November 17, 2016 at 1:00 pm ET
Free to attend
Length: Approximately one hour
Moore’s Law scaling can no longer maintain the pace of progress just when we need it most. Data, logic and applications are migrating to the cloud, consumerization of data and the rise of the Internet of Things are placing new demands and they are all occurring at the same time. Difficult challenges in power, performance, latency, bandwidth density, security and cost threaten our ability to maintain the progress that has enabled the growth of information technology. Meeting these challenges will require reduction in power and cost per function by a factor of 104 over the next 15 years while improving performance and decreasing latency. Only a revolution in packaging through Complex 3D-SiP can provide a solution. This will require new tools for design and simulation, test, new packaging architectures, production processes, materials, and equipment. The difficult challenges and potential solutions will be discussed, including critical test issues.
Dr. W. R. “Bill” Bottoms, the holder of a Ph.D. from Tulane University, has an extensive background in academia, venture funding, and in the commercial semiconductor equipment sector. Since founding 3MTS in 1999, Bill Bottoms has provided strategic leadership and vision in keeping with the promise of the 3MTS business model. Dr. Bottom has also served on a number of important government and industry committees and advisory positions. Key posts include chairmanship of the subcommittee of the Technical Advisory Committee of the United States Commerce Department’s Export Control Commission for Semiconductor Equipment and Materials.
Sponsored by Astronics