12/09/2004 (December 9, 2004) Manhasset, N.Y. — Texas Instruments (TI) says that it expects sales for the fourth quarter, ending in December, to top out at $3.02 to $3.14 billion, compared with a previous guidance of $2.96 to $3.20 billion. The company states that the market continues to undergo inventory adjustments, especially in standard products sold through distribution.
12/09/2004 (December 9, 2004) Grenoble, France — The Spirit Consortium has announced the release of a specification aimed at giving system-on-chip (SoC) designers access to an industry standard for intellectual property re-use that will enable them to select, configure, and integrate standard-compatible IP from multiple vendors, using a range of different standard-compatible EDA tools and design environments.
12/08/2004 December 8, 2004 - Demand for Japanese semiconductor manufacturing equipment continues to slide as the market sinks further into a lull entering the end of the calendar year, according to data from the Semiconductor Equipment Association of Japan (SEAJ).
12/08/2004 (December 8, 2004) Minneapolis, Minn. — Speakers at the first International Wafer-Level Packaging Congress (IWLPC), held October 10-12, 2004, in San Jose, Calif., addressed leading-edge IC packaging and test technologies with special emphasis on 3-D stacked packaging. As rated by the attendees, the Best Paper Award was presented to Dr. Udo E. Frank of FEINFOCUS GmbH.
12/08/2004 (December 8, 2004) Irvine, Calif. — Demonstrating its ongoing commitment to innovation in power semiconductors, Toshiba America Electronic Components Inc. (TAEC) announces TSSOP Advance, a new, smaller packaging technology that extends the company's diverse packaging options for power MOSFETs.
12/07/2004 (December 7, 2004) Endicott, N.Y. — In early November 2004, Endicott Interconnect (EI) received their second U.S. Patent (6,815,837), named "Electronic Package with Strengthened Conductive Pad" — an approach to strengthening the design of printed circuits to improve their reliability when assembled with components.
12/07/2004 December 7, 2004 - EV Group today announced the launch of a global consortium, NILCom, dedicated to commercializing advanced nanoimprint lithography (NIL) technologies. The consortium will have a technology platform supported by an established infrastructure and qualified processes, including leading technology companies and research centers.
12/06/2004 (December 6, 2004) Austin, Texas — TechSearch International's new study, Flip Chip and Wafer Level Packaging Trends and Market Forecasts, projects a compound growth rate of over 28% in this market between 2004 and 2009. The report profiles drivers for the demand and requirements by market, investigates the state of the technology, and details the supply base.
12/06/2004 (December 6, 2004) Schaumburg, Ill. — Motorola has completed the separation of Freescale Semiconductor. As previously announced, Motorola distributed to its shareholders .110415 of a share of Freescale Semiconductor Class B common stock for each outstanding share of Motorola common stock they owned, as of the record date of November 26, 2004.
12/06/2004 In 2003, the Chinese government selected Cary, N.C.-based Coventor and its suite of design tools as the software provider for its MEMS program, an initiative to build the nation's microsystems capabilities through universities and companies. The deal is among several recent agreements between the Chinese government and U.S.-based businesses.
12/03/2004 (December 3, 2004) Hong Kong and Pleasanton, Calif. — ASAT Holdings Limited has announced financial results for the second quarter of fiscal year 2005, which ended October 31, 2004.
12/03/2004 AES Clean Technology, Inc. announces that it has been awarded a major new design/build project to provide manufacturing cleanrooms for ADS/Transicoil's new facility in Collegeville, PA.
12/03/2004 Building on established relationships in the Asian electronic manufacturing arena, BOC Edwards announced it is expanding its leadership position in Taiwan by investing in seven gas plant facilities to ensure bulk gas supply to nine new semiconductor and flat panel display manufacturing fabs currently under construction.
12/03/2004 (December 3, 2004) Willow Grove, Pa. — Kulicke & Soffa Industries announces that its ball bonder product line has extended its leadership position in the first half of calendar year 2004, according to data published by VLSI Research.
12/03/2004 December 3, 2004 - EV Group (EVG) has said that it has signed an agreement with Komag Inc. to develop, license, and sell a high-volume nanoimprint lithography (NIL) application for mass data storage.
12/03/2004 Ten years ago, Ottilia Saxl launched the Center in Scotland for Nanotechnology. The Stirling-based center evolved in 1997 into the Institute of Nanotechnology, and with Saxl as its chief executive has served as a catalyst for nanotech research and commercialization in Europe and beyond.
12/02/2004 (December 2, 2004) Phoenix, Ariz. — FlipChip International announces that it has appointed Jay Grover as its VP of operations for its semiconductor wafer-scale packaging and bumping business in Phoenix, Ariz. Grover will report to Bob Forcier, president and CEO.
12/02/2004 (December 2, 2004) San Jose, Calif. — Noting that the laws of physics will eventually limit the implementation of CMOS scaling technology, the Semiconductor Industry Association (SIA) announces an ambitious research program aimed at assuring U.S. leadership in information technology well into the future.
