05/30/2018  Without any doubt, the advanced packaging industry is on the move. Emerging applications are bringing many new challenges. Packaging experts from all over the world are deeply involved in the development of innovative solutions to answer to the market demand dominated by megatrends.

05/29/2018  TowerJazz, the global specialty foundry leader, and Gpixel, Inc., a fast-growing CMOS image sensor (CIS) provider focusing on professional applications, announced today that Gpixel's GMAX0505.

05/25/2018  The global substrate-like PCB market will grow at a CAGR of over 7% during the forecast period, according to Technavio analysts.

05/24/2018  Microsemi Corporation (Nasdaq: MSCC), a provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it will be expanding its Silicon Carbide (SiC) MOSFET and SiC diode product portfolios early next quarter, including samples of its next-generation 1200-volt (V), 25 mOhm and 80 mOhm SiC MOSFET devices.

05/23/2018  Veeco Instruments Inc. announced that Lumentum Holdings Inc. has ordered the Veeco K475i™Arsenide/Phosphide (As/P) Metal Organic Chemical Vapor Deposition (MOCVD) System for production of its advanced semiconductor components.

05/22/2018  Memory devices employ a wide range of packaging technology from wire-bond leadframe and BGA to TSV.

05/21/2018  Micron Technology, Inc. (Nasdaq:MU), and Intel Corporation today announced production and shipment of the industry's first 4bits/cell 3D NAND technology.

05/18/2018  The first quarter of this year was very strong globally, with growth across the entire electronics supply chain.

05/17/2018  New Hampshire company specializes in high-end FPGA computing platforms designed to improve performance and time-to-revenue for OEMs.

05/15/2018  Presto Engineering Inc. today announced that it has joined GLOBALSOLUTIONS, GF's ecosystem of partners that provides services from conception to production.

05/09/2018  TowerJazz, the global specialty foundry leader, and Newsight Imaging, today announced production of Newsight's advanced CMOS image sensor (CIS) chips and camera modules, customized for very high volume LiDAR and machine vision markets, combining sensors, digital algorithms and pixel array on the same chip.

05/08/2018  Embedded imaging applications in cars, security, machine vision, medical, virtual reality, and other new uses will offset slow growth in camera phones, says new report.

05/07/2018  Semtech Corporation, a supplier of high performance analog, mixed-signal semiconductors and advanced algorithms, today announced it has acquired substantially all the assets of IC Interconnect, Inc.

05/07/2018  The global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers -- the industry’s traditional drivers -- is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018.

05/02/2018  To meet growing market demand for high-density 2.5D and 3D stacked semiconductor solutions, Silicon Valley-based ALLVIA, Inc. has expanded its in-house capabilities to include the formation of through-quartz vias (TQV) ranging from 15 microns in diameter and 100 microns deep to 50 microns in diameter and 250 microns deep.

05/02/2018  TowerJazz today announced the release of its 300mm 65nm BCD (Bipolar-CMOS-DMOS) process, the most advanced power management platform for up to 16V operation and 24V maximum voltage.

05/01/2018  Mentor, a Siemens business, has announced that several tools in its Calibre nmPlatform and Analog FastSPICE (AFS) Platform have been certified by TSMC for the latest versions of TSMC's 5nm FinFET and 7nm FinFET Plus processes.

05/01/2018  Cadence Design Systems, Inc. today announced its continued collaboration with TSMC to further 5nm and 7nm+ FinFET design innovation for mobile and high-performance computing (HPC) platforms.

04/30/2018  Synopsys, Inc. today announced certification of the Synopsys Design Platform with TSMC's latest Design Rule Manual (DRM) for advanced 7nm FinFET Plus process technology.

04/26/2018  The latest LPDDR4X features high performance and energy efficiency while significantly raising the thermal endurance level for automotive applications that often need to operate in extreme environments.