Who needs through-silicon vias?

by Ed Korczynski, Senior Technical Editor

Experts at the recent daylong International Wafer-Level Packaging Conference in San Jose expressed confidence that technology integration can create a manufacturable fab flow using through-silicon vias. But while 3D-WLP is already commercially viable, wire-bonding already can handle up to 16 chips, and two-level connections can be easily flip-chipped. So let’s acknowledge the elephant in the room: besides MEMS and optoelectronics, does anyone really need TSVs for commercial ICs?

Click here for the full posting…

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

One thought on “Who needs through-silicon vias?

Comments are closed.