Yearly Archives: 2016

Researchers discovered a procedure to restore defective graphene oxide structures that cause the material to display low carrier mobility. By applying a high-temperature reduction treatment in an ethanol environment, defective structures were restored, leading to the formation of a highly crystalline graphene film with excellent band-like transport. These findings are expected to come into use in scalable production techniques of highly crystalline graphene films.

Transmission electron microscope images observed from the reduced graphene oxide films prepared by ethanol treatment at (a) 900ºC and (b) 1100ºC. For the high temperature treatment, the periodic bright spots are observed in the reduced graphene oxide films. This means that the crystallinity of the reduced graphene oxide is efficiently improved by high temperature treatment in ethanol environment. Credit: Osaka University

Transmission electron microscope images observed from the reduced graphene oxide films prepared by ethanol treatment at (a) 900ºC and (b) 1100ºC. For the high temperature treatment, the periodic bright spots are observed in the reduced graphene oxide films. This means that the crystallinity of the reduced graphene oxide is efficiently improved by high temperature treatment in ethanol environment. Credit: Osaka University

Graphene is a material with excellent electric conductivity, mechanical strength, chemical stability, and a large surface area. Its structure consists of a one-atom-thick layer of carbon atoms. Due to its positive attributes, research on its synthesis and application to electronic devices is being conducted around the world. While it is possible to create graphene from graphene oxide (GO), a material produced by chemical exfoliation from graphite through oxidative treatment, this treatment causes defective structures and the existence of oxygen-containing groups, causing GO to display low conducting properties. So far, carrier mobility, the basic indicator with which transistor performance is expressed, remained at a few cm2/Vs at most. A group of researchers led by Ryota Negishi, assistant professor, and Yoshihiro Kobayashi, professor, Graduate School of Engineering, Osaka University; Masashi Akabori, associate professor, Japan Advanced Institute of Science and Technology; Takahiro Ito, associate professor, Graduate School of Engineering, Nagoya University; and Yoshio Watanabe, Vice Director, Aichi Synchrotron Radiation Center, have developed a reduction treatment through which the crystallinity of GO was drastically improved.

The researchers coated a substrate with 1-3 extremely thin layers of GO and added a small amount of ethanol to the up to 1100°C high temperature reduction process. The addition of the carbon-based ethanol gas led to the effective restoration of the defective graphene structure. For the first time in the world, this group managed to observe a band-like transport reflecting the intrinsic electric transport properties in chemically reduced GO films. Band-like transport is a conduction mechanism in which the carriers use the periodic electric mechanisms in solid crystals as a transmission wave. The observed band transport in this study achieved a carrier mobility of ~210 cm2/Vs, currently the highest level observed in chemically reduced GO films.

The successful creation of thin graphene films achieved through the above reduction method has opened up the possibility of their application in a diverse set of electronic devices and sensors. The findings of this research group form a milestone in the development of scalable materials that utilize graphene’s excellent physical properties.

Silego Technology Inc. today announced that John Teegen has been named its Chief Executive Officer and President, and a member of its Board of Directors. In addition, Ilbok Lee, who previously served as its Chief Executive Officer and Chairman of the Board, will continue his position on the Board and will serve as Executive Chairman where he will focus on technology roadmaps, intellectual property development and investment opportunities.

“Silego is entering its next phase of growth as an established leader in the emerging Configurable Mixed-signal IC (CMIC) market. It’s with great pleasure that we appoint Teegen to lead this effort as he was a key part of our growth story and product strategy since joining Silego as VP Sales in 2010 and then serving as President in 2015,” said Lee, a 40-year semiconductor industry veteran and founder of two successful IC startups. “Silego is transforming the way engineers design mixed-signal circuits and under Teegen’s leadership we will continue our strategy of growing our customer base as well as moving our products into new markets.”

“Silego has created a new class of ICs that we believe provides our customers with tremendous value in an area that has previously only been served by discrete component implementations,” says Teegen. “In addition to our initial markets of notebook computers and tablets, our CMIC platform is gaining momentum in mobile and wearables markets where design flexibility, time-to-market, lower power and smaller board space are critical. I’m extremely honored to lead Silego and help to expand its innovative product line into the future.”

Teegen has more than 30 years of experience in the semiconductor industry. Before joining Silego, Teegen held executive management positions at Kovio Inc., NeoPhotonics Corporation, MMC Networks Inc. (AMCC), Intellon Corporation (QCOM), VLSI Technology, Inc. (NXP) and Advanced Micro Devices, where he began his career. He was the VP of Sales at MMC Networks during its 1997 IPO and VP of Business Development during its acquisition by AMCC in 2000. Teegen was VP of Sales Intellon and NeoPhotonics prior to their respective IPOs. He earned his bachelors of science degree in electrical engineering (B.S.E.E.) from the University of Florida where he is also an ECE External Advisory Board member.

A leading South Korean research university has successfully integrated two Advanced Vacuum plasma processing systems from Plasma-Therm into its nanotechnology fabrication lab, which supports multiple users engaged in wide-ranging nanotechnology research.

Seoul National University lab researchers recently installed two Apex SLR systems with the well-proven inductively coupled plasma (ICP) source technology from Plasma-Therm. One system is configured for dry etching, and the second system is configured for high-density plasma chemical vapor deposition (HDPCVD).

Jong-Seung Park, Team Manager/Fab. Operations of Seoul National University, said the university’s cleanroom facility serves many users who are employing the Apex SLR® systems’ etch and deposition capabilities.

“We are pleased to provide a good reference for these systems and their support,” Park said. “Both systems operate as we expected and deliver reproducible results over the last more than 16 months. The systems are reliable and we are pleased to be a customer of Plasma-Therm.”

Park said the Apex SLR ICP system utilizes chlorine-based chemistries for etching various materials, with an emphasis on aluminum interconnects. The Apex SLR® HDPCVD system has been employed for a wide range of silicon oxide and silicon nitride deposition processes, such as trench or gap filling for device fabrication.

Dr. David Lishan, Director, Technical Marketing for Plasma-Therm, said that Apex SLR systems are ideally suited for corporate R&D and academic research settings. “The Apex SLR, with its very strong and successful processing history, excellent uniformity and reproducibility, has proven highly productive in research environments.” Dr. Lishan continued, “The ability for facilities like SNU’s to task Apex SLR systems and quickly achieve process specs for multiple users are big reasons for selection of Apex SLR over products that are less capable and more expensive.”

Advanced Vacuum Apex SLR systems are highly versatile, small-footprint, field-proven tools for all plasma processing applications. Apex SLR ICP is capable of etching a wide range of materials for semiconductor devices and other types of nanotechnology. Apex SLR HDPCVD performs deposition of high-quality thin films at relatively low temperatures for applications such as optical coatings, semiconductor device passivation layers, and other nano-electronic fabrication processes with limited thermal budgets.

By Yann Guillou, SEMI Europe

Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.  Over 200 attendees, including the industry’s most influential executives and decision makers, are expected to discuss challenges, solutions, and critical trends impacting the sector.  The full program line-up for SEMI’s MEMS flagship event is available online.  Have a look and register now.

The event’s keynote presentation will be delivered by Udo Gomez, CTO of Bosch Sensortec, headquartered just a few kilometers away from the conference venue.  During his talk titled, “Smart Connected MEMS Sensors – Enabler for the IoT,” with the perspective of a sensor systems integrator, Gomez will discuss how different application domains overlap, the key drivers of connectivity and digitalization, and what is missing with respect to bridging future technologies.

One of the MEMS “Titans,” Benedetto Vigna, EVP and GM of STMicroelectronics, will deliver a keynote about “MEMS Sensors and Actuators – Opportunities and Challenges” and review their implication on ST focus areas such as Smart Driving and the Internet of Things.  It will be exciting to see what Vigna will share with the audience and what details might support what Peter Clarke recently called the “ST resurgence”.

Representing one of the largest growing companies of 2015, Robert Aigner, senior director from Qorvo, will keynote and present the success story behind BAW filters in his talk called “BAW and the “Edge of Tomorrow” in Wireless Communication: Innovate, Ramp. Repeat.” BAW filters had been termed “niche play,” but are now identified as key enablers for smartphones with multibillions of units expected to ship in 2016.

Addressing a key aspect of the quadriptych “power, performance, area and cost” equation, Adrian Arcedera, VP, AMKOR, will in his keynote talk discuss “Sensor in Package – Standard Package Platform for Sensor Fusion and IoT”. To offer cost competitive solutions without compromising performance, he will explain what standardization efforts are needed in packaging, assembly, test, and detail the solution proposed by AMKOR. He may also take the opportunity to provide additional info about the brand new MEMS plant of AMKOR in China.

In addition to these keynote talks, a top notch speaker line-up will be presented to attendees. Market analysts will share the results of their latest reports featuring IHS, Yole Developpement, and Roland Berger. Foundries such as GLOBALFOUNDRIES and Teledyne DALSA will present their strategies. The hyper active company in M&A, ams AG, will talk about MEMS and optical sensor in consumer and wearable electronics.

Intel will join the stage, addressing wearables in addition to providing a review of the key enabling technologies impacting MEMS today. NXP and Bosch will discuss sensors for automotive.  MEMS and CMOS integration, from a process and design perspective, will be addressed by Fraunhofer IPMS and Coventor and Invensas will deliver a presentation from a technological aspect.  Last, but not least, we are very excited to introduce great and promising start-ups Innoluce, USound, Polight and Enerbee. Attendees can look forward to hearing their pitches and learning about their innovative ideas.

Exhibitor space has sold out, but you can visit our website to see who will be exhibiting at the European MEMS Summit in Stuttgart.  Connect to the leaders and industry professionals that will help “Make Every Market Smarter” in the MEMS and Sensor value chain.  Register now, and be part of this exciting event in Stuttgart!

Please follow: SEMI Europe LinkedIn and SEMI Europe Twitter; also Global SEMI LinkedIn and SEMI Twitter.

North America-based manufacturers of semiconductor equipment posted $1.79 billion in orders worldwide in July 2016 (three-month average basis) and a book-to-bill ratio of 1.05, according to the July Equipment Market Data Subscription (EMDS) Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.05 means that $105 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in July 2016 was $1.79 billion. The bookings figure is 4.7 percent higher than the final June 2016 level of $1.71 billion, and is 13.1 percent higher than the July 2015 order level of $1.59 billion.

The three-month average of worldwide billings in July 2016 was $1.71 billion. The billings figure is 0.6 percent lower than the final June 2016 level of $1.72 billion, and is 9.6 percent higher than the July 2015 billings level of $1.56 billion.

“Monthly bookings have exceeded $1.7 billion for the past three months with monthly billings trending in a similar manner,” said Denny McGuirk, president and CEO of SEMI. “Recent earnings announcements have indicated that strong purchasing activity by China and 3D NAND producers will continue in the near-term.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
February 2016

$1,204.4

$1,262.0

1.05
March 2016

$1,197.6

$1,379.2

1.15
April 2016

$1,460.2

$1,595.4

1.09
May 2016

$1,601.5

$1,750.5

1.09
June 2016 (final)

$1,715.2

$1,714.3

1.00
July 2016 (prelim)

$1,705.1

$1,794.7

1.05

Source: SEMI (www.semi.org), August 2016

Pradeep Lall, John and Anne MacFarlane professor of mechanical engineering, has received a top award from the National Science Foundation’s Industry/University Cooperative Research Centers program.

Lall received the 2016 Alexander Schwarzkopf Prize for Technological Innovation for his work as director of Auburn University’s Center for Advanced Vehicle and Extreme Environment Electronics, or CAVE3, which partners with industry, government and academic agencies to address major technological challenges through precompetitive research on automotive and harsh environment electronics. Precompetitive research allows the center to address these challenges before the technologies become commercialized.

“This award is reaffirmation of Dr. Lall’s national reputation and recognition of his seminal contributions to the field of mechanical engineering,” said Christopher B. Roberts, dean of the Samuel Ginn College of Engineering.

Lall’s research focuses on the development of methods for assuring survivability of electronics to high shock forces, vibration and extreme temperatures. He is best known for his research in the areas of reliability and prognostics for electronic systems operating in harsh environments.

“Electronic systems have taken an increasingly important role in automotive design and operation,” Lall said. “Traditional automotive electronics at one time consisted of climate control and entertainment systems. Roll the clock forward to the present day and automotive electronics have expanded to include driving assists such as antilock braking systems, traction control systems, adaptive cruise control, lane departure warning systems and more. Failure of one of these systems is no longer an inconvenience; it may be critical to the safe operation of the vehicle.”

Founded in 1999 as the Center for Advanced Vehicle Electronics, CAVE3 has over the years expanded its expertise to include extreme environment electronics. Lall has been the center’s director since 2008, following his appointment as associate director in 2004. Lall also directs Auburn’s Harsh Environments Node of the NextFlex Manufacturing Institute, part of a national manufacturing effort on harsh environment electronics led by the U.S. Department of Defense.

Lall joined the Auburn faculty in 2002 after a distinguished industry career at Motorola, where he worked on the development and manufacture of wireless products such as cellphones and two-way radios.

“Dr. Lall’s recognition with the Alex Schwarzkopf Prize is evidence of the societal and transformational impact that Auburn University is making on automotive and harsh environment technologies in everyday life,” said John Mason, Auburn’s vice president for research and economic development.

NSF’s cooperative research centers program was established in 1973 by Schwarzkopf to develop long-term research partnerships among industry, academe and government in areas of mutual interest. The Alexander Schwarzkopf Prize for Technological Innovation has been presented annually since 2003 to an individual or team at a member institution whose research makes an exemplary contribution to technology innovation. More than 100 universities and nearly a thousand researchers are members.

2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages. Yole Développement (Yole) is analyzing the current market and technologies trends and offers you to discover these results within a new report entitled Fan-Out: Technologies & Market Trends 2016.

fowlp_history_yole_aug2016_280x433

TSMC investment in FO WLP and development of InFO changed the WLP landscape. Following high volume adoption of InFO and further development of eWLB technology, a wave of new players and FO WLP technologies may enter the market. TSMC’s FO WLP solution called InFO will be used to package the Apple A10 application processor, implemented in the new iPhone 7 series. The success of FO packaging platforms is so undeniable today. What will be the status of the market tomorrow? What are the next steps of the leading FO players? Which technology will be the winning solutions? Yole’s analysts tell the story.

“Production starts in 2016 and represents a big change in the Fan-Out industry for several reasons”, confirms Jérôme Azémar, Market & Technology Analyst, Advanced Packaging & Manufacturing at Yole. And he explains:

  • First of all, in terms of volume, capturing the Apple processor market is a big asset for Fan-Out technology. iPhone 7 phones are expected to be sold in more than 200 million units.
  • In terms of technology capability it is also a major turn: processors require thousands of connections while the FO market was essentially focused on limited IO count applications so far.
  • Eventually, the potential for market spread is very high: the Apple brand brings more interest to the FO platform.

According to Yole’s advanced packaging & semiconductor manufacturing team, the market will actually be split in two types:

  • The “core” market of FO, including single die applications such as Baseband, Power management, RF transceivers, etc. This is the main pool for FO WLP solutions and will keep growing.
  • The “high-density” FO market, started by Apple APE that will include larger IO count applications such as processors, memories, etc. This market is more uncertain and will require new integration solutions and high performing FO packages but has a very high potential.

Apart from TSMC, STATS ChipPAC is willing to make further investments powered by JCET, ASE extends its partnership with Deca Technologies while Amkor, SPIL and Powertech are in development phase eyeing future production. Samsung is seemingly lagging behind and is considering its options to raise competitiveness. “With such a high potential for the high-density FO and solid growth of the core FO, the supply chain is also expected to evolve with a considerable amount of investment in Fan-Out packaging capabilities,” said Jérôme Azemar from Yole. Several players are already offering FO WLP while many others are developing their competitive Fan-Out platforms to enter the Fan-Out landscape and enlarge their portfolio.

What are the next steps of the leading Fan-Out players? Yole’s FO report analyzes in detail the strategies and offers of main players involved. It describes potential success scenarios for all of them. It also helps to define what FO Packaging is and what are the different products and platforms, player per player.

IC Insights released its August Update to the 2016 McClean Report earlier this month.  This Update included an update of the semiconductor industry capital spending forecast, a look at the top-25 semiconductor suppliers for 1H16, including a forecast for the full year ranking, and Part 1 of an extensive analysis of the IC foundry industry (the ranking of the top-10 pure-play foundries is covered in this research bulletin).

In 2014, the pure-play IC foundry market registered a strong 17% increase, the largest increase since 2010 and eight points greater than the 9% increase in the worldwide IC market.  In 2015, the pure-play foundry market showed a 6% increase, about one-third the rate of growth in the previous year, but seven points higher than the total IC market growth rate of -1%.  For 2016, the pure-play foundry market is expected to increase by 9% and greatly outperform the growth rate of total IC market, which is forecast to drop by 2% this year.

Figure 1 shows that the top 10 pure-play foundries are expected to hold 95% of the total pure-play foundry market this year.  This year, the “Big 4” pure-play foundries (i.e., TSMC, GlobalFoundries, UMC, and SMIC) are forecast to hold an imposing 84% share of the total worldwide pure-play IC foundry market.  As shown, TSMC is expected to hold a 58% marketshare in 2016, down one point from 2015, as its sales are forecast to increase by $2.1 billion this year, up from a $1.5 billion increase in 2015.  GlobalFoundries, UMC, and SMIC’s combined share is expected to be 26% this year, the same as in 2015.

The two top-10 pure-play foundry companies that are forecast to display the highest growth rates this year are Israel-based TowerJazz, which is expected to edge-out Powerchip for the 5th spot in the pure-play foundry ranking in 2016, and China-based SMIC, with 30% and 27% sales increases, respectively. TowerJazz and SMIC have been on a very strong growth curve over the past few years.  TowerJazz is expected to grow from $505 million in sales in 2013 to $1,245 million in 2016 (a 35% CAGR) while SMIC is forecast to more than double its revenue from 2011 ($1,220 million) to 2016 ($2,850 million) and register a 19% CAGR over this five-year timeperiod.

Figure 1

Figure 1

Eight of the top-10 pure-play foundries listed in Figure 1 are based in the Asia-Pacific region.  Israel-based TowerJazz, and U.S.-headquartered GlobalFoundries are the only non-Asia-Pacific companies in the top-10 group.  While LFoundry is currently headquartered in Avezzano, Italy, China-based SMIC agreed in 2Q16 to purchase 70% of the company for approximately $55 million.  Since LFoundry has an installed capacity of 40K 200mm wafers/month, the acquisition of a controlling interest in the company essentially serves to immediately expand SMIC’s capacity by 13% this year.

Although SMIC is forecast to register strong sales growth of 27% this year, Chinese foundries, in total, are expected to hold only 8.2% of the pure-play foundry market in 2016, down 5.1 points from the peak share of 13.3% reached in 2006 and 2007.  IC Insights believes that the total Chinese company share of the pure-play foundry market will increase through 2020, as the China-based foundries take advantage of the huge amount of government and private investment that will be flowing into the Chinese semiconductor market infrastructure over the next five years.

Microsemi Corporation (Nasdaq:  MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it is renewing its current 50,000 euros scholarship program for University of Limerick engineering students living in County Clare, where the company has its European headquarters in Ennis, Ireland. In addition, the company announced its new “Microsemi Women in Engineering” scholarship and first award recipient.

Microsemi initially launched its 50,000 euros scholarship program with the University of Limerick in August 2012 as part of the company’s 20 year anniversary of operations in Ireland. Scholarships are awarded to a first-year engineering student from County Clare to the value of 3,000 euros per academic year, or 12,000 euros per student. The original 50,000 euros were awarded to a student for each of the four academic years (2012/2013, 2013/2014, 2014/2015 and 2015/2016), and now the company will grant the same scholarships to four new engineering students each December for four years beginning December 2016. Winners are selected objectively via the students’ scores on the Leaving Certificate, a national examination students complete at the end of secondary school.

“We are pleased to announce the continuation of our 50,000 euros scholarship program, as this introduces our company to some of the brightest talent in the region while supporting their academic achievements in engineering,” said Jim Aralis, chief technology officer and vice president of advanced development at Microsemi. “Leveraging our longstanding relationship with the University of Limerick, engineering students are exposed to internships, hands-on education and coursework which are extremely relevant to Microsemi’s business, products and technologies. Our scholarship program is both an investment in the future of our company and the success of our Clare community’s most deserving youth.”

In conjunction with the new 50,000 euros scholarship program, the company also announced its new “Microsemi Women in Engineering” scholarship, a one-time 2,000 euros award which will be presented to Eimear O’Sullivan in late August 2016. O’Sullivan will graduate from the University of Limerick with a Bachelor of Engineering in Electronic and Computer Engineering degree, with a First Class Honours. Microsemi’s new award is given to the highest performing graduating female student registered in the Bachelor of Engineering in Electronic and Computer Engineering, Bachelor of Engineering in Design and Manufacture, or Bachelor of Engineering in Mechanical Engineering courses at the University of Limerick.

“Expanding our support for the specific achievements of our female students here in our community reflects Microsemi’s ongoing commitment to diversity and to securing top talent for our company,” said Siobhan Dolan Clancy, vice president and general manager of Microsemi’s Discrete Products Group. “We congratulate Eimear for achieving such an impressive level of engineering education.”

The University of Limerick and Microsemi have worked together for decades to ensure top-tier engineering resources are available to all students, offering real-world training and education to prepare them for in-demand technology careers. The four recipients of Microsemi’s initial scholarships have each completed an internship or summer employment with Microsemi in one of its three Ireland facilities, reflecting the strong support system the institutions have developed together.

“The University is delighted with this new commitment from Microsemi, which not only rewards excellence in engineering generally, but also further strengthens the university’s commitment to gender equality through its ‘Women in Engineering’ prize,” said Professor Edmond Magner, dean of the Faculty of Engineering at the University of Limerick.

In addition, Laurence Egan, the first recipient of the Microsemi Scholarship in 2012, has just been announced as a joint winner of the Gold Medal from the University of Limerick. The Gold Medal is awarded annually to an undergraduate student at the university graduating with the highest overall Quality Credit Average (QCA) result in his or her final year of study and signifies the highest level of academic achievement.

Microsemi established its presence in Ireland in 1992 through the acquisition of a facility in Ennis, Co. Clare and in 2012 the company named the Ennis facility as its European headquarters. Over the past several years, Microsemi has made a significant investment in its Ennis operations and now employs 270 people, making it one of the largest employers in the area. Microsemi’s annual spend in Ireland is in excess of $20 million annually and it continues to recruit engineers and other technical professionals.

Aemulus, a developer of automated test equipment (ATE) solutions, and Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator), announce their strategic partnership in the development of a new microwave frequency tester. Building on the success of Aemulus’s Amoeba AMB7600 RF tester, this next-generation test solution will extend its support into microwave frequency bands and enable more complex testing.

“This Aemulus microwave tester is the latest project in a series of successful collaborations with Peregrine Semiconductor,” says Sang Beng Ng, CEO of Aemulus Corporation. “Our two-year relationship has been an exciting journey as two agile industry leaders move the needle forward in microwave testing. This new tester will not only contribute to growth in test and measurement, but I foresee many opportunities flowing in from other markets with high frequency demands, such as automotive, radar and 5G wireless. With this strategic partnership, we look forward to duplicating the success of previous collaborative projects.”

For this new tester, the Aemulus Amoeba AMB7600 will be upgraded with key peripheral modules to expand into microwave bands X, Ku and Ka. The AMB7600 is the world’s first true multi-site, multi-instance RF tester, and it supports RF, digital and analog testing. While the AMB7600 addresses RF front-end devices, the new tester will enable more complex testing, such as the rigorous testing needs of radar products and mixers. Currently in design development, the new tester will be integrated into Peregrine’s test infrastructure in fall 2016 and will have full implementation by spring 2017.

“As the market demand for high frequency products increases, Peregrine has responded with a robust high frequency product portfolio and has set new records for SOI at microwave frequencies,” says Carl Tulberg, principal engineer, NPI operations at Peregrine Semiconductor. “But this innovation must be supported by a sophisticated test infrastructure and that boils down to the right test equipment. This Aemulus partnership aligns with our product roadmap and ensures we meet our microwave test equipment needs today and in the future. It also highlights Peregrine’s focus and investment in high frequency product development.”

Debunking the industry’s perceived boundaries of RF SOI technology, Peregrine Semiconductor’s high frequency portfolio includes RF switches, an image-reject mixer and monolithic phase and amplitude controllers (MPACs). It is Peregrine’s UltraCMOS technology platform that enables the company to reach these high frequencies without compromising performance or reliability.