01/23/2018  Micron Technology, Inc. today launched the Micron 5200 series of SATA solid state drives.

01/17/2018  2017 proved to be record-setting year for the semiconductor industry. According to World Semiconductor Trade Statistics (WSTS), worldwide semiconductor market will have grown 20 percent, exceeding $400 billion for the first time.

01/17/2018  Everspin Technologies, Inc., a developer and manufacturer of discrete and embedded MRAM, today announced the Company recorded revenue for its first 40nm 256Mb STT-MRAM products in the fourth quarter of 2017 and is in the process of ramping its volume production in 2018

01/12/2018  Amid market consolidation, the top four PC vendors accounted for 64% of shipments in 2017.

01/10/2018  These were key highlights from a SEMI Member Forum in December that brought together industry representatives and students in Dresden to weigh in on job-skills challenges facing the electronics manufacturers and solutions for the industry to consider.

12/22/2017  The SEMI European 3D Summit will make its Dresden, Germany, debut 22-24 January, 2018, featuring a broader scope of 3D topics driving innovation and business opportunities in the 3D market.

12/19/2017  EPC2049 GaN power transistor offers power systems designers a 40 V, 5 m? power transistor about 8 times smaller than equivalently rated silicon MOSFETs for point of load converters, LiDAR, and low inductance motor drive.

12/15/2017  One of the world's largest independent MEMS foundries ready to manufacture MEMS and image sensor products utilizing Invensas wafer bonding and 3D interconnect technology.

12/14/2017  Fabricated using a charge compensation principle and IXYS' own process technology, these new MOSFETs exhibit the lowest on-state resistances in the industry.

12/12/2017  aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.

12/08/2017  Leti, a research institute of CEA Tech, demonstrated significant improvements in the field of memory systems at IEDM 2017 this week.

12/07/2017  3D acoustic imaging is useful for measuring the heights of bumps on BGAs, flip chips, and other devices. But it can also be used to image and quantify depth/height variation of features within a particular sample.

12/05/2017  The hows and whys of resin bleed-out (RBO) are discussed, as well as the impact it makes and how to control it.

12/05/2017  A new illumination technology compares favorably to conventional bright field illumination.

12/01/2017  The ConFab 2018, to be held at The Cosmopolitan of Las Vegas on May 21-23, is thrilled to announce the newest opening day Keynote speaker, Professor John M. Martinis.

11/30/2017  Soitec, a designer and manufacturer of semiconductor materials for the electronics industry, today announced the latest generation of silicon-on-insulator (SOI) substrates in its Imager-SOI product line designed specifically for fabricating front-side imagers for near-infrared (NIR) applications including advanced 3D image sensors.

11/17/2017  Crosstalk and noise can become a major source of reliability problems of CNT based VLSI interconnects in the near future.

11/09/2017  IC Market Drivers 2018 report ranks major end-use applications and their impact on IC market growth.

11/08/2017  Earlier this year, DARPA's Microsystems Technology Office (MTO) announced a new Electronics Resurgence Initiative (ERI) "to open pathways for far-reaching improvements in electronics performance well beyond the limits of traditional scaling."

11/08/2017  Artificial intelligence (AI) may be a hot topic today, but SEMI has helped to incubate Big Data and AI since its founding.