09/20/2017  Sales of ICs built using <40nm process technology forecast to rise 18% at pure-play foundries.

09/19/2017  Learn all about Monolithic 3D at IEEE S3S.

09/15/2017  Flex Logix Technologies, Inc., a supplier of embedded FPGA IP and software, today announced it has won the TSMC Open Innovation Platform's Partner of the Year Award 2017 in the category of New IP for its EFLX embedded FPGA IP product.

09/13/2017  This is the first stage in beginning FD-SOI production in Singapore and providing multi-site FD-SOI substrate sourcing to the global semiconductor market.

09/13/2017  Cadence Design Systems, Inc. today announced new capabilities that complete its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

09/05/2017  Flex Logix Technologies, Inc., the supplier of embedded FPGA IP and software, today announced that it has joined the TSMC IP Alliance Program included in TSMC's Open Innovation Platform.

09/05/2017  STMicroelectronics (NYSE: STM) has announced the integration of its contactless NFC technology with MediaTek's mobile platforms.

09/01/2017  There have been media reports speculating that Toshiba will make a decision on Aug 31 at Toshiba’s Board of Directors meeting.

09/01/2017  A dozen performer teams with DARPA’s CHIPS program convene to kick off an ambitious push for an era of versatile, plug-and-play "chiplets."

08/28/2017  The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces the 2018 event will be held at THE COSMOPOLITAN of LAS VEGAS on May 20-23.

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

08/18/2017  Global DRAM revenue reached a new historical high in the second quarter of 2017, according to DRAMeXchange.

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

08/15/2017  Topping the chart of fastest-growing products is DRAM, which comes as no surprise given the strong rise of average selling prices in this segment throughout the first half of 2017.

08/14/2017  The increase in vacuum process intensity of the semiconductor industry means that by 2022, the market for vacuum subsystems could be up to 62 percent higher than today’s value of $1.9 billion.

08/09/2017  Samsung Electronics Co., Ltd. has announced new V-NAND (Vertical NAND) memory solutions and technology that will address the pressing requirements of next-generation data processing and storage systems.

08/09/2017  GLOBALFOUNDRIES today announced that it has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs).

08/08/2017  Toshiba America Electronic Components, Inc. (TAEC) announces the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH to deliver better transfer speeds and power efficiency.

08/08/2017  This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.

07/27/2017  As 3D NAND becomes the mainstream technology, its challenging roadmap poses opportunities for continued innovation.