03/21/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc. and Benjamin S. Louie of Zeno Semiconductor blog about dimensional scaling as it relates to EUV and future per transistor device cost.

03/18/2013 

FlipChip International (FCI), a developer of flip chip bumping, Wafer Level and embedded die packaging and EZconn Czech a.s. announced a partnership agreement today.

03/13/2013 

Foundry to use wafers for 3D IC and advanced packaging volume production applications.

03/12/2013 

Tokyo-based Asahi Glass Co., Ltd. and nMode Solutions Inc. of Tucson, Arizona, have invested $2.1 million to co-found a subsidiary business, Triton Micro Technologies , to develop via-fill technology for interposers, enabling next-generation semiconductor packaging solutions using ultra-thin glass.

03/04/2013 

Flip-Chip is big on value: in 2012, it was a $20B market, making it the biggest market in the middle-end area, and Yole Développement expects it to continue growing at a 9% clip, ultimately reaching $35 billion by 2018.

02/20/2013 

Researchers at North Carolina State University have developed a new type of nanoscale structure that resembles a “nano-shish-kebab,” consisting of multiple two-dimensional nanosheets that appear to be impaled upon a one-dimensional nanowire.

02/18/2013 

TechNavio's analysts forecast the global 3D IC market to grow at a CAGR of 19.7 percent over the period 2012-2016. However, the thermal conductivity issues could pose a challenge to the growth of this market.

02/18/2013 

Subcommittee chair Stefan Rusu of Intel in Santa Clara, CA will present on trends in high-performance digital. The relentless march of process technology, he says, brings more integration and performance.

02/11/2013 

Roland Thomas, subcommittee chair of ISSCC, writes of the substantial growth and future in key areas of technology.

02/05/2013 

Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.

02/05/2013 

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.

01/30/2013 

STATS ChipPAC and UMC announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.

01/30/2013 

Renesas and J-Devices signed a memorandum of understanding regarding the transfer of the semiconductor back-end production business of three facilities operated by Renesas’ wholly owned manufacturing subsidiaries

01/28/2013 

Zvi Or-Bach, President & CEO of MonolithIC 3D Inc., blogs about the evolution of 3D technology seen at the International Electron Devices Meeting.  

01/24/2013 

Imec and PVA Tepla say they have achieved void detection in through-silicon vias at wafer level, after TSV copper plating, thanks to a nondestructive high-frequency scanning acoustic microscopy (SAM) technique.

01/24/2013  Looking at 2014, we see challenges and innovations in both the front-end semiconductor and 3D TSV markets.

01/18/2013 

Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking services and test to customers.

01/03/2013 

In semiconductor manufacturing, 450mm is the next big opportunity. Issues of economic scale and complexity will force fab designers, OEMs and process integrators to investigate all open avenues in the search for solutions to the huge challenges that accompany 450mm.

01/03/2013 

80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.

01/03/2013 

In order to maintain profitability manufacturers must increase the productivity and return from their R&D investments.