McCarthy Building Companies Inc. recently constructed Duffield Hall, a 150,000-square-foot nano facility at Cornell University. The St. Louis-based construction firm also renovated and remodeled a nano center at Rice University, and is working on a bio and nanotech facility at University of California, Berkeley.

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The Cornell contract helped the 140-year-old firm gain know-how in a nascent field about which it knew nothing. McCarthy brought its expertise of an area that’s crucial for nearly every nano lab: clean rooms.

“I just happened to notice that Cornell was planning this project and thought, ‘Maybe we can get something here,'” said Bud Guest, McCarthy’s senior vice president responsible for research and development facilities. “At the time, I didn’t even know what nano was. I don’t think anybody did. But we knew clean rooms.”

McCarthy’s previous experience building rooms with equipment that controls airborne particles, humidity and temperature helped the firm win the right to compete for the Cornell contract. But Guest said the selection process was the most stringent in his company’s history.

McCarthy went through three separate interviews over a three-month period, followed by a 24-hour final exam that began with a 5 p.m. dinner with Cornell’s selection committee.

“Toward the end of dinner, they said, ‘Here’s a list of 40 technical questions we’re going to ask you at 8 a.m. Good night, guys,'” Guest recalled. “It was virtually an all-nighter.”

McCarthy ultimately prevailed in a joint venture with Welliver McGuire Inc., a Montour Falls, N.Y.-based construction firm. The contract included construction as well as managing the installation of the tools.

Guest said McCarthy’s building experience with the likes of Motorola, Intel, Amgen Inc.and the University of California system has translated into nanotech fabs and labs. But a major difference for the latter category is the effort necessary to limit vibration. At Cornell, concrete slabs as much as 3-feet thick separate the lab floor from the rest of the building due to the extreme sensitivity of electron microscopes and other tools.

Overcoming such technical challenges is part of the mission of the Buildings for Advanced Technology (BAT) workshops organized by the National Nanotechnology Initiative (NNI) and other federal research institutes.

As more money flows into nano building projects — especially since last year’s passage of the 21st Century Nanotechnology Research and Development Act — leaders say it’s important to hear the concerns of scientists, architects, engineers, builders and equipment suppliers.

“What we like, certainly, is for all the facilities to be state-of-the-art. We don’t like to have a variety of standards,” said Mike Roco, senior nanotech adviser at the National Science Foundation and NNI architect. “However, at the same time, we like to leave open competition among the companies that are building.”

There is cooperation among players as a nano building boom looms. Omaha, Neb.-based HDR Inc. is an architectural, engineering and consulting firm. Like McCarthy, HDR seeks contracts to manage major nano facility projects. HDR, which co-sponsored the second BAT workshop in January, is currently working on nano centers at University of South Florida and Purdue University.

Although HDR and McCarthy do compete for the total package — bids for designing and building a center — Guest said each firm has its own specialties on the job and will team up if an owner selects an independent designer and builder.

HDR and McCarthy have yet to collaborate on a nano project, but they have worked together on medical centers. They shared a Project of the Year Award from the Design-Build Institute of America for the University of Colorado Hospital.

With three nano projects wrapped up or underway, Guest said McCarthy is pursuing other projects in the budding field. But the firm won’t take on all comers; it recently declined one national laboratory’s invitation to compete in a process that would pick the low bidder.

“They asked us several times, ‘Why won’t you bid?'” he said.

“Two things: One, we don’t want to be a commodity. Secondly, I doubt we could be the low bidder because we know too much. … If the secret to success is to be the low bidder, I don’t think we’d be the low bidder. We don’t think the nanotech facilities lend themselves to the hard-bid process.”

By Shou-Nan Li, Hui-Ya Shih, Jui-Hsiang Cheng, Jung-Nan Hsu, Kuang-Sheng Wang, Industrial Technology Research Institute, Hsinchu, Taiwan, and
Chun-Nan Lin, Winbond Electronics Corp., Hsinchu, Taiwan

The semiconductor industry has taken a leadership role in setting targets for reduced emissions of harmful perfluorocompounds (PFCs) into the earth’s atmosphere. Members of the World Semiconductor Council have voluntarily committed to lowering PFC emissions substantially by 2010. New measurements from advanced abatement systems and manufacturing tools now show the industry could be overstating PFC emissions when using existing Tier 2C Method default values to estimate the global warming potential (GWP) of fabs. A study shows these default values should be revised to accurately reflect improvements in abatement technology and the use of PFCs inside equipment.

Members of the World Semiconductor Council (WSC), including trade groups in the US, Europe, Japan, Korea, and Taiwan, have voluntarily committed to substantially reduce the emissions of perfluorocompounds due to their potential global warming effects. The “PFCs” term used by WSC members covers a range of gas compounds, including perfluoromethane (CF4), perfluoroethane (C2F6), perfluoropropane (C3F8), perfluorocyclobutane (C4F8), trifluoromethane (CHF3), nitrogen trifluoride (NF3) and sulfur hexafluoride (SF6). These PFCs are used for chamber cleaning of chemical vapor deposition (CVD) process tools and for dry etching of wafers. To estimate annual PFC emissions and then to monitor the progress of emission reduction, WSC members unanimously adopted the Tier 2C Method, which is published by the Intergovernmental Panel on Climate Change (IPCC). [1]

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If you have any questions or comments, please contact:
Julie MacShane, Managing Editor, email: [email protected].

The company saw a continuation of the market recovery in electronics manufacturing that started in the first quarter, according to Speedline Technologies President Pierre de Villemejane. “Cell phone and computer production was exceptionally strong, driving higher spending for capital equipment to expand capacity,” he said.

(September 8, 2004) Scotts Valley, Calif.&#8212Carsem, a provider of packaging and test services to the semiconductor industry, announced it will increase its capacity for the MLP (micro leadframe package) family to a total of 155 million units per month. In September 2003, Carsem had a monthly capacity of 50 million in its Malaysian factories. Since then, it has been increased to a current capacity of 90 million, and will be ramped to 135 million by November 2004.