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Graphene Flagship researches create thin film transistors printed with layered materials

04/07/2017  Graphene Flagship researchers from AMBER at Trinity College Dublin have fabricated printed transistors consisting entirely of layered materials.

Device boosts interaction between light and motion

04/07/2017  Novel design developed by Brazilian researchers couples light waves and mechanical waves at higher intensity levels.

Artificial topological matter opens new research directions

04/06/2017  An international team of researchers have created a new structure that allows the tuning of topological properties in such a way as to turn on or off these unique behaviors. The structure could open up possibilities for new explorations into the properties of topological states of matter.

D2S unveils fifth-generation GPU acceleration platform for semiconductor manufacturing

04/06/2017  D2S today announced the unveiling of the fifth generation of its computational design platform (CDP), which enables extremely fast and precise simulations for semiconductor design and manufacturing.

What is the impact of most dynamic advanced packaging platform on manufacturing markets?

04/06/2017  2016 was a turning point for fan-out packaging. With AppleÂ’s entrance and its subsequent decision to package its A10 APE in TSMCÂ’s fan-out solution, the market changed.

Cadence unveils expanded Virtuoso Advanced-Node Platform for 7nm processes

04/05/2017  Cadence Design Systems, Inc. today announced the release of the new Virtuoso Advanced-Node Platform supporting advanced 7nm designs.

A novel method for the fabrication of active-matrix 3-D pressure sensors

04/05/2017  A recent study, affiliated with UNIST has created a three-dimensional, tactile sensor that could detect wide pressure ranges from human body weight to a finger touch. This new sensor with transparent features is capable of generating an electrical signal based on the sensed touch actions, also, consumes far less electricity than conventional pressure sensors.

Carbon nanotubes self-assemble into tiny transistors

04/05/2017  University of Groningen scientists, together with colleagues from the University of Wuppertal and IBM Zurich, have developed a method to select semiconducting nanotubes from a solution and make them self-assemble on a circuit of gold electrodes.

Ultratech receives multiple commitments for laser melt anneal system evaluation

04/05/2017  Ultratech, Inc. today announced that it has received multiple commitments for its LM7 laser melt anneal system.

Advanced packaging industry: What we could expect in 2017

04/04/2017  2016 was the year of strong consolidations in the semiconductor industry. Yole Developpement (Yole) highlights many mergers and acquisitions with several billions of dollars transactions.

Spray-on memory could enable bendable digital storage

04/04/2017  Nanowire ink enables flexible, programmable electronics on materials like paper, plastic or fabric.

To e-, or not to e-, the question for the exotic 'Si-III' phase of silicon

04/04/2017  Discovery of semiconducting properties of Si-III might lead to unpredictable technological advancement.

Telit celebrates its 100th connected 300mm semiconductor fab

04/03/2017  Telit, a global enabler of the Internet of Things (IoT), today announced that it is celebrating the 100th installation of its secureWISE software platform in a 300mm semiconductor fabrication plant.

Tiny black holes enable a new type of photodetector for high speed data

04/03/2017  Tiny "black holes" on a silicon wafer make for a new type of photodetector that could move more data at lower cost around the world or across a datacenter.

SEMI reports 2016 global semiconductor materials sales of $44.3B

04/03/2017  SEMI today announced that the global semiconductor materials market increased 2.4 percent in 2016 compared to 2015 while worldwide semiconductor revenues increased 1.1 percent.

Picosun and Hitachi MECRALD process

04/03/2017  ALD fab films at lower temperatures.

New approaches to scaling needed

04/03/2017  Applied Materials hosted a panel session in December in San Francisco during the International Electron Devices Meeting, titled: “Rethinking Scaling: New Paragdigms, New Approaches.”

Advanced Process Control in Microelectronics Manufacturing: Leveraging Smart Manufacturing and Big Data

04/01/2017  Friday, April 7, 2017 at 1pm ET / Sponsored by Epicor

One of the primary concerns of todayÂ’s fab managers is cost reduction. This webcast will examine how top fabs are tackling that challenge by embracing smart manufacturing, otherwise known as Industry 4.0 or IIoT. Greater connectivity and information sharing -- enabled by new capabilities in data analytics, remote monitoring and mobility -- will lead to increased efficiency and reduced costs.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.