05/05/2016  Tessera Technologies, Inc. announced today that its wholly owned subsidiary Invensas Corporation signed a new technology license and development agreement with Advanced Semiconductor Engineering, Inc.

04/20/2016  Program unveiled for 2016 Symposia on VLSI Technology & Circuits – includes short courses, focus sessions, and panel discussions on "Inflections for a Smart Society" theme.

04/19/2016  Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc., announced today that Sandia National Laboratories signed a new license agreement for ZiBond and Direct Bond Interconnect (DBI) technologies.

04/14/2016  To overcome the current market and technology constraints taking place today within the semiconductor industry, new advanced packaging technologies have been developed by industrial companies.

04/12/2016  Leti, an institute of CEA Tech, today announced the continuation of its collaboration with Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, to develop CoolCube.

04/08/2016  The flip chip technology market is driven by factors such as increasing demand for miniaturization and high performance in electronic devices, and strong penetration in consumer electronics sector.

04/07/2016  Rudolph Technologies, Inc. today announced the availability of new, high-speed 3D metrology on its flagship NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects.

03/29/2016  Texas Instruments Incorporated (TI) announced that Devan Iyer has been elected vice president of the company.

03/25/2016  A look into how the silicide process has evolved over the years, trying to cope with the progress in scaling technology and why it could no longer be of service to finFET devices.

03/25/2016  Amkor Technology Inc. announced it has shipped 700 million RF and front-end advanced system-in-package (SiP) modules for mobile device applications.

03/16/2016  ARM and TSMC announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute SoCs.

02/25/2016  What’s the single area that is being most disrupted by emergent technologies like the Internet of Things (or the Internet of Vehicles) and Silicon Photonics? We think it’s packaging.

02/23/2016  The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2016) will be held May 16-19 in Saratoga Springs, New York.

02/12/2016  University of Washington scientists have successfully combined two different ultra thin semiconductors to make a new two-dimensional heterostructure with potential uses in clean energy and optically-active electronics.

02/11/2016  EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies.

02/11/2016  The FinFET technology market is expected to grow from $4.91 billion USD in 2015 to $35.12 billion by 2022, at a compound annual growth rate (CAGR) of 26.2% between 2016 and 2022.

02/10/2016  SEMI announced today the launch of the European Semiconductor integrated Packaging and Test (ESiPAT) Special Interest Group.

02/08/2016  A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.

01/28/2016  Technavio analysts forecast the global semiconductor packaging and assembly equipment market to post a CAGR of 4.7% by 2020, according to their latest report.

01/27/2016  Samsung Electronics and Apple remained the top semiconductor buyers in 2015, representing 17.7 percent of the market, according to Gartner, Inc.