The Path to Future Interconnects


The Path to Future Interconnects

Date: August 6, 2015 at 1:00 p.m. ET

Free to attend

Length: Approximately one hour

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Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.


jon-candelariaJonathan Candelaria, Director, Interconnect and Packaging Sciences, Semiconductor Research Corporation

Jon Candelaria has over 38 years of experience in the electronics industry in a wide variety of engineering and managerial roles. He was a Distinguished Member of the Technical Staff at Motorola’s Applied Research & Technology Center before joining the SRC in September, 2010 as the Director for Interconnect and Packaging Sciences.

He has over a dozen issued patents and published technical articles, and received the Motorola Patent of the Year Award for a foundational backend processing invention which contributed over $1B to Motorola over the course of its lifetime.

He has been an invited speaker on a wide range of topics and has led or participated in many industrial consortia activities such as the Science Advisory Council for the SRC, the National Optoelectronic Technology Research Task Force, the SIA’s ‘Semiconductor Technology Roadmap for CMOS’, and the ‘International Technology Roadmap for Semiconductors’ (ITRS), etc.

He served as Technical Program Chair and General Chair of the IEEE Electron Devices Society’s flagship conference, the IEDM.

He was the V.P. of Conferences for the IEEE’s Electron Devices Society (EDS), the EDS representative on a joint United Nations-IEEE Humanitarian Challenge advisory committee, and was an Executive Committee member of the local IEEE Computer Society, Waves & Devices, and Laser and Electro Optics Society Chapters in Phoenix, Arizona.

He is currently the North American Technical Program Chair for the International Interconnect Technology Conference (IITC)

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2 thoughts on “The Path to Future Interconnects

  1. Byung Yang


    Could you please send me any video or audio record to my e-mail address since I will be flighting to abroad? Thank you for helping me to know his idea and knowledge on Beol process and trend!

    Byung Yang

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