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New FDA guidance on aseptic processing addressed at Aseptic Filling Conference in November

10/08/2004  October 7--IIR conferences announced that Robert Darius, FDA-CBER, will be making the Keynote Presentation: FDA Insight into Correcting Aseptic Filling Compliance Deficiencies, at IIR's Aseptic Filling Conference, Nov 3-5 2004, at the Doubletree Hotel in Philadelphia PA.

SEMI group says wafer shipments forecast to grow 23% in 2004

10/08/2004  October 8, 2004 - The leading suppliers of silicon wafers forecast year-end wafer shipments for 2004 to be 23% higher than 2003 shipments. According to the SEMI Silicon Manufacturers Group (SMG) Consensus Forecast, total wafer shipments will increase by about 5% in 2005.

Nano industry must find more ways to explain unseen world

10/08/2004  Those involved with nanotech need to remove boulders from the publicÂ’s path to help them understand the basics. We need to answer questions, respond to fears, and help point the way to the brighter future offered by nanotechnology.

IMEC, KLA-Tencor set sights on sub-65nm metrology

10/07/2004  October 7, 2004 - KLA-Tencor Corp., San Jose, CA, and Belgium-based research center IMEC have begun a joint development project to accelerate adoption of optical critical-dimension (CD) metrology technology for sub-65nm semiconductor applications.

Former Hynix chip group relaunched

10/07/2004  October 6, 2004 - MagnaChip Semiconductor, the former nonmemory semiconductor operations of Hynix purchased earlier this summer by investors, officially has been relaunched in South Korea.

Nano-TexÂ’s Tice finds new answers to existing market problems

10/07/2004  Nano-Tex has managed to grow sales by more than 50 percent annually by providing value to its customers, Tice said. "We try to make it really easy for people to buy our product," he said. "We work in a value-added relationship with our partners."

Indium Corporation Opens China Facility

10/06/2004  (October 6, 2004) Clinton, N.Y.—Indium Corporation of America announced the opening of their newest facility. Located in the Suzhou Industrial Park in Jiangsu, China, the facility houses solder-paste manufacturing and quality operations as well as fully integrated sales and technical support teams. This new facility offers prompt responses to customer needs to ensure world-class service throughout China.

Matsushita to join International SEMATECH manufacturing initiative

10/06/2004  October 6, 2004 - The Semiconductor Company of Matsushita Electric Industrial Co., Ltd. has joined the International SEMATECH Manufacturing Initiative (ISMI) effective Oct. 1, becoming the newest member of a global alliance of semiconductor companies focused exclusively on manufacturing effectiveness, officials of SEMATECH announced today.

NanoCommerce commences with economic workshop

10/06/2004  Oct. 6, 2004 – Pre-conference activities at NanoCommerce 2004 kicked off Monday with an economic workshop designed to help attendees develop regional clusters of nanotech activity. Titled "Creating a Nano Economy in Your State or Region," the panel featured speakers from a number of U.S. state development initiatives, universities and government programs, as well as international perspectives from representatives of the United Kingdom and Australia.

SEMI publishes six new technical standards

10/05/2004  (October 5, 2004) San Jose, Calif.—SEMI has published six new technical standards applicable to the semiconductor, flat panel display, and MEMS manufacturing industries. The new standards, developed by technical experts from equipment suppliers, device manufacturers, and other companies participating in the SEMI International Standards Program, are available for purchase in CD-ROM format, or can be downloaded from the SEMI website at www.semi.org.

STATS ChipPAC reaches milestone in wafer-level chip scale package (WLCSP) production

10/05/2004  (October 5, 2004) Singapore and Fremont, Calif.—STATS ChipPAC announces reaching a milestone in its scale-up of full turnkey wafer-level chip scale package (WLCSP) wafer bumping, probe, and back-end processing services, with production run rates exceeding 4 million packaged units per month.

MEMC and Solid State Technology to host Silicon Workshop in Boston area

10/05/2004  October 5, 2004 - MEMC Electronic Materials Inc. has announced it will again co-sponsor the Understanding Silicon Materials Technical Workshop with Solid State Technology magazine on Oct. 19 in Boston, MA, which will detail the latest developments and advances in silicon wafers to all levels of semiconductor fab engineers and management.

Asahi Kasei sets up South Korean subsidiary to sell pellicles

10/05/2004  October 5, 2004 - Asahi Kasei Corp. said it has set up a wholly owned subsidiary in South Korea to boost sales of pellicles. The new subsidiary will start operating on Nov. 1, aiming to post 2 billion yen in sales in fiscal 2005 ending in March 2006, reported Kyodo News International.

ZettaCore appoints Subodh Toprani as new CEO

10/05/2004  This past July, the chief executive of ZettaCore met with a colleague to give away his job. ItÂ’s not that he was unhappy with his job. In fact, heÂ’ll be staying on. Today this transition was made official: Subodh Toprani has replaced ZettaCoreÂ’s Randy Levine as CEO, effective Sept. 15.

MEMS, aka 'Big Nano,' seeks to elevate its political profile

10/05/2004  Although nobody predicts a MEMS sequel to the nanotech bill signed into law last year, some say it is the right time for micro to raise its profile in Washington. Nanotech's bigger, older cousin has real revenues coming from major players. The industry also has a history of support from DARPA.

Weak demand in China, Taiwan hurts Japan tool orders

10/04/2004  October 4, 2004 - Worldwide orders for Japanese semiconductor manufacturing equipment in August fell 22.6% to 118.50 billion yen ($1.08 billion), the lowest level in six months, due to declines in demand from Taiwan and China.