01/15/2016  Will work with Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies using direct Cu-Cu bonding

01/14/2016  SEMI announced the recipients of the 2015 SEMI Awards for the Americas.

01/13/2016  The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry.

12/21/2015  At the 12th annual 3D ASIP [Architectures for Semiconductor Interconnect and Packaging] Conference, sponsored by RTI Int, in Redwood City CA last week, Professor Mitsumasa Koyanagi of Tohoku University and Dr. Peter Ramm of Fraunhofer EMFT were the conference's first recipients of the “3DIC Pioneer Award”.

12/18/2015  SPTS Technologies has supplied CEA-Leti, one of Europe’s largest micro- and nanotechnologies research institutes, with its vapor HF etch release systems for 300mm microelectromechanical systems (MEMS) on CMOS development.

12/15/2015  The $18 billion semiconductor packaging materials will undergo steady single-digit unit volume growth for many material segments through 2019, including laminate substrates, IC leadframes, underfill, and copper wire.

12/14/2015  After deflated 2015, 3D leads the way.

12/11/2015  SEMI this week announced details about the fourth annual European 3D Summit.

12/08/2015  It is possible to fabricate copper pillars more than 100?m in height, with aspect ratios up to 6:1, using advanced packaging stepper lithography in conjunction with electroplating.

12/08/2015  Subtleties in thicknesses between the alternating Cu metal and dielectric layers within a build-up substrate can impact BLR performance.

12/07/2015  Market projected to grow by 0.2 percent in 2015, 1.4 percent in 2016, and 3.1 percent in 2017.

12/03/2015  Advanced packaging will reach 44% of packaging services and a revenue of US$ 30 billion by 2020.

11/17/2015  Is there any question that TCB is real and will be the next big bonding technology? The focus this month is more on this very important new assembly process from Intel and ASM.

11/16/2015  Researchers from RMIT University in Melbourne have helped crack the code to ultra-secure telecommunications of the future in an international research project that could also expedite the advent of quantum computing.

11/11/2015  Ultratech, Inc. today introduced the Superfast 4G+ in-line, 3D topography inspection system.

11/03/2015  SEMI announced today that the deadline for presenters to submit an abstract for the 27th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is November 2.

10/30/2015  Ziptronix, Inc. announced it has entered into a development agreement with Fraunhofer IZM-ASSID.

10/22/2015  Two years after the launch of the PICS project , three European SMEs, IPDiA, Picosun, and SENTECH Instruments along with CEA-Leti and Fraunhofer IPMS-CNT announce the major technological results achieved.

10/21/2015  Lam Research Corporation (LRCX) and KLA-Tencor Corporation (KLAC) announced that they have entered into a definitive agreement for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.

10/06/2015  Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.